• Title/Summary/Keyword: 습식 공정

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Characterization of the SOI wafer by Pseudo-MOS transistor (Pseudo-MOSFET을 이용한 SOI wafer 특성 분석)

  • Kwon, Kyung-Wook;Lee, Jong-Hyun;Yu, In-Sik;Woo, Hyung-Joo;Bae, Young-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.21-24
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    • 2004
  • Pseudo-MOSFET의 제작을 위해서는 표면 실리콘 층의 식각 공정이 필요하며, 공정의 간편성으로 인해 주로 RIE(Reactive Ion Etching)를 사용하고 있다. 하지만, RE 공정 도중 발생하는 Plasma에 의해서 SOI 층이 손상을 받게 되고 이 영향으로 소자의 특성이 열화 될 가능성이 있다. 이러한 특성의 열화를 확인하기 위하여 소자 제작을 위한 표면 실리콘 층의 식각을 RIE 공정과 TMAH 용액을 이용한 습식 식각을 각각 행하여 그 특성을 비교한 결과, 건식 식각된 시편에서 계면상태 밀도의 증가, 이동도의 감소 등 특성 열화 현상이 현저히 나타났다. 이러한 RIE 공정 중 발생하는 손상을 제거하기 위하여 저온 열처리를 하였으며 그 결과 $400^{\circ}C$ $N_2$ 분위기에서 4시간 동안 열처리를 하여 습식 식각된 시편과 동일한 특성을 가지게 할 수 있었다.

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A study on the hot gas cleanup of waste-derived fuel gas (폐기물 합성가스의 활용을 위한 고온 정제 공정 적용 연구)

  • Kim, Narang;Yoo, Youngdon;Jung, Kijin;Kim, Jeongheon;Kim, Byunghwan
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.172.2-172.2
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    • 2011
  • 다양한 저급연료나 폐기물로부터 가스엔진이나 연료전지의 연료로 사용하기위한 연료가스를 얻기 위한 방법으로 가스화 기술을 적용할 수 있다. 폐기물의 가스화를 통해 발생된 합성가스에는 CO, $H_2$, $CO_2$와 같은 주요성분 이외에 황화합물($H_2S$, COS), 염소화합물(HCl), 고형 물질(분진)등의 오염물질이 포함되어 있으므로, 이용목적에 따라 적절한 정제 기술이 필요하게 된다. 현재 가장 널리 알려진 저온 습식 정제공정은 장치운전이 쉽고 오염물질 제거효율이 높은 장점이 있으나, 합성가스 온도를 상온까지 낮추기 때문에 현열 손실이 발생하는 단점을 가지고 있다. 고온 건식 정제공정에 의해 $300^{\circ}C$ 이상의 고온에서 오염물질의 제거가 가능하다면 에너지 이용효율을 높일 수 있고, 습식공정에 의해 발생되는 폐수처리에 따른 비용 절감효과도 얻을 수 있다. 폐기물 합성가스를 최종 적용처에 이용하기위한 고온 정제 공정의 적용을 위해 흡착제를 이용하여 탈황, 탈염 실험을 실시하였고, 실험결과로부터 장치 설계의 기초인자를 도출하였다.

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Development of Build up Multilayer Board Rapid Manufacturing Process Using Screen Printing Technology (스크린인쇄 법을 이용한 Build-up다층인쇄회로기판의 쾌속제조공정 기술개발)

  • 조병희;정해도;정해원
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.4
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    • pp.15-22
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    • 1999
  • Generally, many equipments and a long lead time ale required to manufacture the build-up multilayer board through various processes such as etching, plating, drilling etc. Wet process is suitable for mass production, however it is not adequate for manufacturing prototype in developing stage. In this study, a silk screen printing technology is introduced to make a prototype build-up multilayer board. As for the material photo/thermal curable resin and conductive paste are used for forming dielectric and conductor. And conductive paste fills vias for interconnecting each layer, and also is used for circuit patterning by silk screen technology. Finally, the basic concept and the possibility of build-up multilayer board prototype is proposed and verified as a powerful approach, compared with the conventional processes.

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Removal of PVC from Mixed Plastic Waste by Combination of Air Classification and Centrifugal Process (풍력(風力) 및 습식비중(濕式比重) 선별(選別)에 의한 혼합(混合)폐플라스틱 종말품(終末品)으로부터 PVC 제거(除去)에 관한 연구(硏究))

  • Choi, Woo-Zin;Yoo, Jae-Myung
    • Resources Recycling
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    • v.16 no.5
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    • pp.71-76
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    • 2007
  • The mixed plastic waste generated from households after hand-picking and/or mechanical sorting processes amounts to 1,750,000 ton in 2006, and most of these waste are finally end up with landfill and/or incineration due to the lacks of separation technologies and economical reasons. The mixed plastic wastes can not be used as raw materials for chemical and/or thermal recycling processes because of their high content of PVC(upto 4.0 wt.%). In the present research, gravity separation system has been developed to remove PVC from the mixed plastic waste and to recover the PO-type plastics. This system mainly consists of air classification, magnetic separation, one-step crushing, feeding system at fixed rate and wet-type gravity separation system. The gravity system based on centrifugal separation has been developed at capacity of 0.5 ton/h and it consists of mixing, precleaning, separation, dewatering, recovery system and wastewater treatment system, etc. The main objective of this process is to achieve high separation efficiency of polyolefins with less than 0.3 wt.% PVC content and less than 10% moisture content in the final products. In addition, a crushing unit of with 8 rotor system is also developed to improve the crushing efficiency of soft-type plastics. The system with a capacity of 1.0 ton/h is developed and operational results are presented.

Effect of Limestone Particle Size on the performance of FGD system (석회석 입도에 따른 습식배연탈황 성능연구)

  • Lee, Kyeong-Woo;Hwang, Jae Dong;Woo, Kwangje;Jang, Gil Hong
    • Clean Technology
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    • v.7 no.1
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    • pp.81-88
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    • 2001
  • Limestone has been used as absorbent in the FGD(Flue Gas Desulfurization) system, the DeSOx system of thermal power plant. This study investigated the desulfurization characteristics of the two different limestones, 325mesh and 200mesh particle size. Experimental analysis showed that the dissolving rate of limestone became much slower as the particle size increased. But the desulfurization efficiency depended on the L/G(liquid/gas) ratio and slurry pH regardless of the limestone particle size. The quality of gypsum produced in the FGD process increased as the limestone particle size or the slurry pH decreased. To reduce the cost of absorbent, the mixed limestone which were composed of 200 and 325mesh limestone with 5 different ratios were tested.

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Fabrication of Glass Microstructure Using Laser-Induced Backside Wet Etching (레이저 습식 후면 식각공정을 이용한 미세 유리 구조물 제작)

  • Kim, Bo Sung;Park, Min Soo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.9
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    • pp.967-972
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    • 2014
  • The good light permeability and hardness of glass allow it to be used in various fields. Non-conventional machining methods have been used for glass machining because of its brittle properties. As one non-contact machining method, a laser has advantages that include a high machining speed and the fact that no tool making is required. However, glass has light permeability. Thus, the use of a laser to machine glass has limitations. A nanosecond pulse laser can be used at low power for laser-induced backside wet etching, which is an indirect method. In previous studies, a short-wave laser that had good light absorption but a high price was used. In this study, a near-infrared laser was used to test the possibility of glass micro-machining. In particular, when deeper machining was conducted on a glass structure, more problems could result. To solve these problems, microstructure manufacturing was conducted using ultrasonic vibration.