• Title/Summary/Keyword: 빔형성

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Monitoring of Bathymetry Changes in the Coastal Area of Dokdo, East Sea (동해 독도 연안 해저지형 변동 모니터링 연구)

  • Chang Hwan Kim;Soon Young Choi;Won Hyuck Kim;Hyun Ok Choi;Chan Hong Park;Yun Bae Kim;Jong Dae Do
    • Economic and Environmental Geology
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    • v.56 no.5
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    • pp.589-601
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    • 2023
  • We compare high-resolution seabed bathymetry data and seafloor backscattering data acquired, using multi-beam, between 2018 and 2021 to understand topographic changes in the coastal area of Dokdo. The study area, conducted within a 500 m × 500 m in the southern coast between the islands where Dongdo Port is located, has been greatly affected by human activities, waves and ocean currents. The depth variations exhibit between 5 - 70 m. Irregular underwater rocks are distributed in areas with a depth of 20 m or less and 30 - 40 m. As a whole, water depth ranges similar in the east-west direction and become flatter and deeper. The bathymetry contour in 2020 tends to move south as a whole compared to 2018 and 2019. The south moving of the contours in the survey area indicates that the water depth is shallower than before. Since the area where the change in the depth occurred is mainly formed of sedimentary layers, the change in the coast of Dokdo were mainly caused by the inflow of sediments, due to the influence of wind and waves caused by these typhoons (Maysak and Haishen) in 2020. In the Talus area, which developed on the shallow coast between Dongdo and Seodo, the bathymetry changed in 2020 due to erosion or sedimentation, compared to the bathymetry in 2019 and 2018. It is inferred that the changes in the seabed environment occur as the coastal area is directly affected by the typhoons. Due to the influence of the typhoons with strong southerly winds, there was a large amount of sediment inflow, and the overall tendency of the changes was to be deposited. The contours in 2021 appears to have shifted mainly northward, compared to 2020, meaning the area has eroded more than 2020. In 2020, sediments were mainly moved northward and deposited on the coast of Dokdo by the successive typhoons. On the contrary, the coast of Dokdo was eroded as these sediments moved south again in 2021. Dokdo has been largely affected by the north wind in winter, so sediments mainly move southward. But it is understood that sediments move northward when affected by strong typhoons. Such continuous coastal change monitoring and analysis results will be used as important data for longterm conservation policies in relation to topographical changes in Dokdo.

Effects of Fiber Surface Modification on the Flow Characteristics and Wettability in the Resin Transfer Molding Process (섬유의 표면개질이 수지이동 성형공정에서의 유동특성 및 젖음성에 미치는 영향)

  • 김세현;이건웅;이종훈;김성우;이기준
    • The Korean Journal of Rheology
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    • v.11 no.1
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    • pp.34-43
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    • 1999
  • Flow-induced voids during resin impregnation and poor fiber wetting have known to be highly detrimental to the performance of composite parts manufactured by resin transfer molding(RTM) process. In this study, in order to overcome these serious problems encountered in RTM, the effects of surface modification by using silane coupling agent as a surface modifier on the flow characteristics, the wetting between resin and fiber, and void content were investigated. For the experiments of microscopic flow visualization and curing in a beam mold, glass fiber mats having plain weaving structure and epoxy resin were used. Modifying the fiber surface was found to result in a significant decrease of dynamic contact angle between resin and fiber and increase of wicking rate. Therefore, it was confirmed that the surface modification employed in this study could improve the wettability of reinforcing fibers as well as micro flow behavior. In addition, It was revealed that high temperature and low penetration rate of the resin are more favorable processing conditions to reduce the dynamic contact angle. However, surface modified fiber mat was found to have lower permeability than the unmodified one, which may be explained in terms of the decrease of contact time between resin and fiber owing to improvement of wetting. It was also exhibited that surface modification had a significant influence on void formation in RTM process, resulting in a decrease of overall void content due to the improvement of wetting in cured composite parts.

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Characteristics of Plasma Discharge according to the Gas-flow Rate in the Atmospheric Plasma Jets (대기압 플라즈마 제트의 기체 유량에 대한 방전 특성)

  • Lee, Won Young;Jin, Dong Jun;Kim, Yun Jung;Han, Gook Hee;Yu, Hong Keun;Kim, Hyun Chul;Jin, Se Whan;Koo, Je Huan;Kim, Do Young;Cho, Guangsup
    • Journal of the Korean Vacuum Society
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    • v.22 no.3
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    • pp.111-118
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    • 2013
  • The influence of gas flow on the plasma generation in the atmospheric plasma jet is described with the theory of hydrodynamics. The plasma discharge is affected by the gas-flow streams with Reynolds number (Re) as well as the gas pressure with Bernoulli's theorem according to the gas flow rate inserted into the glass tube. The length of plasma column is varied with the flow types such as the laminar flow of Re<2,000 and the turbulent flow of Re>4,000 as it has been known in a general fluid experiments. In the laminar flow, the plasma column length is increased as the increase of flow rate. Since the pressure in the glass tube becomes low as the increase of flow velocity by the Bernoulli's theorem, the breakdown voltage of plasma discharge is reduced by the Paschen's law. Therefore, the plasma length is increased as the increasing flow rate with the fixed operation voltage. In the transition of laminar and turbulent flows, the plasma length is decreased. When the flow becomes turbulent as the flow rate is increasing, the plasma length becomes short and the discharge is shut down ultimately. In the discharge of laminar flow, the diameter of plasma beam exposed on the substrate surface is kept less than the glass diameter, since the gas flow is kept to the distinct distance from the nozzle of glass tube.

Improvement of Adhesion Between metal and Polymer by Ion Assisted Reaction (IAR) (이온 보조 반응법을 이용한 금속과 고분자의 접착력 향상)

  • 최성창;김현주;고석근
    • Journal of the Korean Vacuum Society
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    • v.7 no.3
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    • pp.221-228
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    • 1998
  • Enhancement of adhesion between polymer films and metal films are obtained by forming the hydrophilic functional groups on the polymer surfaces by ion assisted reaction which uses ion beam in reactive gas environments. In ion assisted reaction, ion dose, blown gas flow rate and ion energy were changed from $5\times 10^{14}$ to $1\times 10^{17}\textrm{ions/cm}^2$, from 0 to 8 sccm, and 0.3 to 1.2 kV, respectively. Wetting angle of water on polymer films modified by $ Ar^+$ ion without blowing oxygen decreases to ~$40^{\circ}$. Contact angle of water on polymer films modified by $ Ar^+$ ion with blowing oxygen decreases to ~$20^{\circ}$, and the surface free energy increases to ~70 dyne/$\textrm{cm}^2$. However, contact angle of water on polytetraflouroethylene (PTFE) modified by ion assisted reaction increases with ion dose. The adhesion strength of metal film deposited on the polymer surface was investigated. In the case of the metal film deposited on the untreated polymers, the metal films are detached from the polymer surface. While, In the case of the metal film deposited on the polymers treated by ion assisted reaction, the metal films are strongly adhere to the polymer surfaces.

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A study on the fabrication of heatable glass using conductive metal thin film on Low-e glass (로이유리의 전도성 금속박막을 이용한 발열유리 제작에 관한 연구)

  • Oh, Chaegon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.1
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    • pp.105-112
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    • 2018
  • This paper proposes a method for fabricating heatable glass using the conduction characteristics of metal thin films deposited on the surface of Low-e(Low emissivity) glass. The heating value of Low-e glass depends on the Joule heat caused by Low-e glass sheet resistance. Hence, its prediction and design are possible by measuring the sheet resistance of the material. In this study, silver electrodes were placed at 50 mm intervals on a soft Low-e glass sample with a low emissivity layer of 11 nm. This study measured the sheet resistance using a 4-point probe, predicted the power consumption and heating value of the Low-e glass, and confirmed the heating performance through fabrication and experience. There are two conventional methods for manufacturing heatable glass. One is a method of inserting nichrome heating wire into normal glass, and the other is a method of depositing a conductive transparent thin film on normal glass. The method of inserting nichrome heating wire is excellent in terms of the heating performance, but it damages the transparency of the glass. The method for depositing a conductive transparent thin film is good in terms of transparency, but its practicality is low because of its complicated process. This paper proposes a method for manufacturing heatable glass with the desired heating performance using Low-e glass, which is used mainly to improve the insulation performance of a building. That is by emitting a laser beam to the conductive metal film coated on the entire surface of the Low-e glass. The proposed method is superior in terms of transparency to the conventional method of inserting nichrome heating wire, and the manufacturing process is simpler than the method of depositing a conductive transparent thin film. In addition, the heat characteristics were compared according to the patterning of the surface thin film of the Low-e glass by an emitting laser and the laser output conditions suitable for Low-e glass.

Improvement of the Adhesion Properties between Aluminum and a Parylene-C Film by Using the Duoplasmatron Ion Source (Duoplasmatron Ion Source를 이용한 Parylene과 Al의 접착력 향상에 관한 연구)

  • Choi, Sung-Chang
    • Journal of the Korean Vacuum Society
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    • v.21 no.2
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    • pp.78-85
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    • 2012
  • In order to improve the adhesion between poly-monochloro-para-xylylene (Parylene-C) film and Aluminum thin film, the surface of Parylene-C film was irradiated by ${O_2}^+$ and $Ar^+$ ion beam generated by duoplamatron ion source. The ion dose of $Ar^+$ and ${O_2}^+$ was changed from $5{\times}10^{14}$ to $1{\times}10^{17}/cm^2$ and the ion beam energy was 1 kV. Contact angles of water on Parylene-C modified by $Ar^+$ and ${O_2}^+$ ion irradiation decreased from $78^{\circ}$ to around $17^{\circ}$, and $9^{\circ}$, respectively. X-ray photoelectron spectroscopy analysis shows that the hydrophilic groups were formed on the surface of Parylene-C by chemical reaction between the unstable chains induced by the ion irradiation and oxygen ions or residual oxygen gas. The hydrophilic groups were identified as C-O bond, C=O bond and (C=O)-O bond. The cross cut tape test which was applied to characterize the adhesion between Al thin film and Parylene-C film modified by ${O_2}^+$ ions irradiation shows that the adhesion strength was improved as increasing ion dose.

An Efficient Symbol Timing Synchronization Scheme for IEEE 802.11n MIMO-OFDM based WLAN Systems (IEEE 802.11n MIMO-OFDM 기반 무선 LAN 시스템을 위한 효율적인 심볼 동기 방법)

  • Cho, Mi-Suk;Jung, Yun-Ho;Kim, Jae-Seok
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.46 no.5
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    • pp.95-103
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    • 2009
  • An efficient symbol time synchronization scheme for IEEE 802.11n MIMO-OFDM based WLAN systems using cyclic shift diversity (CSD) preamble is proposed. CSD is used to prevent unintentional beamforming when the same preamble signal is transmitted through transmit antennas. However, it is difficult to find a proper starting-point of the OFDM symbol with the conventional algorithms because of time offset by multi-peaks which are result from cross-correlation of received CSD preamble with a known short training symbol. In addition, the performance of symbol time sync. is affected by AGC and packet detection position. In this paper, an optimal symbol time synch. algorithm which is composed of the boundary detection scheme between LTS and OFDM symbols, the verification scheme for enhancement of boundary detection accuracy, and the SNR-varying threshold estimation scheme is proposed. Simulation result show that the proposed algorithm has performance gains of 4.3dB in SNR compared to the conventional algorithms at the rate of 1% sync. failure probability for $2{\times}2$ MIMO-OFDM system and 18dB at 0.1% when maximum frequency offset exists. It also can be applied to $4{\times}4$ MIMO-OFDM system without any modification. Hence, it is very suitable for MIMO-OFDM WLAN systems using CSD preamble.

The Fabrication and Evaluation of HgI2 Semiconductor Detector as High Energy X-ray Dosimeter Application (고에너지 X선 선량계 적용을 위한 TiO2 첨가된 요오드화수은 반도체 검출기 제작 및 평가)

  • Choi, Il Hong;Noh, Sung Jin;Park, Jung Eun;Park, Ji Koon;Kang, Sang Sik
    • Journal of the Korean Society of Radiology
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    • v.8 no.7
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    • pp.383-387
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    • 2014
  • In this paper, for a new detection system development with the better accurate dose evaluation and beam distribution imaging using the small field irradiation of linear accelerator, the compound semiconductor based detection sensors were fabricated and the performance evaluation was investigated. The special particle-in-binder sedimentation was used for a large area film sensor fabrication. The detection properties for high energy x-rays were investigated from a dark current, an output current, a rising time, a falling time, and response delay measurement. The experimental results, the $TiO_2$ mixed $HgI_2$ sensor showed the best electrical characteristics than $PbI_2$, PbO, pure $HgI_2$. Linearity, repeatability, and accuracy tests from LINAC were tested, the $TiO_2$ mixed $HgI_2$ sensor showed the better performance than the commercially available dosimetry devices.

Hidden Object Detection System using Parametric Array (파라메트릭 배열을 이용한 은폐 물체 탐지 시스템)

  • Lee, Kibae;Lee, Jaeil;Bae, Jinho;Lee, Chong Hyun;Cho, Jung Hong
    • Journal of the Institute of Electronics and Information Engineers
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    • v.54 no.3
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    • pp.78-86
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    • 2017
  • In this paper, we propose hidden object detection system using parametric array based on acoustic signal that is harmless to human body. A transmit signal of the proposed detection system uses a high directive chirp signal generated from parametric array phenomenon, which uses technique to improve a signal to noise (SNR) of a received signal and a distance resolution trough the dechirp processing. The transmit sensor array is constructed as $8{\times}2$ and has a horizontal beam width of $7^{\circ}$ and vertical beam width of $26^{\circ}$. To verify the detection and visualization of the proposed system, a 2-axis driving control system based on linear stage was constructed, and A-scan, B-scan, and C-scan experiments was addressed for hidden object. From experimental results, we detected and visualized the hidden bronze plate and pipe by cloth and the visualized shapes was confirmed. Especially, the obtained errors was $0.015m^2$ for bronze plate, and $0.046m^2$ for pipe.

Flip Chip Solder Joint Reliability of Sn-3.5Ag Solder Using Ultrasonic Bonding - Study of the interface between Si-wafer and Sn-3.5Ag solder (초음파를 이용한 Sn-3.5Ag 플립칩 접합부의 신뢰성 평가 - Si웨이퍼와 Sn-3.5Ag 솔더의 접합 계면 특성 연구)

  • Kim Jung-Mo;Kim Sook-Hwan;Jung Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.1 s.38
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    • pp.23-29
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    • 2006
  • Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

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