• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.93-98
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• 2017

The fixing behaviors of raw silk yarns treated with melamine and formaldehyde at a molar ratio of 1:3 for trimethylolmelamine were investigated. Sericin was fixed during the fixing process, but a part of sericin I was removed simultaneously by hot water. The weight losses by fixing and the degumming losses by degumming greatly decreased with increasing concentrations of melamine and formaldehyde. The silk yarns fixed with 0.011 M melamine and 0.033M formaldehyde were significantly degummed due to the insufficient fixation of sericin and the alkaline hydrolysis of sericin by sodium carbonate during the degumming process. On the other hand, the silk yarns fixed with 0.055M melamine and 0.165M formaldehyde were degummed slightly (the degumming losses of 3-8%) due to the strong fixation of sericin, which might result from the many cross-linkages between the sericin I molecules, which were formed by trimethylolmelamine. Those fixed with the fixing solution containing 15% owf softener showed the lowest weight and degumming losses because under the condition of 15% owf softener, the cation of the softener can effectively form ionic bonds with the negatively charged side chain of aspartic acid in sericin. In addition, van der Waals' forces may be also formed between the hydrophobic tail of the softener and the hydrophobic region of sericin, which may help inhibit the removal of sericin I.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.39 no.1
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• pp.9-17
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• 2013

We studied the anti-oxidant and anti-aging activities of Sericinjam Gland Hydrolysate (SJGH) in the human dermal fibroblasts. SJGH effectively defended cell death and ROS generation under high H2O2 in human dermal fibroblasts. Moreover SJGH reduced the expression of SA-${\beta}$-Gal and MMP-1 under low concentration of $H_2O_2$ whereas biosynthesis of procollagen-I was increased. This results demonstrate the anti-oxidant and anti-aging activities of SJGH. SJGH could be a good candidate for anti-aging cosmetics ingredient.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.65-65
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• 2003

Chemical mechanical polishing (CMP) is one of the most important processes in recent ULSI (Ultra Large Scale Integrated Circuit) manufacturing technology. Recently, ceria slurries with surfactant have recently been used in STI-CMP,[1] became they have high oxide-to-nitride removal selectivity and widen the processing margin The role of the abrasives, however, on the effect of planarization on STI-CMP is not yet clear. In this study, we investigated how the crystal characteristic affects the planarization efficiency of wafer surface with controlling crystallite size and poly crystalline abrasive size independently.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.45-49
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• 2004

We examined large particles and filter size effects of Central Chemical Supplying (CCS) system for STI-CMP on Light Point Defects (LPDs) after polishing. As manufacturing process recently gets thinner below 0.1 um line width, it is very important to keep down post-CMP micro-scratch and LPDs in case of STI-CMP. Therefore, we must control the size distribution of large particles in a slurry. With optimization of final filter size, CCS system is one of the solutions for this issue. The oxide and nitride CMP tests were accomplished using nano-ceria slurries made by ourselves. The number of large particles in a slurry and the number of LPDs on the wafer surface after CMP were reduced with decrease of the final filter size. Oxide removal rates slightly changed according to the final filter size, showing the good performance of self-made nano ceria slurries.

• Journal of the Semiconductor & Display Technology
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• v.3 no.1
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• pp.15-20
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• 2004

Through shallow trench isolation (STI) chemical mechanical polishing (CMP) tests, we investigated the dependence of pad surface temperature on the abrasive and additive concentrations in ceria slurry under varying pressure using blanket film wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surfaces during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increasing the additive concentration. This difference in temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, meaning the higher friction coefficient.

• Journal of the Korean Ceramic Society
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• v.36 no.4
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• pp.372-379
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• 1999

Hihg-toughened ceria-stabilized tetragonal zirconia ceramics with irregular grain shape and undulated grain boundary was prepared by ceria doping. Irregularity of grain shapes was increased with the amount of doped ceria. But in case of the large amount of doped ceria grain boundary was migrated to the reverse direction of DIGM. Ceria-stabilized zirconia ceramics annealed at 1650$^{\circ}C$ for 2h after twice dippings into cerium nitrate solu-tion of 0.2M and sintering at 1500$^{\circ}C$ for 2h showed the highest grain boundary length with a value of 23.6$\mu\textrm{m}$ Ceria concentration difference between convex and concave sides in irregular grains was observed over 1 mol% but not observed in normal grains, Specimens with normal grain shape showed intergranular fracture mode whereas the specimens with irregular grain shape showed transgranular fracture mode.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.542-542
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• 2008

본 논문에서는 기존에 상용화된 슬러리에 비해 새로운 혼합 연마제 슬러리의 우수성을 입증하고, 최적화 된 공정기술을 연구의 기반으로 활용하고자 Silica slurry에 $CeO_2$ 연마제를 혼합하여, 어떠한 연마 특성을 나타내는지 알아보았고, AFM, EDX, XRD, TEM 분석을 통해 그 가능성을 비교 분석하였다.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.87-88
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• 2006

To investigate the possibility of ceria abrasive-added slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, two kinds of retreated methods were introduced as follows: First, the characteristics of mixed abrasive slurry (MAS) using $CeO_2$ powder as an abrasive added within diluted silica slurry (DSS) were evaluated to achieve the improvement of removal rates and non-uniformity. Second, the control of pH level due to the dilution of slurry was examined. And then, we have discussed the CMP characteristics as a function of abrasive dispersion time.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.122-125
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• 2003

We investigated the effect of the abrasive and additive concentrations in Nano ceria slurry on the pad surface temperature under varying pressure through chemical mechanical polishing (CMP) test using blanket wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with increase of the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surface during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increase of the additive concentration. This difference of temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, which means the higher friction coefficient.

• Korean Journal of Materials Research
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• v.15 no.12
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• pp.818-823
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• 2005

Sub-micron colloidal silica particles coated with nano-sized ceria were prepared by mixing of its silica and cerium salts hydrolysis, and modified by hydrothermal reaction. By using the slurries with and without hydrothermal modification containing above particles, oxide film coated on silicon wafer was polished. The modified slurries had higher polish rate due to increase of ceria fraction to silica through hydrothermal reaction. They revealed higher stability in wide range of pH $2\~10$ than ceria coated silica slurries without its modification.