• 한국산학기술학회논문지
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• 제18권5호
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• pp.93-98
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• 2017

트리메틸올멜라민에 의한 세리신 정착 거동을 고찰하기 위해 멜라민과 포름알데하이드를 몰 비 1:3으로 세리신정착액을 조성하여 실크 생사를 정착시켰고, 정련에 의해 세리신 정착 거동을 살펴보았다. 정착 과정에서 세리신의 정착이 일어나는 동시에 열수에 의해 세리신 I의 일부가 제거되었다. 정착 중의 감량과 정련에 의한 연감율은 멜라민과 포름알데하이드의 농도가 증가할수록 크게 감소했다. 0.011몰 멜라민과 0.033몰 포름알데하이드로 정착한 실크 생사는 불충분한 정착과 탄산나트륨에 의한 세리신의 알칼리 가수분해로 인해 많은 정련이 일어났다. 그러나 0.055몰 멜라민과 0.165몰 포름알데하이드로 정착한 실크 생사는 강한 세리신 정착으로 인해 3-8%의 매우 적은 연감율을 보였는데 이는 트리메틸올멜라민에 의해 세리신 I 분자 간에 많은 가교결합이 형성되었기 때문으로 사료된다. 또한 15% owf 유연제의 정착액으로 처리한 경우 정착에 의한 감량과 정련에 의한 연감율이 가장 작게 나타났는데 이는 유연제의 양이온이 세리신 중의 아스파르트산의 음이온과 이온결합을 형성하고 유연제의 소수부와 세리신의 소수성 영역 간에 반데르바알스력이 형성되어 세리신 I의 제거가 다소 억제된 것으로 사료된다.

• 대한화장품학회지
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• 제39권1호
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• pp.9-17
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• 2013

본 논문에서는 세리신잠 실샘 가수분해물(Sericinjam Gland Hydrolysate: SJGH)을 이용하여 진피 섬유아세포에서 항산화 및 항노화 연구를 진행하였다. SJGH는 사람 섬유아세포에서 고농도의 과산화수소에 의한 세포사멸과 세포 내 산화 증가를 효과적으로 방어하였다. 또한 SJGH는 저농도의 과산화수소에 의한 섬유아세포의 SA-${\beta}$-Gal 발현과 MMP-1의 발현 증가를 억제하였고, 반대로 프로콜라겐 I의 생합성은 증가시켰다. 이러한 결과를 통해 SJGH의 항산화 및 항노화 효과가 우수함을 확인하였으며, SJGH가 항노화 화장품의 우수한 소재가 될 수 있음을 보여준다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.65-65
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• 2003

Chemical mechanical polishing (CMP) is one of the most important processes in recent ULSI (Ultra Large Scale Integrated Circuit) manufacturing technology. Recently, ceria slurries with surfactant have recently been used in STI-CMP,[1] became they have high oxide-to-nitride removal selectivity and widen the processing margin The role of the abrasives, however, on the effect of planarization on STI-CMP is not yet clear. In this study, we investigated how the crystal characteristic affects the planarization efficiency of wafer surface with controlling crystallite size and poly crystalline abrasive size independently.

• 반도체디스플레이기술학회지
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• 제3권4호
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• pp.45-49
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• 2004

We examined large particles and filter size effects of Central Chemical Supplying (CCS) system for STI-CMP on Light Point Defects (LPDs) after polishing. As manufacturing process recently gets thinner below 0.1 um line width, it is very important to keep down post-CMP micro-scratch and LPDs in case of STI-CMP. Therefore, we must control the size distribution of large particles in a slurry. With optimization of final filter size, CCS system is one of the solutions for this issue. The oxide and nitride CMP tests were accomplished using nano-ceria slurries made by ourselves. The number of large particles in a slurry and the number of LPDs on the wafer surface after CMP were reduced with decrease of the final filter size. Oxide removal rates slightly changed according to the final filter size, showing the good performance of self-made nano ceria slurries.

• 반도체디스플레이기술학회지
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• 제3권1호
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• pp.15-20
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• 2004

Through shallow trench isolation (STI) chemical mechanical polishing (CMP) tests, we investigated the dependence of pad surface temperature on the abrasive and additive concentrations in ceria slurry under varying pressure using blanket film wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surfaces during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increasing the additive concentration. This difference in temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, meaning the higher friction coefficient.

• 한국세라믹학회지
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• 제36권4호
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• pp.372-379
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• 1999

Hihg-toughened ceria-stabilized tetragonal zirconia ceramics with irregular grain shape and undulated grain boundary was prepared by ceria doping. Irregularity of grain shapes was increased with the amount of doped ceria. But in case of the large amount of doped ceria grain boundary was migrated to the reverse direction of DIGM. Ceria-stabilized zirconia ceramics annealed at 1650$^{\circ}C$ for 2h after twice dippings into cerium nitrate solu-tion of 0.2M and sintering at 1500$^{\circ}C$ for 2h showed the highest grain boundary length with a value of 23.6$\mu\textrm{m}$ Ceria concentration difference between convex and concave sides in irregular grains was observed over 1 mol% but not observed in normal grains, Specimens with normal grain shape showed intergranular fracture mode whereas the specimens with irregular grain shape showed transgranular fracture mode.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.542-542
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• 2008

본 논문에서는 기존에 상용화된 슬러리에 비해 새로운 혼합 연마제 슬러리의 우수성을 입증하고, 최적화 된 공정기술을 연구의 기반으로 활용하고자 Silica slurry에 $CeO_2$ 연마제를 혼합하여, 어떠한 연마 특성을 나타내는지 알아보았고, AFM, EDX, XRD, TEM 분석을 통해 그 가능성을 비교 분석하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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• pp.87-88
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• 2006

To investigate the possibility of ceria abrasive-added slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, two kinds of retreated methods were introduced as follows: First, the characteristics of mixed abrasive slurry (MAS) using $CeO_2$ powder as an abrasive added within diluted silica slurry (DSS) were evaluated to achieve the improvement of removal rates and non-uniformity. Second, the control of pH level due to the dilution of slurry was examined. And then, we have discussed the CMP characteristics as a function of abrasive dispersion time.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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• pp.122-125
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• 2003

We investigated the effect of the abrasive and additive concentrations in Nano ceria slurry on the pad surface temperature under varying pressure through chemical mechanical polishing (CMP) test using blanket wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with increase of the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surface during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increase of the additive concentration. This difference of temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, which means the higher friction coefficient.

• 한국재료학회지
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• 제15권12호
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• pp.818-823
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• 2005

Sub-micron colloidal silica particles coated with nano-sized ceria were prepared by mixing of its silica and cerium salts hydrolysis, and modified by hydrothermal reaction. By using the slurries with and without hydrothermal modification containing above particles, oxide film coated on silicon wafer was polished. The modified slurries had higher polish rate due to increase of ceria fraction to silica through hydrothermal reaction. They revealed higher stability in wide range of pH $2\~10$ than ceria coated silica slurries without its modification.