• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.327-327
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• 2012

사파이어는 우수한 광학적, 물리적, 화학적 특성을 가지고 있는 물질 중의 하나이며, 청색 발광특성을 나타내는 GaN와 격자상수, 열팽창 계수가 가장 유사할 뿐만 아니라 가격도 상대적으로 저렴하기 때문에 GaN 성장을 위한 기판으로 사용될 수 있다. 실제로 사파이어는 프로젝터와 전자파 장치, 군사용 장비 등 다양한 분야에 응용되고 있으며, 발광 다이오드(LED)를 위한 기판으로 활용됨으로써 그 수요가 급격히 증가하고 있다. 그러나 사파이어 결정의 성장 중에 생길 수 있는 전위(dislocation)와 적층결함(stacking fault) 등의 결정 결함들은 결정 내에 존재하여 역학적, 전기적 성질에 큰 영향을 미칠 수 있다. 특히 사파이어가 청색 발광소자의 기판으로 사용되는 경우, 사파이어 기판 내부의 결정 결함은 증착되는 박막 특성에 영향을 미치게 된다. 따라서 사파이어의 보다 나은 응용을 위해서는 결정 결함에 대한 평가기술과 결함의 형성 메커니즘 등에 대한 이해가 필요하다. 특히, 결함의 정량적 평가 기술의 개발은 사파이어의 상용화에 중요한 핵심요소 중 하나이다. 결정을 산이나 염기 등을 이용하여 화학적 식각을 하게 되면 분자나 원자 간의 결합이 약한 부분이나 높은 에너지 상태에 있는 부분부터 반응을 하게 되는데, 이러한 반응을 통해 결정의 표면에 형성되는 것을 에치 피트(etch pit)라고 한다. 일반적으로 결정 내에 존재하는 전위는 높은 에너지 상태이므로, 이러한 에치 피트는 전위와 관련되어 있다. 따라서 사파이어 결정과 같은 결정질 물질은 표면의 식각을 통하여 관찰되는 에치 피트 등의 형상이나 반응성 등을 평가하여 결정 특성을 연구할 수 있다. 본 연구는 화학적 식각법으로 사파이어 결정의 특성을 평가하기 위하여 진행하였다. 사파이어 결정의 식각을 위하여 다양한 산-염기 용액들이 사용되었다. 식각 용액의 종류에 따른 사파이어 결정의 식각거동을 연구하고, 표면에 나타나는 형상을 연구하여 사파이어 결정의 구조적 특성을 파악하였다. 특히, 에치 피트 형성거동의 시간 및 온도 의존성에 관한 연구를 진행하였다.

• Applied Chemistry for Engineering
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• v.24 no.5
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• pp.562-565
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• 2013

The high purity Al foil, which has an enlarged surface area by electrochemical etching process, has been used as an anode for an aluminum electrolytic capacitor. Etch pits are randomly distributed on the surface because of the existence of surface irregularities such as impurity and random nucleation of pits. Even though a large surface area was formed on the tunnel-etched Al, its applications to various fields were limited due to non-uniform tunnel morphologies. In this work, the selective electrochemical etching of aluminum was carried out by using a patterned mask fabricated by photolithographic method. The formation of etch pits with uniform distribution has been demonstrated by the optimization of experimental conditions such as current density and etching solution temperature.

• Korean Journal of Materials Research
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• v.10 no.5
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• pp.369-374
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• 2000

In order to investigate the effects of addition of 1M sulfuric acid to the etching solution or 1M hydrochloric acid on the etching behavior of aluminum foil for electrolytic capacitors, the changes in the density of etch pit, the length and diameter of etch tunnels and the capacitance were analyzed using SEM, TEM, LCR meter etc. Sulfate ion as a corrosion inhibitor was contributed to the increase of the surface area comparing with chloride ion. By adding sul-furic acid the density of etch pit and the length of etched tunnel increased and the diameter of the tunnel decreased, resulting in the increase of capacitance. It was also shown that the capacitance decreased when the current density was below $0.9A/\textrm{cm}^2$, while remarkably increased in the other case.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.61-67
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• 2004

The structural, electrical properties of the electrolytic capacitors were examined. By the addition of additives to hydrochloric acid solution increased the dielectric aluminum surface layer. For etch tunnels formed in hydrochloric acid, the away and density of the tunnels was not uniform, while for those formed in hydrochloric acid with additives the distribution presented relative uniformity. When the etched surface formed in hydrochloric acid with $5\%$ ethylene glycol, the enlargement of specific surface area was more effective.

• Electrical & Electronic Materials
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• v.8 no.3
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• pp.291-297
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• 1995

The InP crystals have been grown by modified synthesis solute diffusion (SSD) method and its properties have been investigated. The crystals have been grown by lowering the crucible quartz for growth in the furnace and crystal growth rate is 1.8mm/day. The lattice constant a. of the grown crystals is 5.867.angs.. Etch pits density along growth direction of crystal changes from 3.0*10.sup 3/cm$\^$-2/ of first freeze part to 6.7*10$\^$4/cm$\^$-2/ of last freeze part and the radial direction of wafer shows nearly uniform distribution. The resistivity and the carrier concentration of the grown crystals are 1.43*10$\^$-1/.ohm.-cm, 7.7*10$\^$15/cm$\^$-3/ at room temperature, respectively. In the photolurninescence at 10K, the radiation transitions are observed by the near band edge recombination, a pair recombination due to Si donor - Zn acceptor and its phonon replica in the InP. The activation energy by Zn diffusion in undoped n-InP crystals is 1.22eV.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.338-339
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• 2005

The wider surface of the aluminum foil, electrochemically very important and it is necessary to increase the surface area. A study has been made of the fabrication condition for etching cube texture of high purity aluminium foil and of electrochemical etching of the aluminium foil. In the present work, it is shown there exists a relation between the influence of the pre-treatment time in the NaOH & HCI solution and $H_2SO_4$ concentration in the conversion solution. Also effect of temperature during AC etching was also studied. Result of the etched aluminum film is shown in the typical SEM images. Its electrochemical characteristics were investigated by cyclic voltammetry. And effects of current density and frequency is also reported. Cyclic voltammogram showed that the protective oxide film was formedon the inner surfaces of etch pit. the frequency influence resistance of oxide film in AC etching.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.5
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• pp.41-45
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• 1984

The production of high-quality epitaxial layers almost always involves an etching step of silicon substrates with HCl gas prior to epitaxy, In this work, an investigation has been made on the etch rate and the etch-pit formation as a function of HCl gas concentration and etch temperature at atmospheric pressure (1 atm.) and reduced pressure (0.1 atom.). As a result, it is found that the etch rate is proportional to the square of the HCI gas concentration (XHC12) and the apparent ativation energy is between 0 and 111 Kcal/mole for both ammospheric and reduced pressure operation. From these results, it is expected that the HCI etching of silicon in reduced pressure operation proceeds, as in atmospheric operation, via the reaction ; Si + 2HCl ↔ SiCl2 + H2.

• Korean Journal of Materials Research
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• v.11 no.1
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• pp.48-54
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• 2001

The effects of additives in the HCI etching solution on etching behaviors of aluminum foil as dielectric film for electrolytic capacitors were investigated. The etch pits formed in 1M hydrochloric acid containing ethylene glycol as an additive contain more fine and homogeneous etch tunnels compared to those in 1 M hydrochloric acid only, which led to the increase in the effective internal surface area of aluminum foil. After anodizing of aluminum foil etched in etching solutions, the LCR meter results have shown that the capacitance of dielectric film etched in hydrochloric acid with ethylene glycol was increased remarkably compared to that etched in hydrochloric acid only.

• Applied Chemistry for Engineering
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• v.23 no.5
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• pp.501-504
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• 2012

In this study, etched Al electrodes with ordered arrays of pits and high aspect ratios were successively obtained using a patterned protect layer on the Al surface prepared with soft lithography method. Various methods were applied to fabricate a well ordered protect layer on the Al surface and the difference of etched Al surfaces with and without a protect layer was investigated by using SEM. It was found that the etched Al surfaces were affected by using either a protect layer or a non protect layer. As a result, the Al surface with the well ordered pits could be achieved by protect layer. However, the etched Al with nonuniform pits can be obtained without any protect layers.

• Electrical & Electronic Materials
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• v.5 no.3
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• pp.284-294
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• 1992

합성용질확산법으로 GaP단결정을 성장시키고 몇가지 성질을 조사하였다. 정지상태에서 결정의 성장속도는 1.75[mm/day]이었고 결정성장용 석영관을 전기로내에서 하강시키므로써 양질의 GaP 단결정을 성장하였다. 에치피트밀도는 결정의 성장축 방향으로 3.8*$10^{4}$[$cm^{-2}$]부터 2.3*$10^{5}$[$cm^{-2}$] 까지 증가하였다. 성장된 GaP결정의 이동도와 캐리어농도는 실온에서 197.49[$cm^{2}$/V.sec]와 6.75*$10^{15}$[$cm^{-3}$]이었고 77K의 온도에서는 266.91[$cm^{2}$ /V.sec]와 3.13*$10^{14}$[$cm^{-3}$]이었다. 에너지갭의 온도의존성은 실험적으로 $E_{g}$(T)=2.3383-(6.082*$10^{-4}$) $T^{2}$/(373.096+T)[eV]로 구하여졌다. 저온에서 측정된 광루미네센스 스펙트럼은 구속된 여기자의 복사재결합과 재결합 과정에 포논의 참여로 인하여 에너지갭 부근의 복잡한 선 스펙트럼이 나타났고 얕은 준위의 Si도너와 Zn억셉터준위 사이에서의 복사재결합 및 이에 대한 1LO, 2LO의 포논복제가 나타났으며 S $i_{Ga}$ -S $i_{p}$의 쌍방출에 의하여 1.8932[eV]에서 넓은 반치전폭의 피크가 나타났다. GaP의 적외선 흡수는 TO, LO, LA, T $A_{1}$, T $A_{2}$ 포논들의 이중결합모드와 G $a_{2}$O의 진동모드 및 Si도너와 Zn억셉터들에 의하여 일어났다. Zn를 확산시키어 제작한 p-n GaP발광다이오드는 실온에서의 발광중심피크가 6250[.angs.]이었고 최대광출력은 0.0916[mW], 양자효율은 0.51%이었다.이었다.