• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.4
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• pp.155-159
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• 2004

Numerical analysis which is based on finite element techniques, implicit Euler method and frontal solving algorithm was performed to study the effects of the crucible shape on the temperature of sapphire crystal and the shape of the melt/crystal interface in heat exchanger method. The computer simulation described here and effective to solving the heat transport phenomena with the transition of the interface shape from hemispherical to planar. In the work, various crucibles with differently shaped corners at their bottom are considered to improve the deflection of the melt/crystal interface. The shape of the crucible should be considered as one of the variables for the process optimization.

• Journal of Applied Reliability
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• v.14 no.1
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• pp.11-19
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• 2014

A colloidal silica slurry has been manufactured by mixing nano silica powders having different grain size to improve the reliability of Sapphire wafer CMP process. The main reliability problem of CMP process such as the breaking of wafer can be prevented by reducing the size of particles in a slurry. While existing commercial colloidal silica slurries are usually made of single grain size silica powder of about 120nm, in the present study 40nm and 100nm silica powders are mixed to achieve a similar removal rate. The new colloidal silica slurry showed wafer removal rate of $3.04{\mu}m/120min$ while that of a commercial colloidal silica slurry was $3.03{\mu}m/120min$. The roughness was less than $4{\AA}$ and scratch was 0. It is also expected that the reduction of the size of nano silica particles can improve the dispersion stability and prolong the useful life of the slurry.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.185.1-185.1
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• 2015

본 연구에서는 라디오파 마그네트론 스퍼터링 방법을 사용하여 증착 온도를 변화시켜면서 Eu 이온이 도핑된 MgMoO4 적색 형광체 박막을 사파이어 기판 상부에 성장하였다. 타겟은 고상반응법을 사용하여 직접 제작하였다. 형광체 박막의 구조, 표면, 광학적 특성은 X-선 회절장치, 주사전자현미경, 투과도 및 광여기발광 측정장치를 사용하여 측정하였다, 증착 온도는 100, 200, 300, $400^{\circ}C$이었으며, 증착 후 $870^{\circ}C$에서 열처리 공정을 실행하였다. 이와 더불어, $400^{\circ}C$에서 증착한 박막을 다양한 온도 $770-920^{\circ}C$에서 열처리를 수행하여 각각의 특성을 분석하였다. 증착 온도 $200^{\circ}C$에서 성장한 박막의 경우에 614 nm에 피크를 갖는 주 적색 발광 피크가 관측되었으며, 열처리 온도를 달리한 박막의 경우에는 $920^{\circ}C$에서 가장 강한 발광 피크가 나타났다. UV-VIS 분광광도계를 사용하여 박막의 투과도와 흡광도를 측정하였으며, Tauc의 모델을 사용하여 밴드갭 에너지를 계산하였다. 증착 온도 변화에 따라 성장된 박막의 투과도는 평균 82% 이상 이었으며 밴드갭 에너지는 4.1 eV이었다. 박막의 결정 구조는 단사정계임을 확인하였다. 특히, 결정 입자, 발광 피크의 세기와 투과도의 상관 관계를 조사하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.253-254
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• 2009

본 연구는 다결정 알루미나 소결체와 사파이어웨이퍼(sapphire wafer)의 견고한 접합을 위해 활성금속 Ti가 함유된 Active Filler Metal을 사용하였고, 이를 브레이징한 후 접합 반응층과 Ti 거동 특성에 관한 것이다. 브레이징 (brazing)은 Ar 분위기 종에 $850^{\circ}C$에서 이행하였으며. 이때 다결정 알루미나, 사파이어와 Active Filler Metal 사이의 접합 반응층을 확인하였다. Active Filler Metal 내어| 존재하는 Ti가 접할 반응층의 양계면에 집중되는 것을 SEM을 이용하여 확인하였다. 또한 EDS Line Scanning을 실시하여 접합부에서 원소들의 분포를 관찰하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.6
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• pp.104-110
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• 2015

LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.37.1-37.1
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• 2011

1990년 나카무라 연구팀에서 청색이 개발된 이래로 LED는 눈부시게 발전해 왔으며, 청색 LED로 인하여 조명용 백색 LED가 급격히 발전하고 있다. 현재까지 개발되고 있는 조명용 백색 LED는 통상적으로 c축 방향의 사파이어 기판위에 GaN film을 성장하여 제작하지만 원천적으로 생기는 자발분극과 압전분극 영향 때문에 양자우물에서의 밴드를 기울게 만들고 이것은 캐리어 재결합율을 감소시켜 그 결과 양자 효율을 낮춘다. 이러한 근본적인 문제를 해결하기 방안은 사파이어 기판에서 c-plane이외의 결정면에서 무분극(혹은 반극성) GaN LED를 성장하여 양자효율을 극대화하여 고효율 LED를 구현할 수 있음. 본 연구에서는 Carbonization mask를 이용하여 r-plane sapphire기판상에 a-plane GaN의 ELOG성장 방법에 대하여 연구하였다. Carbonization mask를 이용하면 기존에 사용되던 SiOx 나 SiNx 막을 사용하지 않고 mask를 만들 수 있다는 장점을 가지고 있으며, 이러한 mask를 이용하여 r-plane sapphire위에 ELOG법을 이용한 a-plane GaN을 성장할 수 있음을 실험을 통해 보이려 한다. ELOG 성장이 이루어 지는지 확인을 위하여 SEM을 통하여 ELOG가 되는 과정을 분석하였으며, 표면의 거칠기를 알아보기 위하여 AFM측정을 시행하였다. 실험 결과 약 20 um 두께로 성장되면서 merge가 되는 것을 확인 하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.2
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• pp.102-107
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• 2017

This study focuses on the effect of the elasticity modulus of jig material on blade edge shape in the grinding process of a sapphire medical knife. The ELID grinding process was applied as the edge-grinding method for sapphire material. Carbon steel and copper have been selected as the hard and soft jig materials, respectively. The blade edge created by ELID grinding was measured by a surface roughness tester and optical microscope. The shape of the ground edge and surface roughness were compared using the measurement results. As a result, it was found that chipping in the blade edge of the sapphire knife occurred more than in the case of jig material with a high-elasticity modulus because of the high normal force in the grinding process. Moreover, the maximum height surface roughness, $R_{max}$,of the ground surface was higher in the case of the jig material with a high-elasticity modulus due to the difference in elasticelongation. It was considered to lead to chipping from the notch effect.

• Journal of the Korean Vacuum Society
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• v.6 no.4
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• pp.354-358
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• 1997

Crystal properties of wurtzite GaN films grown on $Al_2O_3$(0001) substrates under various nitrogen pressure and plasma power by electron cyclotron resonance molecular beam epitaxy were investigated by full width at half maximum of X-ray diffraction peak and scanning electron microscope. It was found that the nitrogen pressure has a large effect on the FWHM value of XRD, and the GaN film grown under the optimum nitrogen pressure contains high density of dislocations. These results suggest that the crystal quality is sensitive to the plasma source conditions and that the relaxation of stress depends of V/III ratio. However, substrate-surface nitridation has little effect on the relaxation of misfit stress.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.3
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• pp.247-252
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• 2012

This study has been focused on application of ELID mirror-surface grinding technology for manufacturing single crystal optic sapphire. Single crystal sapphire is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. Mirror-surface machining technology is necessary to use sapphire as optic parts. The ELID grinding system has been set up for machining of the sapphire material. According to the ELID experimental results, it shows that the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.155-159
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• 2000

YBCO step-edge dc SQUID magnetometers on sapphire substrates have been fabricated. CeO2 buffer layer and YBCO films were deposited in situ on the low angle (${\sim}$35$^{\circ}$) steps formed on the sapphire substrates. Typical 5-${\mu}$m-wide junction has R$_n$ of 5 ${\omega}$ and I$_c$ of 50 ${\mu}$A with large I$_c$R$_n$ product of 250 ${\mu}$V at 77K. According to applied bias current, depth of voltage modulation was changed and maximum voltage was measured 16 ${\mu}$V. Field noise of do SQUID was measured 100${\sim}$300 fT/${\surd}^{Hz}$ in the 1 $^{kHz}$, and about 1.5 pT/${\surd}^{Hz}$ in the 1/f region. For ac bias reversal method, field noise was decreased in the 1/f region. The QRS peak of magnetocardiogram was measured 50 pT in the magnetically shielded room.