• Title/Summary/Keyword: 비접촉 측정기

Search Result 43, Processing Time 0.032 seconds

LASER를 이용한 비접촉식 외경측정기

  • 권영중;이상훈
    • 전기의세계
    • /
    • v.37 no.7
    • /
    • pp.64-70
    • /
    • 1988
  • 본고에서는 대한전선 기술연구소에서 개발되어 양산되고 있는 비접촉식 외경 측정기인 LASER MICROTEK X8700을 중심으로 비접촉식 외경 측정기의 특징, 측정원리, 구성, 광학계의 이론, 오차요인등에 관해서 논하기로 하겠습니다.

  • PDF

3차원 측정기의 현상과 문제점

  • 정석주
    • Journal of the KSME
    • /
    • v.32 no.2
    • /
    • pp.184-193
    • /
    • 1992
  • 현재의 3차원 측정기 중에서 CNC 3차원 측정기, 3차원 측정기의 데이터 처리장치 및 측정용 센서에 대해서 알아보았다 3차원 측정기는 공작기계와 많은 관계가 있지만 로봇, CAD/CAM 과도 밀접한 관계를 지니고 있다. 또한 3차원 측정기는 센서와도 밀접한 관계가 있다. 앞으로 더욱 바람직한 것은 3차원 형상의 고속연속측정이 가능하게 하는 것, 접촉점의 위치좌표가 고 정도로 구해지는 것 마찰력을 제거할 수 있는 것, 소형, 경량화 등을 열거할 수 있겠다. 한편, 비접촉 센서로서는 광학적 방법을 이용한 센서가 많이 개발되어지고 있지만 표면거칠기, 표면 반사율, 경사각 등의 영향을 받기 쉽기 때문에 고정도의 3차원 측정에 있어서 아직 많은 문제가 남아 있다. 앞으로도 이 같은 많은 문제점을 해결할 수 있는 연구가 계속 진전되기를 바란다

  • PDF

Current status and application of Photogrammetry (사진측정기의 동향 및 응용사례)

  • Choi, Jung-Su;Park, Eung-Sik;Kim, Hyung-Wan;Yoon, Yong-Sik
    • Current Industrial and Technological Trends in Aerospace
    • /
    • v.6 no.2
    • /
    • pp.80-89
    • /
    • 2008
  • Photogrammetry is a non-direct 3-dimensional coordinate measurement technique using 2-dimensional photographic images. For reconstruction 3-dimensional data from the 2-dimensional photos, photogrammetry uses the fundamental principle of triangulation. Digital photogrammetry solve for the camera location and coordinates simultaneously through the mapping, scaling and bundle processing in software processing. In this paper, several applications for photogrammetry measurement are introduced, such as 'photogrammetric measurement of the gravity deformation of a cassegrain type antenna', 'analysis of photogrammetry data from ISIM mockup', 'underwater photogrammetric verification of nuclear fuel assemblies', 'spacecraft optical bench measurement' and 'spacecraft ground support equipment measurement'.

  • PDF

The Precision Measurement for Electrical Conductivity of Non-magnetic Materials (비자성체의 전기전도도 정밀측정)

  • Kang, J.H.;Kim, H.J.;Yu, K.M.;Han, S.O.;Kim, J.S.;Park, K.S.
    • Proceedings of the KIEE Conference
    • /
    • 2003.07c
    • /
    • pp.1484-1486
    • /
    • 2003
  • 본 연구는 항공, 선박, 자동차, 철강, 철도, 건설 산업 등에서 필수적으로 사용되고있는 여러 비자성 금속의 전기전도도에 대하여 4단자 측정방법 및 비접촉 측정방법에 의한 정밀측정원리를 적용하여 전기전도도를 측정한 결과 4단자 측정방법의 경우 ${\pm}$0.1 %이하의 표준편차 범위 내에서 안정된 값을 보였고, 그 결과를 비접촉 측정방법(eddy current원리를 활용한 전기전도도 측정기)으로 측정한 결과와 상호 비교하였으며, 두 측정방식에 따른 전기전도도 측정결과는 최대 1.5 %이내에서 일치 하였다.

  • PDF

PLAQUE ADHESION ON THE SURFACES OF VARIOUS COMPOSITE RESIN (수종 복합레진에 대한 치태 부착도 비교)

  • Kim, Young-Jong;Kim, Shin;Jeong, Tae-Sung
    • Journal of the korean academy of Pediatric Dentistry
    • /
    • v.31 no.4
    • /
    • pp.547-554
    • /
    • 2004
  • The surface characteristics of restoration such as surface roughness and droplet contact angle are important part for the process of bacterial adhesion. The purpose of this study is to compare plaque adhesion by measuring roughness, droplet contact angle, and amount of accumulated plaque on the surfaces of composite resins. Four kinds of composite resins, Z-100(Z1), Durafil(DF), Filtek supreme(FS), Clearfil AP X(CA) were used. Ten samples were divided into unpolished and polished group. Surface roughnesses and droplet contact angles were measured by profilometer and goniometer. Plaque weight gains are measured. The results were as follows: 1. The experimental group were rougher than the control group. Surface roughnesses were decreased in the following order; (Z1, DF, CA)>FS in the control group, and CA>Z1>(FS, DF) in the experimental group(P<0.05). 2 The control group showed larger contact angle than the experimental group. Contact angles were decreased in the following order; CA>(FS, DF, Z1) in the control group, and (CA, DF)>(FS, Z1) in the experimental group(P<0.05). 3. The experimental group showed more much plaque than the control group. The amounts of plaque accumulation in vitro were decreased in the following order; Z1>(DF, FS)>CA in the control group, and Z1>FS>(CA, DF) in the experimental group. The latter showed more much plaque than the former(P<0.05). 4. There were stronger correlation between plaque deposition and contact angle (P<0.05) than that of plaque deposition and surface roughness.

  • PDF

Global Market Entry Strategy for Smart Personal Recognition-based Non-contact Thermometer Convergence access Control System (스마트 개인 인식기반 비접촉 체열측정기 융합 출입통제시스템의 글로벌 시장 진출전략)

  • Chung, Jason;Kim, hyung-o
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • 2021.10a
    • /
    • pp.673-675
    • /
    • 2021
  • Biometric technology is a next-generation information security technology that provides reliability and convenience. As a core technology in the post-corona era, then on-contact biometric access control system is capable of non-face-to-face and automated technology, and is active not only in Korea but also in overseas markets such as the United States, Europe, and the Middle East. There are precautions that must be taken to reflect requirements such as cooperation between companies and approval of the US Food and Drug Admin is tration in developing IoT-based smart device customized sensors and securing H/W systems.

  • PDF

Suppression of Microwelding on RF MEMS Direct Contact Switches (직접접촉식 RF MEMS 스위치에서의 미소용접 현상 억제)

  • Lee, Tae-Won;Kim, Seong-Jun;Park, Sang-Hyun;Lee, Ho-Young;Kim, Yong-Hyup
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.33 no.4
    • /
    • pp.41-46
    • /
    • 2005
  • In this paper, a new method for suppressing microwelding on the RF MEMS (Radio Frequency Microelectromechanical System) direct contact switches is introduced. Two kinds of refractory metals, tungsten and molybdenum were coated onto the contact point of the switches and the effect of the coating was examined. The changes in insertion loss and isolation at the switch were measured by using network analyzer and power loss was evaluated by power measurement. The results revealed that while tungsten and molybdenum showed higher contact resistance than gold in low input power range, they enhanced the power handling capability and reliability of the switches in high input power region.