• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1018-1021
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.205.1-205.1
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• 2014

4세대 가속기 언듈레이터 진공용기는 길이가 6 m이고 내경이 $7{\times}11mm$로 매우 좁아서 내부 표면의 경면연마가 까다롭다. 미국이나 독일의 경우 입자유동연마 방법으로 표면 거칠기와 표면 산화막 두께를 요구되는 수준으로 낮췄다. 이 방법을 적용해 본 결과, 연질의 알루미늄 표면에 스크레치 및 피트 발생율이 높고 고비용에 처리시간이 길다는 단점이 있었다. 포항가속기에서는 입자유동연마와 병행하여 화학연마 방법으로 관경이 좁은 형상이나 길이에 구애받지 않고 긴 진공용기 크기의 약품조가 없이 표면연마 할 수 있는 장치를 고안하였다. 이 장치는 표면조도 개선 목적의 화학연마, 표면 산화막 두께 개선, 세척 및 건조장치가 한 시스템으로 구성되어 큰 약품조와 수세조가 필요하지 않다는 장점이 있어서 입자유동연마 공정을 대체할 수 있는 방법으로 기대된다. 본 발표에서는 화학연마 장치에 대해 소개하고 연마 전 후 표면조도와 산화막 개선 결과에 대해서 논하고자 한다.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1448-1452
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin-film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the tangential forces simultaneously as the probe tip of the equipment approaches to the interface between thin-film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ${\sim}$ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester, the feasibility test was performed to evaluate the adhesive strength of thin-film.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.67-72
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• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.

• Journal of the Korean Society for Nondestructive Testing
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• v.18 no.6
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• pp.455-463
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• 1998

RCCA(rod cluster control assembly) End-Tip suffers from neutron irradiation and constant vibration due to high-speed internal flow of primary coolant during plant operation. Such operating conditions cause the RCCA end-tip crackings around tile circumferential weldment of the end-tip, and in some cases, the defective end-tips were completly broken loose. However, no reliable inspection techniques for end-tip crackings were developed in the past, although some techniques exist for inspecting RCCA control rod wears. Therefore, NDE group at KEPRI has developed an ECT technique for the detection and the sizing of the end-tip crackings. The technique uses a specially designed surface-riding probe that can detect size of circumferential crackings with an accuracy of ${\pm}5.31%$ RMS error. This paper describes the ECT instrumentation including the ECT probes, calibration bars, as well as technical approaches.