• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.3
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• pp.712-717
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• 2013

In this paper, we propose a performance-enhanced object recognition by using nonlinear 3D correlator based on pixel restoration. In the proposed method, elemental images of the 3D target that are partially occluded by a foreground object are picked up and transformed into sub-images. By using the block-matching algorithm, the occluded target regions of each sub-image are estimated and removed. After that, the missing pixels in each sub-image are reestablished by using the pixel-restoration method. Finally, through the nonlinear cross-correlations between the reconstructed reference and the target plane images, the improved object recognition can be performed. To show the feasibility of the proposed method, some preliminary experiments are carried out and results are presented by comparing the conventional method.

• Proceedings of KOSOMES biannual meeting
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• 2005.11a
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• pp.197-202
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• 2005

Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection using subpixel edge detection method in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.12
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• pp.1039-1047
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• 2015

Contact type sensors (e.g., displacement sensor and strain gauge) were typically used to evaluate the safety and mechanical properties in machines and construction. However, those contact type sensors have been constrained because of measurement problems such as surface roughness, temperature, humidity, and shape. The Digital Image Correlation (DIC) measurement system is a vision measurement system. This measurement system uses the taken image using a CCD camera and calculates the image correlation between the reference image and the deformed image under external force to measure the displacement and strain rates. In this paper, we discuss methods to improve the measurement precision of the digital image correlation measurement system. A tensile test was conducted to compare the precision improvement effects, by using the universal test machine and the DIC measurement system, with the use of subpixel algorithms, i.e., the Coarse Fine Search (CFS) algorithm and the Peak Finding (PF) algorithm.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.4
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• pp.793-799
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• 2007

Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm, because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection with subpixel edge detection in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.135-136
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• 2015

일반적으로 머신비전을 이용한 위치 추정 정밀도는 카메라의 화소 수에 비례한다. 머신비전 카메라의 경우 화소가 많을수록 카메라 가격이 크게 증가하므로 화소 수만을 늘려서 정밀도를 높이는 하드웨어적 방법은 활용이 제한적이다. 이런 문제를 해결하기 위해서 적은 화소 수로 높은 위치 추정 정밀도를 얻을 수 있는 다양한 소프트웨어 알고리즘에 대한 연구가 진행되어 왔다. 본 논문에서는 위치 추정 정밀도를 높이기 위한 서브 픽셀 위치 추정 알고리즘을 구현하고 이를 반도체 칩 검사용 고정밀 스테이지에 적용하였다.

• Proceedings of the Optical Society of Korea Conference
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• 2000.08a
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• pp.46-47
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• 2000

본 논문에서는 적응광학시스템$^{(1)}$ 의 성능 향상에 필수적인 파면왜곡의 기울기 정보를 고속으로 측정하기 위한 중심점 추출 알고리즘을 제안하였다. 본 논문에서는 컴퓨터 내부의 영상처리전용보드와 CCD카메라를 이용하여 하트만 센싱 점 영상을 획득하였고, 획득한 하트만 센싱 점 영상에 대해 제안한 중심점 추출 알고리즘을 적용하여 서브픽셀 분해능으로 X축과 Y축의 기울기 정보를 고속으로 추출하였다. CCD센서에 촬상되는 하트만 센싱 점영상에서 각각의 점 영상은 중심점으로부터 대칭형으로 강도가 분포되어 있다고 가정할 수 있으나 전체 점영상의 각 점을 분석한 결과 비대칭적으로 예외적인 강도 분포를 갖는 점영상도 일부 발견되었다. 파면 왜곡이 없는 하트만 센싱 점영상으로부터 X, Y축 파면 왜곡 기울기 값을 추출한 결과 CCD 센서 픽셀의 기저 노이즈가 큰 불안정한 영역에서 기울기 값이 반복적으로 크게 추출되어 파면왜곡보정 시스템의 보정 성능을 떨어뜨리는 효과가 나타났다. (중략)

• Journal of Korea Game Society
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• v.20 no.3
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• pp.65-74
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• 2020

In the shadow map method, if the shadow map is magnified, the shadow has a jagged silhouette. Herein, we propose a soft shadow method that filters reshaped silhouettes analytically. First, the shadow silhouette is reshaped through sub-texel edge detection, which is based on linear or quadratic curve models. Second, an integral shadow filtering algorithm is used to accurately obtain the average shadow intensity from a definite integral estimation. The implementation demonstrates that our solution can effectively eliminate jagged aliasing and efficiently generate soft shadows.

• KIPS Transactions on Software and Data Engineering
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• v.12 no.3
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• pp.141-148
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• 2023

Accurate overlay metrology is essential to achieve high yields of semiconductor products. Overlay metrology performance is greatly affected by overlay target design and measurement method. Therefore, in order to improve the performance of the overlay target, measurement methods applicable to various targets are required. In this study, we propose a new algorithm that can measure image-based overlay. The proposed measurement algorithm can estimate the sub-pixel position by using a motion vector. The motion vector may estimate the position of the sub-pixel unit by applying a quadratic equation model through polynomial expansion using pixels in the selected region. The measurement method using the motion vector can calculate the stacking error in all directions at once, unlike the existing correlation coefficient-based measurement method that calculates the stacking error on the X-axis and the Y-axis, respectively. Therefore, more accurate overlay measurement is possible by reflecting the relationship between the X-axis and the Y-axis. However, since the amount of computation is increased compared to the existing correlation coefficient-based algorithm, more computation time may be required. The purpose of this study is not to present an algorithm improved over the existing method, but to suggest a direction for a new measurement method. Through the experimental results, it was confirmed that measurement results similar to those of the existing method could be obtained.

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.365-366
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• 2007

본 워터마크를 삽입 할 수 있는 임베디드 시스템을 구현 하였다. 워터마크 삽입을 위해 DWT와 Data Matrix가 사용되었다. DWT(Discrete Wavelet Transform)는 주파수 공간에서 워터마크를 삽입하기 위해 사용되었고, Data Matrix는 워터마크로 사용되었다. 데이터 매트릭스는 미국의 Data Matrix사가 만든 이차원 바코드로 오류검출 및 복원 알고리즘을 가지고 있어 작은 에러는 복원이 가능하다. 시스템으로는 PDA를 사용하였고, 틀로는 EVC를 사용하였다. 삽입 알고리즘은 다음과 같다. DWT를 한 경우 4개의 서브밴드로 나누어지며, 그 중 cV(horizontal detail)와 cH(vertical detail)를 선택하여 4*4블록 단위로 나눈다. 나누어진 블록과 대응하는 워터마크의 픽셀 값에 의해 계수에 일정 값(가중치)을 더하거나 때주어 워터마크를 삽입한다. 추출 알고리즘은 역으로 이루어진다. 성능평가는 PDA에서 워터마크 삽입 알고리즘을 통하여 워터마크를 삽입, 추출된 영상을 가지고 Matlap을 이용하여 평가하였다.

• Journal of the Korean Institute of Intelligent Systems
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• v.17 no.1
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• pp.94-99
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• 2007

In this paper, a 2-dimensional edge-based matching algorithm is proposed that combines the generalized Hough transform (GHT) and the Chamfer matching to complement weakness of either method. First, the GHT is used to find approximate object positions and orientations, and then these positions and orientations are used as starling parameter values to find more accurate position and orientation using the Chamfer matching. Finally, matching accuracy is further refined by using a subpixel algorithm. The algorithm was implemented and successfully tested on a number of images containing various electronic components.