Controllable Patterning of an Al Surface by a PDMS Stamp |
Park, Gayun
(Department of Chemical Engineering, Inha University)
Kim, Kyungmin (Department of Chemical Engineering, Inha University) Lee, Hoyeon (Department of Chemical Engineering, Inha University) Park, Changhyun (Department of Chemical Engineering, Inha University) Kim, Youngmin (SAMYOUNG S&C CO.LTd) Tak, Yongsug (Department of Chemical Engineering, Inha University) Choi, Jinsub (Department of Chemical Engineering, Inha University) |
1 | R. S. Alwitt, H. Uchi, T. R. Beck, and R. C. Alkire, J. Electrochem. Soc., 131, 13 (1984). DOI ScienceOn |
2 | N. Osawa and K. Fukuoka, Corrosion Science, 42, 585 (2000). DOI ScienceOn |
3 | R.-G. Xiao, K.-P. Yan, J.-X. Yan, and J.-Z. Wang, Corrosion Science, 50, 1576 (2008). DOI ScienceOn |
4 | Z. H. Hou, J. H. Zeng, J. J. Chen, and S. J. Liao, Mater. Chem. Phys., 123, 625 (2010). DOI ScienceOn |
5 | Z. Ashitaka, G. E. Thompson, P. Skeldon, G. C. Wood, and K. Shimizu, J. Electrochem. Soc., 146, 1380 (1999). DOI ScienceOn |
6 | F. Larmat, J. R. Reynolds, and Y.J. Qiu, Synthetic Metals, 79, 229 (1996). DOI ScienceOn |
7 | T. Balaji, R. Govindaiah, M. K. Sharma, Y. Purushotham, A. Kumar, and T. L. Prakash, Materials Letters, 56, 560 (2002). DOI ScienceOn |
8 | P. Vasina, T. Zednicek, J. Sikula, and J. Pavelka, Microelectronics Reliability, 42, 849 (2002). DOI ScienceOn |
9 | H. Shin, J.-S. Park, S. Kim, H. S. Jung, and K. S. Hong, Microelectronic Engineering, 77, 270 (2005). DOI ScienceOn |
10 | H. Kishi, Y. Mizuno, and H. Chazono, Jpn. J. Appl. Phys., 42, 1 (2003). DOI |
11 | M. Pollet, S. Marinel, and G. Desgardin, Journal of the European Ceramic Society, 24, 119 (2004). DOI ScienceOn |
12 | P. J. Harrop and D. S. Campbell, Thin Solid Films, 2, 273 (1968). DOI ScienceOn |
13 | K. Aoki, I. Murayama, Y. Fukuda, and A. Nishimura, Jpn. J. Appl. Phys., 36, L690 (1997). DOI ScienceOn |
14 | Y. Liu, T. Cui, and K. Varahramyan, Solid-State Electronics, 47, 811 (2003). DOI ScienceOn |
15 | O. G. Vendik and L. T. Ter-Martirosyan, Tech. Phys., 44, 954 (1999). DOI ScienceOn |
16 | J. Kang, Y. Shin, and Y. Tak, Electrochimica Acta, 51, 1012 (2005). DOI ScienceOn |
17 | M. Baumgartner and H. Kaesche, Corrosion Science, 31, 231 (1990). DOI |
18 | K. R. Hebert and R. C. Alkire, J. Electrochem. Soc., 135, 2147 (1988). |
19 | K. Hebert and R. Alkire, J. Electrochem. Soc., 135, 2447 (1988). DOI ScienceOn |
20 | D. Goad, J. Electrochem. Soc., 144, 1965 (1997). |
21 | T. Fukushima, K. Nishio, and H. Masuda, Electrochem. Solid-State Lett., 13, C17 (2010). DOI ScienceOn |
22 | T. Fukushima, K. Nishio, and H. Masuda, J. Electrochem. Soc., 157, C137 (2010). DOI ScienceOn |
23 | K. Nishio, T. Fukushima, and H. Masuda, Electrochem. Solid-State Lett., 9, B39 (2006). DOI ScienceOn |
24 | K. Nishio, T. Fukushima, A. Takeda, and H. Masuda, Electrochem. Solid-State Lett., 10, C60 (2007). DOI ScienceOn |
25 | J. P. Rolland, E. C. Hagberg, G. M. Denison, K. R. Carter, and J. M. De Simone, Angew. Chem., 116, 5920 (2004). DOI ScienceOn |
26 | T. W. Odom, J. C. Love, D. B. Wolfe, K. E. Paul, and G. M. Whitesides, Langmuir, 18, 5314 (2002). DOI ScienceOn |
27 | X.-M. Zhao, Y. Xia, and G. M. Whitesides, J. Mater. Chem., 7, 1069 (1997). DOI ScienceOn |
28 | D. Qin, Y. Xia, and G. M. Whitesides, Nature Protocols, 5, 491 (2010). DOI ScienceOn |
29 | K. Y. Suh, J. Seong, A. Khademhosseini, P. E. Laibinis, and R. Langer, Biomaterials, 25, 557 (2004). DOI ScienceOn |
30 | R. S. Kane, S. Takayama, E. Ostuni, D. E. Ingber, and G. M. Whitesides, Biomaterials, 20, 2363 (1999). DOI ScienceOn |