• Proceedings of the Optical Society of Korea Conference
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• 1989.02a
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• pp.36-38
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• 1989

We have developed Magnetic Pulse Compression System to realize repetitive excimer laser excitation. The principle of this system is to use the large change in permiability owing to the nolinear characteristics of ferro-magnetic material (Metglas2605s-2 metal ribon). Prior to the laser operation, the MPC system was tested with a dummy load (5$\Omega$) and laser head. Laser head has a discharge volume of 1.0 (w) x 2.0 (h) x 20.0(1) cm. This MPC system compressed a 6.2us (FWHM), 80 A pulse into a 0.4us(FWHM), 1.3kA pulse.

• Korean Journal of Optics and Photonics
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• v.4 no.2
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• pp.157-161
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• 1993

An optical autofocus system for a DUV KrF excimer laser wafer stepper was developed by using the PSD (Position Sensitive Detector) as the position sensor. The laser beam was incident on the surface of wafer and the reflected beam was magnified optically by a lens. And the beam was directed onto the surface of PSD by a mirror system. The spatial resolution of the autofocus system was found to be $0.03{\mu}m$.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.9 s.174
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• pp.60-68
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• 2005

To investigate the effects of beam focusing in the etching of polymers with short pulse Excimer lasers, a polymer etching model of SSB's is combined with a beam focusing model. Through the numerical simulation, it was found that in the high laser fluence region, SSB model considering both photochemical and thermal contribution is considered to be suitable to predict the etched hole shape than a simple photochemical etching model. The average temperature distribution into the substance obtained by assuming 1-D heat transfer is found to be fairly similar to the fluence distribution on the ablated surface. The experimental etching data fur polymers are used to give material properties for ablation model. The fitted etch depth curve gives a nice agreement with the experimental data.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.748-751
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• 2000

Microlens made by laser radiation method have advantages in the easiness of their fabrication. The process is based on the projection of a chromium-on-quartz reticle on to the Polymer using a pulsed 248nm KrF excimer laser. Fabrication process is a fluence-dependent rate and density. The lens shape is defined by a rotationally symmetric sluence distribution with smooth radial variation in the image plane of the reticle. A typical lens of 50㎛ diameter was fabricated by irradiating 2000 laser pulses within 40 seconds. The experimental results show microlens fabrication by UV laser is possible and well worth studying further.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.743-746
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• 2000

The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

• Korean Journal of Optics and Photonics
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• v.1 no.1
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• pp.33-39
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• 1990

By developing a computer simulation code for discharge excited KrF excimer laser, we analyzed mainly the effects of buffer gas for the $KrF^*$ formation. the $KrF^*$ relaxation. and the absorption of the laser radiation. The $KrF^*$ formation efficiency were found to be 7.5%, 19% and the $KrF^*$ relaxation kinetic reactions were found to be 45%, 30% at the charging voltage of 30 KV and He. Ne buffer gas. respectively. But the absorption of the 248 nm laser radiation were less than 10% by the buffer gas.er gas.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.5
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• pp.318-323
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• 2000

The planarization of rough polycrystalline diamond films synthesized by DC arc discharge plasma jet CVD (chemical vapor deposition) was attempted using KrF excimer laser pulses. The effects of laser incidence angle and reaction gases (ozone and oxygen) on etching rate of diamond were studied. The temperature change of diamond and graphite with different laser fluences was calculated by computer simulation to explain the etching behavior of diamond films. The threshold energy density from the experiment for etching of pure crystalline diamond was about $1.7J/cm^2$ and fairly matched the simulation value. Preferential etching of a particular crystallographic plane was observed through scanning electron microscopy. The etching rate of diamond with ozone was lower than that with oxygen. When the angle of incidence was $80^{\circ}$ to the diamond surface normal, the peak-to-valley surface roughness was Significantly reduced from $20{\mu}m$ to $0.5{\mu}m$.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.8
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• pp.134-139
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• 2000

In order to understand the removal mechanism and seek the optimal conditions. KrF excimer laser ablation of Cr films on glass substrates is investigated. The surface morphology of the laser-irradiated spot is examined by SEM. The measured single-shot ablation rate is found to be about two times the result of numerical analysis based on a surface vaporization model and heat conduction theory. Surface morphology examination indicates that the Cr film is removed by the sequence of melting-surface vaporization-,melt expulsion by plasma recoil and that the outmost ripple of the diffraction pattern gives a strong effect on the morphology of molten Cr during the melting and vaporization processes. To seek the optimal process parameters for micro patterning morphological investigation is carried out experimentally on samples having different chromium film thicknesses. Optimal processing conditions are determined to enhance the accuracy and quality of thin film removal for micro patterning.