• Journal of the Institute of Electronics Engineers of Korea SC
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• v.47 no.6
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• pp.43-50
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• 2010

In this paper, the TWTA (Traveling Wave Tube Amplifier) maintenance system for the low altitude surveillance Radar was developed using the embedded Linux system, and its superiority was demonstrated through the performance test. Nowadays, the necessity of maintenance system and reliability testing on military equipments has been increasing steadily. In addition, nonlinear characteristics of the maintenance system for the low altitude surveillance Radar are more likely to have serious problems as well as to slow down durability. Therefore, after analyzing characteristics of RF input-output signal and TWTA, we designed interface circuits between the TWTA equipment and the embedded Linux system. The Linux kernel on the system was optimized to improve the efficiency and reliability. And our new TWTA maintenance system was evaluated in the real field. As a result, the proposed system was contented with desired specifications, and demonstrated military's fighting capabilities. Therefore, our novel system will advance military maintenance technology and will help to develop similar equipments.

• Journal of the Korea institute for structural maintenance and inspection
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• v.21 no.1
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• pp.59-66
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• 2017

In this paper, to protect the piping in nuclear power plants and various plant facilities, we have developed a damper using the friction method and carried out a study to analyze the performance. Friction typed damper means a device for attenuating vibration by generating a frictional force to the bearing and the shaft by applying a compressive force to the MER-Spring. In order to analyze the performance of the damper, the properties of MER-Spring and friction materials were analyzed, a study on the effects of friction was carried out, and the behavior of this equation was established. And, to determine whether deformation of the material and to examine the reliability of the behavior equation established, prototypes was produced and, through a performance test and finite element analysis of a damper made of specimens, they were analyzed. As a result, it is noted that the reliability of the material was confirmed, the coefficient of friction have to be adjusted according to the velocity, cyclic loading test and finite element analysis results show exhibits excellent results. In addition, a review of the dynamic loads in the future shall be performed for the usage in more broad fields.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.1
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• pp.61-68
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• 2012

The purpose of Crash Protected Module in Black Box used at aircraft is to protect a stored information(Flight data & Cockpit Voice) safely even after extreme environment like a plane crash. This study shows the structure & thermal analyses and the comparisons of predictions and results of tests about CPM for Crash Survival through extreme environment such as Penetration Resistance, High Temperature Fire, Low Temperature Fire. Specially, the Effect of housing thickness change was studied through the Penetration Resistance analysis using LS-DYNA, and the influence of volume ratio change between phase change material and thermal insulation material was studied through the High Temperature & Low Temperature analysis using Icepak. Also, structural and thermal reliability of CPM was validated through the tests.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.3
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• pp.535-541
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• 2009

In this paper, we present the improvement on the performance of driving part for single-phase MJ81 switch point machine which has been developed for localization. The single-phase motor's specification and reliability for speed and safety improvement of conventional line was investigated in "Development project for Speed-up on Conventional Line" We systemized the test procedure fur single-phase motor by investigating the feasibility for localization and the specification of function and performance. Also, we developed appropriate technology and proved the durability of the single-phase driving motor by executing synthesis test over 200,000 times.

• Journal of Advanced Navigation Technology
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• v.19 no.4
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• pp.288-298
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• 2015

For the commercialization of unmanned aircraft, we must validate the safety of the air/ground collision alert systems (CAS). The validation procedure of CAS requires the flight test which is not only expensive but also dangerous. To alleviate this problem, we need the simulation based validation process for the CAS. We developed an integrated UAV simulation (IUS) environment which interconnect the flight simulator, the Matlab/Simulink, and a target avionics simulation model. We developed the collision warning module of the TCAS and tested using IUS and flight encounter models. Using IUS, we can evaluate the performance and reliability of a target avionic system at the preliminary design stage of a development life cycle.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Journal of Korean Institute of Industrial Engineers
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• v.28 no.4
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• pp.407-414
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• 2002

The inherent reliability of a product is primarily determined in the design stage, and therefore, design engineers should be able to design reliability into the product in an efficient manner. Especially, the product should be designed such that its reliability is robust to various noise factors encountered in production and field environments. The Taguchi method can be effectively used for this purpose. However, there exist only a few attempts to integrate the Taguchi method with reliability design, and in addition, the existing works do not sufficiently consider the robustness and/or the distinction between noise and acceleration factors. This paper develops a unified approach to robust reliability design assuming that accelerated life tests are conducted at each combination of design and noise conditions. First, an experimental structure for assigning not only acceleration but also noise factors is presented. Second, the reliability at the use condition is estimated using the assumed accelerated life test model. Third, reliabilities are transformed into 'efforts' using an effort function which reflects the degree of difficulty involved in improving the reliability. Finally, an optimal setting of design parameters is determined based on the mean and standard deviation of the effort values. The above approach is illustrated with an example of a paper feeder design.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.339-345
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• 2020

In the field of defense, one-shot devices such as missiles are stored for a long period of time after they are manufactured, so it is essential to predict their storage life. A study was conducted to find the shelf life of a Li-ion battery used in one-shot devices. To do this, a Li-ion battery that has been used in weapon systems for more than 5 years was secured. A non-functional test was performed on the battery to check for external changes or failures. After the non-functional test, a discharge test was performed to measure the performance after storing it. Through the test, the performance was checked, including the initial charging voltage, discharge time, and battery temperature, and the trend of the change was identified. An F-test, One-way ANOVA, and regression analysis were performed to verify the aging, and the shelf life of the battery was estimated by an approximation formula that was derived through a regression analysis. As a result of the ANOVA, the p-value was less than the reference value of 0.05, and the performance of the battery decreased by more than 15% after a certain period of time. This change is assumed to result from the change in physical properties of the lithium polymer cell.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.180-186
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• 2002

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8＂)\;to\;\Phi300mm$ (wafer 12＂) and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.63-69
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• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.