• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.12
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• pp.1627-1633
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• 2011

Injection molds are generally fabricated by assembling a number of plates in which the core and cavity components are assembled. This assembled structure has a number of contact interfaces where the heat transfer characteristics are affected by thermal contact resistance. In previous studies, numerical approaches were investigated to predict the effect of thermal contact resistance on the temperature distribution of injection molds. In this study, thermal-fluid coupled numerical analyses are performed to take into account the thermal contact effect on the numerical evaluation of the mold filling characteristics. Comparisons with experimental results show that the proposed coupled analysis provides more reliable results than the conventional analyses in predicting the mold filling characteristics by taking into account the effect of thermal contact resistance inside the injection mold assembly.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.5
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• pp.575-582
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• 2010

In recent years, several rapid-mold-heating techniques that can be used for the injection molding of thin-walled parts or micro/nano structures have been developed. High-frequency induction heating, which involves heating by electromagnetic induction, is an efficient method for the rapid heating of mold surfaces. The present study proposes an integrated numerical model of the high-frequency induction heating process and the resulting injection molding process. To take into account the effects of thermal boundary conditions in induction heating, we carry out a fully integrated numerical analysis that combines electromagnetic field calculation, heat transfer analysis, and injection molding simulation. The proposed integrated simulation is extended to the injection molding of a thin-wall part, and the simulation results are compared with the experimental findings. The validity of the proposed simulation is discussed according to the ways of the boundary condition imposition.

• Journal of the KSME
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• v.51 no.4
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• pp.45-49
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• 2011

이 글에서는 플라스틱 사출 성형에 있어 금형 표면온도와 응용 수지의 온도 차이로 필연적으로 발생되는 표면 결함, 미성형 등의 다양한 사출 성형 문제를 해결하기 위해 사출 사이클에 맞추어 금형 표면 온도의 급가열-급냉각을 제어할 수 있는 E-Mold 시스템에 대해 실제 양산 적용사례를 중심으로 소개하고자 한다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1513-1519
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• 2010

Recently, on-line process monitoring systems using sensors are being extensively used to produce highquality products. However, the difficulty in installing the sensors within the mold in the cases of micro-molds, optical molds, and molds with complex structures is a serious disadvantage of such process monitoring systems. In this study, the quantitative index of a process monitoring system was evaluated with the mold cavity pressure and the nozzle pressure for the injection molding machine. In order to evaluate the effect of the nozzle pressure, we performed correlation analysis for the weight of the molded product. We also examined the control characteristics of the injection molding machine by analyzing the effect of multistage injection speed, holding pressure, and injection pressure limit on the process monitoring data.

• Proceedings of the KAIS Fall Conference
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• 2008.11a
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• pp.371-374
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• 2008

본 연구에서는 무도장 Weldless 평가금형을 이용하여 사출성형 공정조건에 따라 다양한 형태의 변형이 생기는 성형품을 CAE를 통하여 ABS와 PC의 사출조건 냉각시간, 보압의 유/무 등에 따라서 발생되는 문제점과 변형량을 예측하고, 실제 사출성형 되어진 성형품과의 비교 분석을 통하여 사출성형 CAE 해석을 실제 사출성형 공정에서의 활용방안에 대하여 검토하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.7
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• pp.771-777
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• 2014

Injection-compression molding was used for film insert molding of an automotive door grip using films with three-dimensional embossed patterns. A vacuum mold was fabricated for vacuum-assisted thermoforming of the film, and an injection-compression mold was developed for film insert molding. Three pressure transducers were installed inside the mold cavity to measure cavity pressures. Injection-compression molding experiments under various compression strokes and toggle speeds were performed to investigate their effects on the cavity pressure and heights of the embossed patterns. The compression stroke of 0.9mm and low toggle speed resulted in a higher degree of conservation of embossed patterns. Additionally, the processing conditions for the maximum heights of embossed patterns were almost similar to those for minimum integral value of cavity pressures. The injection-compression molding process presents the opportunity to impart a soft-touch feeling of plastic parts printed with embossed patterns.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.69-73
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• 2008

본 연구에서는 고분자 플라스틱 부품의 친환경 외장성형공법인 Insert Film 사출성형공법중 첫 번째 공정인 진공성형공정에서 진공금형의 표면온도 균일화 기술에 대해 연구를 수행하였다. 진공금형의 온도분포 균일화를 위한 금형설계 및 설계된 금형에 대한 온도분포 평가를 위한 ANSYS를 이용한 유한요소열해석을 수행하였으며, 이때 정상상태 및 과도상태를 함께 평가하였다. 설계 결과를 바탕으로 금형을 제작하였으며, 생산성을 고려하여 4캐비티로 제작된 금형에 대해 금형표면의 온도분포 평가실험을 수행하였다. 또한 금형내 캐비티 온도센서 및 제어시스템을 설치하여 진공금형표면 온도분포가 항상 일정하게 유지될 수 있도록 금형시스템을 개발하였다. 결과적으로 일정한 온도범위의 금형표면온도제어가 가능하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.445-446
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• 2007

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.9
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• pp.893-899
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• 2015

In the design of injection molds, the temperature distribution and deformation of the mold is one of the most important parameters that affect the flow characteristics, flash generation, and surface appearance, etc. Plastic injection analyses have been carried out to predict the temperature distribution of the mold and the pressure distribution on the cavity surface. As the input loads, we transfer the temperature and pressure results to the structural analysis. We compare the structural analysis results with the thermal expansion effect using the actual flash and step size of a smartphone cover part. To reduce the flash problem, we proposed a new mold design, and verified the results by performing simulations.

• Proceedings of the KAIS Fall Conference
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• 2002.05a
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• pp.147-150
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• 2002

사출성형 공정의 컴퓨터 시뮬레이션(CAE)은 짧은 시간에 저 비용으로 여러 설계 및 재료와 공정조건의 조합을 시험할 수 있는 수단이다. 실제 금형을 가공하고 시제품을 생산하기 전에 미리 해석을 수행하여 봄으로써 설계의 오류 및 부적절한 공정조건의 설정을 방지할 수 있다. 컴퓨터 시뮬레이션은 공정조건에 의한 사출성형을 가능하게 해 준다. 즉, 수지의 거동, 냉각과정, 압력거동 등을 컴퓨터 화면을 통해 볼 수 있으며 이를 기초한 성형품의 예상문제점을 파악할 수 있다. 본 논문에서는 CAE기술을 응용한 Back Light Panel의 설계에 대해 논의하고자 한다.