• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.5
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• pp.358-363
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• 2010

The polishing pad is important element for polishing characteristic such as material removal rate(MRR) and within wafer non-uniformity(WIWNU) in the chemical mechanical planarization(CMP). The result of the viscoelasticity measurement shows that 1st elastic modulus is increased and 2nd elastic modulus is decreased when the top pad is thickened. The finite element analysis(FEA) was conducted to predict characteristic of polishing behavior according to the pad thickness. The result of polishing experiment was similar with the FEA, and it shows that the 1st elastic modulus affects instantaneous deformation of pad related to MRR. And the 2nd elastic modulus has an effect on WIWNU due to the viscoelasticity deformation of pad.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.5
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• pp.761-766
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• 2012

Abrasive fluid jet polishing processes have been used for the polishing of optical surfaces with complex shapes. However, unstable and unpredictable polishing spots can be generated due to the fundamental property of an abrasive fluid jet that it begins to lose its coherence as the jet exits a nozzle. To solve such problems, MR fluid jet polishing has been suggested using a mixture of abrasives and MR fluid whose flow properties can be readily changed according to imposed magnetic field intensity. The MR fluid jet can be stabilized by imposed magnetic fields, thus it can remain collimated and coherent before it impinges upon the workpiece surface. In this study, MR fluid jet polishing characteristics of fused silica glass were investigated according to injection time and magnetic field intensity variations. Material removal rates and 3D profiles of the generated polishing spots were investigated. From the results, it can be confirmed that the developed MR fluid polishing system can be applied for stable and predictable precise polishing of optical parts.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.497-498
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• 2006

Tribological properties of a Magneto-Rheological(MR) fluid in a polishing process are studied. For this polishing process, abrasive wear model is proposed as a function of shear force, normal force and actual mean velocity of MR particles at workpiece surface. Experimental conditions are changed by varying the gap distance between workpiece and tool and the rotational speed of tool. From the experimental results, a modified Stribeck curve is obtained, and the friction coefficient turns out to have linear relationship with a modified Sommerfeld number. The validity of the wear model is supported by additional experiments performed for measuring material removal rates.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.305-305
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• 2011

표면 플라즈몬 공진(SPR) 현상을 이용한 광섬유 센서는 SPR 센서의 우수한 표면 민감도, 비표지 검출능 등의 특징은 유지하면서 측정시스템이 단순해지고 저렴하게 제작이 가능하며 원거리 검출에 유리하다는 장점으로 많은 연구가 진행되고 있다. 최근 스택 제어가 용이하고 민감도 또한 우수하다는 이유로 측면 연마형 센서 구조를 적용한 연구가 많이 이루어지고 있다. 본 연구에서는 기존 Kretchman형태의 SPR 센서의 분해능 향상을 위해 사용된 광도파로 구조를 측면 연마형 광파이버에 적용시켰다. 금속 층 / 유전체 층 / 금속 층으로 구성되어 있는 광도파로 구조와 Au 단일 층을 사용한 기존 구조에 대한 이론 전사모사를 진행하고 실물 소자를 제작하여 특성을 평가하였다. WCSPR 센서에서는 두 개의 반사율 dips이 나타난다. 하나는 단파장영역에서 나타나는 폭이 작은 형태이며 또 다른 하나는 장파장영역에서 나타나는 폭이 넓은 형태이다. 단파장에서의 dip은 입사각에 크게 영향을 받지 않기 때문에 Wavelength interrogation mode을 이용하는 광섬유 SPR센서에 적용할 경우 분해능이 향상될 것 이다. WCSPR 센서는 도파로의 유전체층에서 진행되는 모드를 이용하면 Self-referencing을 할 수 있다, 또한 유전체 층의 두께를 변화 시켜 중심파장의 위치를 조절할 수 있는 특징을 갖고 있다. 결과적으로 광도파로 구조를 광파이버에 적용시켜 기존 Au 단일 층 구조의 SPR 센서에 비해 좀 더 정확하고 광범위한 감지를 할 수 있다.

• The Bulletin of The Korean Astronomical Society
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• v.38 no.2
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• pp.83.1-83.1
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• 2013

선형비점수차를 완벽하게 제거한 비축반사경 이론을 천체 관측용 분광기의 전단 광학계 등에 응용하면 색수차가 없는 기기 제작이 가능하다. 이러한 비축 반사경은 DTM(Diamond Turning Machine)을 이용하여 알루미늄으로 만들면 제작 시간이 단축된다. 그러나 DTM을 이용해 알루미늄과 같이 무른 금속을 가공할 경우 툴마크가 발생하게 된다. 툴마크는 회절현상을 발생시키며 이러한 회절현상은 알루미늄 반사경을 이용한 광학계 개발에 제약이 된다. 툴마크는 DTM 가공 이후 연마를 통해 제거할 수 있지만 알루미늄의 무른 특성으로 인해 연마 과정에서 반사경의 형상이 변할 가능성이 크다. 이러한 알루미늄 반사경의 형상 변화를 최소화하기 위한 방법으로는 알루미늄 반사경 표면에 무전해니켈도금을 하는 것이다. 하지만 도금 과정에서 반사경의 형상이 변할 가능성이 있기 때문에 두가지 방법을 사용하여 툴마크를 제거할 계획이다. 첫 번째 방법은 DTM 가공된 알루미늄 반사경을 5 um의 무전해니켈도금 이후 연마하여 툴마크를 제거하고 반사율 증가를 위해 그 위에 다시 알루미늄 코팅을 하는 방법니다. 두 번째 방법은 100 um의 무전해니켈도금 이후 DTM 가공을 하고 다시 연마를 통해 툴마크를 제거하는 방법이다. 이번 발표에서는 툴마크를 제거하기 위한 2가지 방법의 장단점을 확인하고 툴마크를 제거한 알루미늄 반사경을 제작하기 위한 과정을 설명하였다. 본 연구에서 개발한 비축 반사경은 서울대학교 창의연구단의 광학/적외선 카메라 CQUEAN의 차세대 모델에 적용할 계획이다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.482-483
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• 2009

In chemical mechanical planarization (CMP) process, the uniformity of stress acting on wafer surface is a key factor for uniform material removal of thin film especially in the oxide CMP. In this paper, we analyze the stress on the contact region between wafer and pad with finite-element analysis (FEA). The setting pressure acting on wafer back side was $500g/cm^2$ and the retainer pressure was changed from 300 to $700g/cm^2$. The polishing test is also done with the same conditions. The material removal rate profiles well-matched with stress distribution.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.206-209
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• 2002

The fixed abrasive pad(FAP) has been introduced in chemical mechanical polishing(CMP) field recently. In comparison with the general CMP which uses the slurry including abrasives, FAP takes advantage of planarity. resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of $Al_2$O$_3$-FAP using hydrophilic polymers with swelling characteristic in water and explains the self.texturing phenomenon. It also focuses on the chemical effects on tungsten film and the FAP is evaluated on the removal rate as a function of chemicals such as oxidizer, catalyst, and acid. The removal rate is achieved up to 1000A1min as about 70 percents of the general one. In the future. the research has a plan of the advanced FAP and chemicals in tungsten CMP considering micro-scratch, life-time, and within wafer non-uniformity.

• Proceedings of KOSOMES biannual meeting
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• 2017.04a
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• pp.168-168
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• 2017

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.5
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• pp.484-488
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• 2010

Infrared emissivity is one of the most important factors for the temperature measurement by infrared thermography. Although the infrared emissivity of an object can be measured from the ratio of blackbody and the object, at room temperature it is practically difficult to measure the value due to the background effects. Hence, quantitative reflectance of bare steel plate and the surface of coating was measured by FT-IR spectroscopy and emissivity was calculated from this. The emissivity of polished bare steel surface was from 0.06 to 0.10 and the value for the unpolished bare steel can not be achieved because optical characteristics changes of surface roughness induces erroneous results. Emissivity of transparent paint coated steel was from 0.50 to 0.84. Depends on the IR absorption regions, which is a characteristic value of the coating, emissivity changes. This study suggests surface condition of material, thickness, roughness et cetra are important factor for IR optical characteristics. Emissivity measurement by reflection method is useful technique to be applied for metal and it with coating applied on the surface. The range of experimental errors of temperature can be narrowed by the application of infrared thermography from the measured thermal emissivity.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.47-51
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• 2006

Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A conditioning disk is used during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In this study, we characterized diamond disk with 9 kinds of sample.