• Title/Summary/Keyword: 수지 경화

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Cure Behavior and Chemorheology of Low Temperature Cure Epoxy Matrix Resin (저온 경화형 에폭시 매트릭스 수지의 경화거동 및 화학유변학에 대한 연구)

  • Na, Hyo Yeol;Yeom, Hyo Yeol;Yoon, Byung Chul;Lee, Seong Jae
    • Polymer(Korea)
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    • v.38 no.2
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    • pp.171-179
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    • 2014
  • Low temperature cure prepregs are being developed for use in the preparation of large-structured fiber-reinforced polymer (FRP) composites with good performance. Cure behavior and chemorheology of low temperature cure epoxy resin system, based on epoxy resin, curing agent, and accelerators, were investigated to provide a matrix resin suitable for the prepreg preparation. Characteristics of cure reaction were studied in both dynamic and isothermal conditions by means of differential scanning calorimetry and rheometry. The low temperature cure epoxy resin system suggested in this study as a matrix resin was curable at $80^{\circ}C$ for 3 h, and showed the gel times of 120 and 20 min at 80 and $90^{\circ}C$, respectively. Thermal and mechanical properties of the cured sample were almost the same as high temperature cure counterparts.

UV 나노임프린트를 위한 UV 경화성 수지의 경화 모델 개발

  • 이진우;조동우;이응숙
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.13-13
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    • 2004
  • 나노테크놀러지 중의 한 가지인 나노임프린트 리소그래피 기술은 수 ∼ 수십 나노 급의 선폭을 가지는 스탬프(stamp)를 전자빔 리소그래피(electron beam lithography)를 이용하여 제작한 후 스탬프에 형성된 패턴과 동일한 형상을 원하는 곳에 모사하는 기술이다. 이 기술은 크게 열을 가하는 방식과 UV 경화성 수지를 이용한 방식으로 나뉜다. 열을 가하는 나노임프린트 리소그래피 방식의 경우는 열 경화성 수지를 이용하여 고온 조건에서 스탬프를 고압으로 눌러 원래의 형상을 모사하며, UV 나노임프린트는 광경화 반응을 이용하여 수지를 경화 시켜 모사하는 차이점이 있다.(중략)

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Cure Monitoring of Epoxy Resin by Using Fiber Bragg Grating Sensor (광섬유 브래그 격자 센서를 이용한 에폭시 수지의 경화도 모니터링)

  • Lee, Jin-Hyuk;Kim, Dae-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.36 no.3
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    • pp.211-216
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    • 2016
  • In several industrial fields, epoxy resin is widely used as an adhesive for co-curing and manufacturing various structures. Controlling the manufacturing process is required for ensuring robust bonding performance and the stability of the structures. A fiber optic sensor is suitable for the cure monitoring of epoxy resin owing to the thready shape of the sensor. In this paper, a fiber Bragg grating (FBG) sensor was applied for the cure monitoring of epoxy resin. Based on the experimental results, it was demonstrated that the FBG sensor can monitor the status of epoxy resin curing by measuring the strain caused by volume shrinkage and considering the compensation of temperature. In addition, two types of epoxy resin were used for the cure-monitoring; moreover, when compared to each other, it was found that the two types of epoxy had different cure-processes in terms of the change of strain during the curing. Therefore, the study proved that the FBG sensor is very profitable for the cure-monitoring of epoxy resin.

A Study on Cure Monitoring of Fast Cure Resin RTM Process Using Dielectrometry (유전기법을 이용한 속경화 수지 RTM 공정의 경화 모니터링에 대한 연구)

  • Park, Seul-Ki;Kim, Cheol-Hwan;Choi, Jin-Ho
    • Composites Research
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    • v.30 no.3
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    • pp.202-208
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    • 2017
  • Resin transfer molding (RTM) is a mass production process that allows the fabrication of composites ranging in size from small to large. Recently, fast curing resins with a curing time of less than about 10 minutes have been used in the automotive and aerospace industries. The viscosity of resin is bound up with the degree of cure, and it can be changed rapidly in the fast-cure resin system during the mold filling process. Therefore, it is advantageous to experimentally measure and evaluate the degree of cure because it requires much effort to predict the flow characteristics and cure of the fast curing resin. DMA and dielectric technique are the typical methods to measure the degree of cure of composite materials. In this paper, the resin flow and degree of cure were measured through the multi-channel dielectric system. A total of 8 channels of dielectric sensors were used and resin flow and degree of cure were measured and compared with each other under various pressure conditions.

Thermal Stability and Cure Behavior of Waterborne Phenol-Formaldehyde Resin (수용성 페놀-포름알데히드 수지의 열안정성 및 경화거동)

  • Yoon, Sung Bong;Kim, Jin Woo;Cho, Donghwan
    • Journal of Adhesion and Interface
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    • v.7 no.1
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    • pp.16-22
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    • 2006
  • In this work, the effect of cure temperature and time on the thermal stability and the exothermic cure reaction peak of a waterborne resol-type phenol-formaldehyde resin, which may be used for preparing phenolic sheet molding compounds (SMC), has been investigated using a thermogravimetric analyzer and a differential scanning calorimeter. The weight loss of waterborne phenol-formaldehyde resin was mainly occurred at three temperature stages: near $200^{\circ}C,\;400^{\circ}C$, and $500^{\circ}C$. The carbon yield at $750^{\circ}C$ for the cured resin was about 62%~65%. Their thermal stability increased with increasing cure temperature and time. Upon cure, the exothermic reaction was taken placed in the range of $120^{\circ}C{\sim}190^{\circ}C$ and the maximum peak was found in between $165^{\circ}C$ and $170^{\circ}C$. The shape and the maximum of the exothermic curves depended on the given cure temperature and time. To remove $H_2O$ and volatile components, the uncured resin needed a heat-treatment at $100^{\circ}C$ for 60 min at least prior to cure or molding. Curing at $130^{\circ}C$ for 120 min made the exothermic peak of waterborne phenol-formaldehyde resin completely disappeared. And, post-curing at $180^{\circ}C$ for 60 min further improved the thermal stability of the cured resin.

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Synthesis of Water Soluble Anti-Static Composition and It’s Application for PVC Floor (수용성 대전방지제의 합성 및 이를 이용한 PVC 바닥재 코팅)

  • 이도현;하진욱
    • Proceedings of the KAIS Fall Conference
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    • 2001.05a
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    • pp.73-75
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    • 2001
  • 본 연구에서는 무용제 타입의 알킬(alkyl)기를 가진 친수성 4차 암모늄염인 대전방지제(Ultramer 5530)를 합성, 유/무광 수용성 수지와 배합하여 PVC 바닥재에 열경화 코팅을 행하였다. 대전방지 코팅액은 Ultramer 5530을 광택조절이 가능한 유/무광 수용성 수지에 무게 기준으로 5-20 wt%(이하 ‘part’로 표기)범위로 첨가, 배합하여 제조하였다. 대전방지 코팅 처리전 PVC 바닥재의 표면저항은 10/sup 12/Ω이었으나 코팅 후 표면저항은 유광 수지의 경우 최대 10/sup 8/Ω, 무광 수지의 경우 최대 10/sup 6/Ω까지 감소하였다. 유/무광 수지 모두 경화조건에 관계없이 일반적으로 Ultramer 5530의 첨가량이 증가할수록 코팅된 PVC 바닥재의 표면저항은 현저히 감소하였다. 경화온도 l00℃에서 1분간 경화한 콜이도막은 Ultramer 5530의 첨가량이 증가함에 따라 전기저항이 현저하게 감소하였으나 경도 및 부착률 등의 코팅도막 물성이 현저히 저하됨을 알 수 있었다. 이러한 물성 저하는 경화온도를 80℃로 낮추고 경화시간을 20분으로 늘리면 해결할 수 있었다. 본 연구결과, PVC 바닥재의 표면에 형성된 코팅도막의 물성은 Ultramer 5530의 첨가량을 8 part로 하고 120℃에서 1분간 열경화를 시켰을 때 가장 좋았다.

Realtion between Curing Formation and Electrical Insulation Properties in Epoxy Resin (에폭시 수지의 경화형태와 전기 절연특성과의 연관성)

  • Kim, Tae-Seoung;Lee, Jin;Lee, Eun-Hak
    • Electrical & Electronic Materials
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    • v.3 no.2
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    • pp.81-89
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    • 1990
  • 신소재용 전기 절연재료로 각광받고 있는 에폭시 수지는 경화과정에서 현저한 화학적 반응을 동반하며 경화제와 경화조건에 따라 다양한 물리적, 화학적 성질을 나타내므로 전기적 특성과 경화형태와의 관련성에 대한 연구는 에폭시 수지의 절연특성을 향상시키는 중요한 자료가 된다. 실험결과, 경화는 에폭시의 에폭시환과 경화제의 활성기 사이의 화학반응으로 일어나며 전기 절연특성을 경화할 때 얻어지는 가교에 의하여 영향을 받음을 확인하였고 경화형태는 적외선 파수 915[$cm^{-1}$ /]의 에폭시환이 감소하고 1,453[$cm^{-1}$ ] 파수의 변성메틸이 생성되지 않는 가교를 할 때 우수한 졀연특성이 얻어졌다.

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Hardening properties in MMA monomer using UP and EPS in addition hardener (경화제의 첨가에 따른 UP와 EPS 혼입 MMA 수지의 경화특성)

  • Lee, Jung-Hui;Song, Hun;Chu, Yong-Sik;Lee, Jong-Kyu
    • Proceedings of the Korea Concrete Institute Conference
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    • 2008.11a
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    • pp.445-448
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    • 2008
  • The unsaturated polyester(UP) and epoxy resin have a superior material properties and a chemical resistance using sewerage pipes rehabilitation. However, UP and epoxy have not a low temperatures harding, the requirement $8{\sim}11$ hours long times harding and heating system used by reinforcement liner. This study is to evaluate the effects of low temperature harding properties methyl methacrylate(MMA) monomer using expanded polystyrene(EPS) and UP in addition of initiator and promoters. From the test result, viscosity tends to increase with increasing EPS and UP contents. However, harding time change of the MMA resins which it follows in addition of the initiator and promoter.

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Curing Behaviors and Viscoelastic of UPE Resins with Different Glycol Molar Ratios (글리콜 몰비가 다른 불포화 폴리에스테르 수지의 경화거동 및 점탄성)

  • Lee, Sang-Hyo;Park, Yung-Hoon;An, Seung-Kook;Lee, Jang-Oo
    • Polymer(Korea)
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    • v.25 no.1
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    • pp.15-24
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    • 2001
  • In this study, the effects of different glycol molar ratios of unsaturated polyester(UPE) resins on the curing behaviors were investigated. The cross linking process was checked or monitored by differential scanning calorimetry(DSC) and by viscoelastic properties of rigid-body pendulum model. The knife-edge from which the pendulum is suspended, is immersed in a reaction mixture, and the change of the viscoelastic behavior brings on those of the period(T) and logarithmic decrement(${\Delta}$) of the damped free oscillations of the pendulum. The values of T and ${\Delta}$ obtained are related to the dynamic modulus(E') and modulus loss(E'). The information on the viscoelastic behavior of unsaturated polyester(UPE) resins during the curing process are shown to illustrate the usefulness of the techniques. As the content of NPG in a propylene glycol(PG)/NPG glycol mixture increased, both the cycle time during cure and the change of damping during cure of UPE resin decreased.

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Studies on Rheological and Mechanical Properties of Siloxane-modified Epoxy (실록산 변성 에폭시의 유변학적.물리적 특성 연구)

  • 박수진;김현철;이재덕;박병기
    • Proceedings of the Korean Fiber Society Conference
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    • 2003.04a
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    • pp.368-369
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    • 2003
  • 선진 복합재료의 매트릭스 수지로서 자장 많이 사용되고 있는 에폭시는 수지 및 경화제의 종류에 따라 여러 가지 물성을 나타낼 수 있다. 에폭시 수지는 기계적 물성 및 내화학성이 우수하고 경화시 수축변형이 적은 장점이 있으나 높은 가친밀도 때문에 순간적인 충격에 취약하다는 단점을 지니고 있다. 따라서 이러한 에폭시 수지의 취성 (brittleness)을 개선하기 위해 충격강도를 증가시킬 수 있는 강인화제를 혼합하여 경화시키는 방법이 사용되고 있다[1]. (중략)

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