• Title/Summary/Keyword: 신뢰성(reliability)

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Six Sigma and Reliability (6시그마와 신뢰성의 역할)

  • 김환중
    • Journal of Applied Reliability
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    • v.1 no.1
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    • pp.65-78
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    • 2001
  • Recently, Six Sigma to increase market share , decrease costs, and grow profit margin has been adopted by some leading companies in the world. Six Sigma is expected as the optimal movement to raise the quality level remarkably and to make enterprise culture and organization based on customer and market orientation. In this paper, we study on the idea of Six Sigma, the Internal and external success case, the reliability tools using in the Six Sigma, and the difference between the existing quality movement and Six Sigma. Also, we discuss the role of reliability In Six Sigma..

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Implementation Scheme of Database System for Reliability Prediction of the Mechanical System (기계류 시스템 신뢰성 예측 데이터베이스 시스템 구축 방안)

  • Kim, Yon-Soo
    • Journal of Applied Reliability
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    • v.5 no.4
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    • pp.451-463
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    • 2005
  • This paper describes procedure to build a generic reliability analysis database structure and failure data during the conceptual design phase. Reliability prediction utilizing such supporting database system enable the designer to quantify the effects of varying design and operational constrains on mechanical component's failure rate. This leads to compare competing alternatives to the reliability improvement efforts.

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Reliability-Based Design Optimization Using Akaike Information Criterion for Discrete Information (이산정보의 아카이케 정보척도를 이용한 신뢰성 기반 최적설계)

  • Lim, Woo-Chul;Lee, Tae-Hee
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.8
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    • pp.921-927
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    • 2012
  • Reliability-based design optimization (RBDO) can be used to determine the reliability of a system by means of probabilistic design criteria, i.e., the possibility of failure considering stochastic features of design variables and input parameters. To assure these criteria, various reliability analysis methods have been developed. Most of these methods assume that distribution functions are continuous. However, in real problems, because real data is often discrete in form, it is important to estimate the distributions for discrete information during reliability analysis. In this study, we employ the Akaike information criterion (AIC) method for reliability analysis to determine the best estimated distribution for discrete information and we suggest an RBDO method using AIC. Mathematical and engineering examples are illustrated to verify the proposed method.

Reliability Evaluation of ATC for High Speed Line Center (고속 Line Center의 ATC 신뢰성 평가)

  • Lee S.W.;Kim D.H.;Lee H.K.;Shin D.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1914-1917
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    • 2005
  • Recently, the reliability evaluation and analysis are applied for many industrial products, and many products are required to guarantee in quality and in efficiency. The purpose of this paper is to present some of reliability evaluation methodologies that are applicable to machine tools. Especially ATC(Automatic Too Changer), which is core component of line center, was chosen as the target of the reliability evaluation and analysis. The scope of research is reliability prediction, reliability test and evaluates their results. The results of this research has shown the failure rate, MTBF(Mean Time Between Failure), reliability for those components and real tests reliability through constructed reliability test-bed. It is expected that proposed methodologies will increase reliability for high speed line center.

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Study on a System Reliability Calculation Method Using Failure Enumeration of Reliability Path (신뢰도 경로의 고장열거를 이용한 시스템 신뢰도 계산방법 연구)

  • Lee, Jang-Il;Park, Kee-Jun;Chun, Hwan-Kyu;Jeong, Choong-Min;Shin, Dong-Jun;Suh, Myung-Won
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.6
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    • pp.629-633
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    • 2011
  • Recently, systems such as aircraft, trains and ships have become larger more complex. Therefore, the reliability calculation of these systems is more difficult. This paper presents a reliability calculation algorithm for a complex system with a solution that is difficult to analyze. When the system has a very complex structure, it is very difficult to find an analytical solution. In this case, we can assess system reliability using the failure enumeration method of the reliability path. In this research, we represent the reliability block diagram by an adjacent matrix and define the reliability path. We can find any system status by the failure enumeration of the reliability path, and thus we can calculate any kind of system reliability through this process. This result can be applied to RCM (Reliability-Centered Maintenance) and reliability information-management systems, in which the system reliability is composed of the reliabilities of individual parts.

standard enactment of Reliability testing for contact tip during GMA welding (GMA용접용 콘택트팁의 신뢰성 평가 기준 제정)

  • 김남훈;김희진;유회수
    • Proceedings of the Korean Reliability Society Conference
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    • 2004.07a
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    • pp.139-145
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    • 2004
  • 용접산업이 발전함에 따라 가스메탈아크 용접에서 고내마모성의 콘택트 팁이 요구되어지고 있다. 현재 국내외에서는 콘택트팁에 대한 수명평가 기준이 없으며, 일부 업계에서 자체 규격을 제정하여 운용하고 있지만 근거가 명확하지 않다. 따라서 본 연구에서는 콘택트팁의 신뢰성 평가기준을 제정하고자 하였다. 팁의 주요 파손기구로는 고온 마찰마모, 전기적 에로존, 번백 등이 있다. 신뢰성 평가는 경도 시험, 열처리 후 경도, 용접 마모, 전기전도도를 시험으로 구성되었다. 팁의 수명은 마모가 45%에 도달했을 경우 송급된 와이어 총 길이로 하였으며, 4시간까지 마모시험 한 결과를 근거로하여 한계수명을 추정하였다. 본 연구에서는 세 가지 조성의 다섯 가지의 콘택트팁에 대하여 4시간동안 내마모성 실험을 하였으며, 마모정도는 1시간 단위로 면적비를 백분율로 환산하여 측정하였다. 실험 결과 가공경화형팁은 1시간이내에 재결정 및 입자성장에 의한 경도 저하로 가공경화가 팁 수명에 지속적 영향을 주지 못하였다. 반면, 석출경화형팁은 석출경화 효과가 지속되어 가공경화형팁보다 수명이 향상 되었다.

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Operational Reliability Analysis of Guided Weapon Systems (유도무기 시스템의 운용 신뢰도 분석)

  • Ha, Ju Seok;Kim, Kyung Mo
    • Convergence Security Journal
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    • v.17 no.3
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    • pp.95-101
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    • 2017
  • Reliability is the priority matter in guided weapon systems. The reliability prediction data is used during the devel opment stage as the manufacturing cost is very high and the production quantity if quite limited. At the same time it takes relatively a long period of time to acquire a reliable operation data set after deployment such that in order t o determine the operational reliability, weapons must be tested and analyzed in real operating environments. For the research, the life distributions were estimated by using actual operation data and the reliability was calculated by ap plying the method of least squares and maximum likelihood estimation. Also, the comparisons were made between pr edicted reliability and actual operational reliability. As a result, the actual reliability of each system was higher than predicted reliability and it was considered that such a difference was caused by the fact that the application of the l atest designing technology and improved parts to the guided weapon systems was not reflected on the estimation of predicted reliability. It was possible to confirm the actual operational reliability of domestic (ROK) guided weapon sy stems through this research and the methods used here will contribute to the reliability analyses for the future guide d weapon systems to be developed.

Reliability Based Design Optimization for the Pressure Recovery of Supersonic Double-Wedge Inlet (이중 쐐기형 초음속 흡입구의 압력회복률에 대한 신뢰성 기반 최적설계)

  • Lee, Chang-Hyuck;Ahn, Joong-Ki;Bae, Hyo-Gil;Kwon, Jang-Hyuk
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.38 no.11
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    • pp.1067-1074
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    • 2010
  • In this study, RBDO(Reliability Based Design Optimization) was performed for a supersonic double-wedge inlet. By considering uncertainty of design with given design space, the pressure recovery was transformed into the probabilistic constraint while the inlet drag was considered as a deterministic objective function. To save computational analysis cost and to search good design space, Latin-Hypercube design of experiment and the Kriging model were incorporated and then RBDO was performed. Monte-Carlo simulation was performed to verify the accuracy of AFORM(Advanced First Order Reliability Method). It was found that AFORM result agreed very well with the Monte-Carlo simulation result. The system reliability was guaranteed by considering uncertainty of the design variables. In case of considering diverse uncertainty of system design, RBDO was found to be useful.

Experimental and Numerical Analysis of Package and Solder Ball Crack Reliability using Solid Epoxy Material (Solid Epoxy를 이용한 패키지 및 솔더 크랙 신뢰성 확보를 위한 실험 및 수치해석 연구)

  • Cho, Youngmin;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.1
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    • pp.55-65
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    • 2020
  • The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

A Comparative Study on the Reliability Growth Enhancement Activities Using "ANALYSIS" and "TEST" through FMECA and Highly Accelerated Life Tests (신뢰성 성장 강화를 위한 Analysis 방법(FMECA)과 Test(초가속수명시험-HALT) 비교 연구)

  • Shin, Sang-Hee;Jung, Joo-Hyun;Kang, Tae-Ho;Lee, Jong-Sin
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.7
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    • pp.406-418
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    • 2020
  • When developing weapons systems, it is important to implement the functions and performance of equipment suitable for development purposes, but it is very important to ensure that the equipment is capable of operating without any vacuum with reliability after development. Therefore, various activities are carried out to enhance reliability of equipment. Reliability is enhanced by using high-specification parts in development, reliability verification through analysis, and testing using development prototypes to reinforce and improve the parts that are lacking in equipment. However, recently, development schedules are shortened due to rapidly changing external conditions and technologies, and there are cases where sufficient reliability growth activities were not carried out due to problems such as cost. Examples are projects that perform reliability activities only in analytical methods (reliability, FMECA). In this paper, analyzing and testing methods for analysis and testing were carried out on the same equipment through FMECA and super-accelerated life test, the contents of reliability growth activity were derived, the results of design change/review were accordingly compared, the differences between the two methods were analyzed, and measures were proposed to strengthen reliable growth activities. It was concluded that reliable growth activities through analysis from the beginning of development and reliable growth activities through testing should be carried out at the completion of initial prototype production.