• 대한전자공학회논문지
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• 제19권5호
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• pp.5-11
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• 1982

슬라이드 글라스와 위에 1μm 가량의 산화막을 입힌 실리콘 웨이퍼 위에, 폴리우레탄이나 에폭시 등의 유기 물질을 스핀너 (spinner)로 코우팅시켜서 평판형 유전체 도파관(dielectric slab waveguide)을 제작하고, 프리즘으로 빛을 커플링 (coupling) 시켜서 광도파 현상을 화인했다. 실리콘 웨이퍼나 슬라이드 글라스 위에다 알루미늄이나 은(Ag)을 진공증착시킨 것을 기관으로 사용하여 금각판 도파관(metal clad waveguide)을 제작하고, 프리즘 2개로 커플링 (coupling), 디커플링 (decoupling)시켜서 모우드 라인(mode line)을 관찰했다. 포토리지스트 K. P. R.의 굴절율이 폴리우레탄의 굴절율보다 큰 점을 이용하여 2층 구조의 박막 프리즘을 제작하고 빛이 꺾이는 현상을 확인했다.

• 한국전기전자재료학회논문지
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• 제22권12호
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• pp.1063-1066
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• 2009

In this study, we fabricated pentacene organic thin film trasistors(OTFTs) which used aluminum oxide as the gate insulator. Aluminum oxide for OTFTs was deposited on glass substrate with a different deposition rate by E-beam evaporation. In case of the deposition rate of $0.1\;{\AA}$, the fabricated aluminum oxide gate insulating OTFT showed a threshold voltage of -1.36 V, an on/off current ratio of $1.9{\times}10^3$ and field effect mobility $0.023\;cm^2/V_s$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.678-678
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• 2013

은 나노선은 투명 금속전극으로 저온 공정이 가능하고, 플랙서블 기판에 사용 가능하여 다양한 분야의 응용 소재 연구가 진행 중에 있다. 본 연구에서는 전면 전극으로 은 나노선을 스프레이 코팅하고, 알루미늄 도핑된 산화아연(AZO)을 sputter로 증착하였다. 광 경로를 길게 하기 위해 AZO 기판을 수열합성법을 통해 산화아연 나노선을 성장하였다. 은 나노선 전극 기판과 산화아연 나노선이 성장된 기판의 광 투과도를 분석하기 위해 UV-visible을 이용하였으며, FE-SEM, AFM을 이용하여 각 기판의 형상을 분석하였다. 은 나노선은 500 nm 파장영역에서 투과도 86.93%, 면저항 16 ${\Omega}/{\square}$보였다. ITO 기판보다 400~600 nm 영역에서 헤이즈가 증가되는 것을 확인 할 수 있었다. 산화아연 나노선이 성장된 기판을 이용하여 P3HT:PCBM 블랜딩된 유기 태양전지를 제작하여 전기적 특성 및 효율을 평가하였다.

• 한국분말재료학회지
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• 제18권1호
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• pp.49-55
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• 2011

Ni nanowires were fabricated using anodic aluminum oxide (AAO) membrane as a template by electrochemical deposition. The nanowires were formed within the walls of AAO template with 200 nm in pore diameter. After researching proper voltage and temperature for electrochemical deposition, the length of Ni nanowires was controlled by deposition time and the supply of electrolyte. The morphology and microstructure of Ni nanowires were investigated by field emission scanning electron microscope (FE-SE), X-ray diffraction (XRD) and transmission electron microscope (TEM).

• 전기학회논문지
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• 제66권8호
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• pp.1236-1241
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• 2017

We deposited Al-doped ZnO (ZnO:Al) thin films on glass substrates ($200mm{\times}200mm$) by using in-line magnetron sputtering system. Effects of various deposition parameters such as working pressure, deposition power and substrate temperature on optoelectronic characteristics including surface-texture etching profiles were carefully investigated in this study. We found that relatively low working pressure and high deposition power offered to obtain enhanced conductivity and optical transmittance. Haze properties showed similar trend with the transmittance. Furthermore, surface-texture etching study exhibited good morphologies when the films were deposited at $200-300^{\circ}C$. On the basis of these optimizations, we could find the deposition region that produces highly transparent and conductive properties including efficient light scattering capability.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.244-247
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• 1995

Physical, electrical and optical properties of Aluminum(Al) thin films were investigated in order to establish the optimum sputtering parameters in mirror reflection films. Al. thin films deposited on corning glass substrate by DC magnetron sputtering were grown as a variation of the input power, operation pressure and deposition time. The properties of the Al thin films have been discussed by deposition rate, SEM, XRD, sheet resistivity, resistivity and reflectance. Al thin films were obtained at the deposition conditions as follows: operating pressure, 3 mtorr; DC input power desnsitiy, 3W/$\textrm{cm}^2$.

• 한국세라믹학회지
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• 제31권6호
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• pp.601-608
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• 1994

Aluminum oxide thin films were deposited on p-type(100) silicon substrates by electron cyclotron resonance plasma enhanced CVD(ECR-PECVD) using TMA[Al(CH3)3] and oxygen as reactant gases at 16$0^{\circ}C$ or lower temperatures. The aluminum oxide films deposited by ECR-PECVD have the amorphous structure with the refractive index of 1.62~1.64 and the O/Al ratio of 1.6~1.7. Oxygen flow rate necessary for the stable deposition of the aluminum oxide films increases as the deposition temperature increases. It was found from the OES analysis that the ECR plasma had les cooling effect by introducing the TMA reactant gas in comparison with the RF plasma. The properties of aluminum oxide films prepared by ECR-PECVD were compared with those prepared by RF-PECVD. The ECR-PECVD aluminum oxide films have the higher refractive indices, the lower contents of impurities (H and C) and the stronger wet etch resistance than those deposited by RF-PECVD.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
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• pp.258-260
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• 1993

Aluminum thin films were deposited on glass substrate using DC Magnetron Sputtering. Deposition rate, specular reflectance, and resistivity were investigated as a function of the input power, pressure, substrate temperature, and deposition time. Reflectance was reduced with increasing power, also with prolonging deposition time. Topography of the surface, which influences the properties such as electromigration, was observed from scanning electron microscope (SEM) and there was a close relation between the topography and measured reflectance.

• 전자공학회논문지A
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• 제31A권12호
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• pp.31-37
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• 1994

Aluminum films were deposited by the pyrolysis of triisobutylaluminum(TIBA) in a cold wall LPCVD system for the metallization of high level IC. the selectivity on Si/SiO2 substrate and the contact resistance on submicron contacts were investigated. The carbon free aluminum film could be obtained when the aluminum film was deposited at low substrate temperature. Contact resistances of CVD Al/n+ Si contacts whose contact size was 0.5 .mu.m werre as low as 20~40.OMEGA./ea, which is 30~50% of contact resistance obtained by sputtering technique.

• 한국세라믹학회지
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• 제31권5호
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• pp.485-490
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• 1994

The reactive ion etching characteristics of aluminum oxide films, prepared by PECVD, were investigated in the CCl4 plasma. The atomic chlorine concentration and the DC self bias were determined at various etching conditions, and their effects on the etch rate of aluminum oxide film were studied. The bombarding energy of incident particles was found to play the more important role in determining the etch rate of aluminum oxide rather than the atomic chlorine concentration. It is considered to be because the bombardment of ions or neutral atoms breaks the strong Al-O bonds of aluminum oxide to help activate the formation reaction of AlCl3 which is the volatile etch product.