Verification Study of Lifetime Prediction Models for Pb-Based and Pb-Free Solders Used in Chip Resistor Assemblies Under Thermal Cycling (온도변화 환경에서 칩저항 실장용 유·무연솔더의 수명모델 검증연구)
-
- Transactions of the Korean Society of Mechanical Engineers A
- /
- v.40 no.3
- /
- pp.259-265
- /
- 2016