• Title/Summary/Keyword: 부하경감 요구조건

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Experimental Verification of Heat Sink for FPGA Thermal Control (FPGA 열제어용 히트싱크 효과의 실험적 검증)

  • Park, Jin-Han;Kim, Hyeon-Soo;Ko, Hyun-Suk;Jin, Bong-Cheol;Seo, Hak-Keum
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.42 no.9
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    • pp.789-794
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    • 2014
  • The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.

Power Design of an S-Band Transmitter for KSLV-II with Derating (디레이팅을 고려한 한국형발사체 S-밴드 송신기 전원부 설계)

  • Kim, Seokkwon;Kim, Sung-Wan;Hong, Seung Hyun;Kim, Hyo Jong
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.30 no.5
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    • pp.339-347
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    • 2019
  • The power circuit design of an on-board S-band transmitter for KSLV-II with derating(operation of a component at less than its maximum rated specification to enhance reliability) is investigated. The power circuit of the transmitter consists of linear voltage regulators, DC/DC converters for regulating the DC supply, and diodes for reverse voltage protection. After analyzing the load current of the components, derating requirements are explored. Furthermore, power dissipation and junction temperature rise are considered with respect to the load current. The analysis is compared to the results from an engineering model of the transmitter. The temperature of the components is derated by >$40^{\circ}C$ in an environment where the ambient temperature is $+60^{\circ}C$, which is the acceptance test specification of high temperature.

A Study on the Reliability Prediction for Space Systems (우주 시스템의 신뢰성 예측에 관한 연구)

  • Yu, Seung-U;Lee, Baek-Jun;Jin, Yeong-Gwon
    • Aerospace Engineering and Technology
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    • v.5 no.2
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    • pp.227-239
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    • 2006
  • Reliability prediction provides a rational basis for design decisions such as the choice between alternative concepts, choice of part quality levels, derating factors to be applied, use of proven versus state-of-the-art techniques, and other factors. For this reasons, reliability prediction is essential functions in developing space systems. The worth of the quantitative expression lies in the information conveyed with the numerical value and the use which is made of that information and reliability prediction should be initiated early in the configuration definition stage to aid in the evaluation of the design and to provide a basis for item reliability allocation (apportionment) and establishing corrective action priorities. Reliability models and predictions are updated when there is a significant change in the item design availability of design details, environmental requirements, stress data, failure rate data, or service use profile. In this paper, the procedure, selection of reliability data and methods for space system reliability prediction is presented.

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