• Composites Research
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• v.24 no.3
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• pp.39-45
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• 2011

Adhesive joints are widely used for structural joining applications in various fields and environmental conditions. Polyurethane (PU) and Epoxy adhesives are now being used for liquefied natural gas (LNG) carriers at cryogenic temperatures. This paper presents a comprehensive evaluation of epoxy and PU adhesive bonds between Triplex sheets at normal and cryogenic temperatures. The most significant result of this study is that for all adhesives tested, there is a significant decrease in peel strength at cryogenic temperatures. However, the reasons for the decrease in peel strength for epoxy and PU adhesives differ. Consequently, PU adhesives can be considered better suited for use in applications requiring high bonding performance at cryogenic conditions, such as in LNG carriers.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.56.2-56.2
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• 2011

최근 철강, 알루미늄, 이종재료의 접합 등 용접이 어려운 부분에 구조용 접착제의 적용이 증가하고 있는 추세이다. 이를 위해 변성 에폭시레진을 활용한 고접합 강도, 고인성의 구조용 접착제가 연구되어 지고 있다. 피착제의 표면처리는 접합부의 접합강도를 향상시키는 방법으로 알려져 있으나 최근의 구조용 접착제는 표면 전처리 없이도 우수한 접착 특성을 보이는 것으로 기대되고 있다. 본 연구에서는 변성레진에 대해서 각종 표면처리가 접합부 특성에 미치는 영향을 조사하였다. 피착제로는 자동차용 냉연강판인 SPRC440을 사용하였고, 전처리로는 무처리 상태, SiC연마지를 이용한 연마, 아르곤 및 산소가스를 이용한 마이크로웨이브 플라즈마 표면처리, 산세 등의 표면처리를 실시하였다. 에폭시 접착제는 변성 에폭시 레진과 경화제 및 촉매제를 이용하여 직접 포뮬레이션하였다. 단일 겹치기 전단강도 시험과 T-Peel 시험은 각각 ASTM D 1002 규격에 따라 준비하였으며 인장 시험 후 파면은 SEM으로 관찰하였다.

• Proceedings of the KAIS Fall Conference
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• 2000.10a
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• pp.237-240
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• 2000

본 연구에서는 비스페놀 A, 에피크로로히트린을 반응시킨 에폭시 기본주제를 중심으로 경화제, 희석제, 충진제, 촉매 등을 배합하여 토목, 건축용 반고체형 에폭시 접착제를 개발하였다. 여기서 특히 에폭시 주제와 희석제의 종류 및 배합비율에 따른 기본 물성, 접착성능 등을 측정하였다. 상온 경화 특성을 측정하기 위하여 경화시 간을 측정한 결과 희석제의 종류와 관계없이 희석제의 양이 증가할수록 경화시간이 증가하고 경화온도도 증가하는 경향을 알 수 있었으며 촉매의 양이 적을 경우가 경화시간이 빠른 것을 알 수 있었다. 또한 경화 시간은 30분 내지 40분 정도로 상온에서 사용할 수 있을 것으로 기대한다. 접착력 시험 결과는 촉매의 양이 적당한 때 가장 좋은 접착력을 나타내고 희석제 중에서 HDGE의 경우가 가장 좋은 접착력을 나타내었고 희식제의 양이 증가할수록 접착력은 증가하였다. 실리카와 철분을 섞어 반고체형 에폭시 접착제를 제조한 경우 기존의 제품보다 우수한 접착력을 나타내었다. 따라서 본 연구에서 개발한 반고체형 접착제는 제조공정 코스트 등에 대한 검토와 함께 제품화하여 토목, 건축 분야의 콘크리트 균열 접착, 볼트와 콘크리트의 접합, 목재의 접합 등에 간편하게 사용될 수 있으며, 배합물질과 비율에 따라 전기전자. 토목건축, 자동차산업 등의 산업용 접착제로서 응용될 수 있을 것으로 기대된다.

• Journal of Adhesion and Interface
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• v.21 no.2
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• pp.65-70
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• 2020

Epoxy adhesive was mainly used to combine different composite materials. Epoxy adhesive was a typical thermosetting resin that can be bonded by changing from a linear structure to a three-dimensional network structure by curing reaction of epoxy and hardener. The curing conditions of epoxy adhesive were different with different types of hardener such as mixing ratio, curing time, and temperature. These curing conditions affected to the adhesive property of epoxy adhesive. In industry, it was difficult to proceed the applying epoxy adhesive and combining two parts immediately. The adhesive property decreased by humidity and pre-curing of epoxy adhesive in waiting time between two processes. In this paper, the glass fiber reinforced composite (GFRC) was combined with epoxy adhesive and adhesion property between epoxy adhesive and GFRCs was evaluated using single lap shear test. The different waiting times and humidity conditions were applied to epoxy adhesive in room temperature and adhesive property decreased as the waiting time increased. In small amount of humidity, the adhesive property increased because a small amount of moisture in the surroundings accelerated the curing reaction. In certain amount of humidity, however, the adhesion property decreased.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.33-37
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• 2011

In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

• Applied Chemistry for Engineering
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• v.25 no.5
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• pp.520-525
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• 2014

In this paper, the effect of silane-treated silicas and epoxidized soybean oil (ESBO) addition on adhesion properties of silicas-filled epoxy adhesives was examined. The silicas were treated by ${\gamma}$-methacryloxy propyltrimethoxy silane (MPS), ${\gamma}$-glycidoxy propyl trimethoxy silane (GPS), and ${\gamma}$-mercapto propyl trimethoxy silane (MCPS). Surface and structural properties of the adhesives were determined by using scanning electron microscope (SEM) and Fourier transform infrared spectroscopy (FT-IR). The t-peel strength of the adhesives was estimated using the universal testing machine (UTM). And, the equilibrium spreading pressure, surface free energy, and specific surface area were investigated by BET methods with $N_2$/77 K adsorption. As a result, the peel strength of the adhesives was increased in the presence of silane-treated silicas in the adhesives compared to that of untreated silicas. This result indicated that the silane coupling agent played an important role in improving the dispersion of silicas in epoxy adhesives. And, the adhesives treated by MCPS were superior to the others in adhesion.

• Composites Research
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• v.26 no.2
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• pp.129-134
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• 2013

The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

• Journal of Conservation Science
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• v.26 no.1
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• pp.85-94
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• 2010

Color stable hydrogenated bisphenol-A (HBA) epoxy adhesives containing organic-inorganic hybrid nanocomposites were prepared and investigated the properties. Isophorone-diamine (IPDA) was used as a hardener and polyhedral organomeric silsesquioxanes (POSS; EP0408 and EP0409) having epoxy function groups were used to tailor adhesives in the nanoscale range. The dependence of the concentration of different nano materials were studied since the large surface area of the nanosized particles can cause significant changes in properties of adhesives. HBA-IPDA adhesives containing different amount of nanomaterials have been applied to the fresh Namsan granite and compared with those of commercial adhesives, which have problems of color change as well as a high viscosity. The mechanical properties of HBA-IPDA containing POSSs are consistent with those of commercial adhesives in addition to the low viscosity.

• Composites Research
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• v.29 no.2
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• pp.79-84
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• 2016

An adhesive can be used to connect two different materials in structures. In comparing with other connecting methods, such as bolt, rivet, and hot melting, the adhesive does not need to use them. It leads to reduce the weight and decrease the stress concentration along the connecting line. This work studied the comparison of mechanical and interfacial properties of commonly-used two adhesives, acrylic type and bisphenol-A epoxy type. Tensile and flexural strength of neat adhesives were also compared. Lap shear test of two adhesives was deduced from the measurement of tensile and fatigue tests. After testing, the failure patterns of adhesive surfaces were observed by a microscope. Tensile strength and mechanical fatigue resistance at using bisphenol-A epoxy adhesive were better than acrylic adhesive. Also adding CNT reinforcement in epoxy adhesive can anticipate mechanical improvement.

• The Korean Journal of Rheology
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• v.8 no.2
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• pp.129-138
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• 1996

접착강도는 접착제의 점탄성을 반영한 온도·속도 의존성을 나타낸다는 것이 잘 알 려져있다. 특히 유리전이온도(Tg)에서의 역학적 완화기구가 접착층의 변형을 수반하는 접착 층의 변형을 수반하는 접착강도에 크게 영향을 미치고 있다. 또한 접착계의 모드I의 변형에 너지 해방율(GIC)를 측정할때에도 접착제의 변형과 파괴가 발생하기 접착제의 점탄성이 그 값에 어떠한 영향을 미치는 지에 흥미가 깊다. 본 연구에서는 2종류의 에폭시 수지를 블랜 드한 접착제를 이용하여 일정한 측정조건에서 인장 접착강도와 GIC의 상관관계에 대하여서 도 토론하였다.