• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.1
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• pp.34-41
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• 2017

In this study, the effect on the zinc nuclei crystallization caused by changes preprocessing of the zinc crystalline glaze preparation has been studied. The mechanism of the nuclei formation in the crystalline glaze and development of the nuclei by studying the preprocessing step was explained. The preprocessing step was improved by altering mixing process of the materials prior to sintering: number of sieving dispersion process and ultra-sonication prove tests with various duration of sonication. According to the result, the sieving and sonication of the starting materials facilitated the interface reactions of $ZnO-SiO_2$ from $680^{\circ}C$ where low temperature willemite is formulated, and altered Si bonding for the easier bonding between Zn-Si. In other words, solely sieving was enough to accelerate the formation of willemite in low temperature. When the particles were distributed evenly by sonication, the willemite formation was even more significant.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• The korean journal of orthodontics
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• v.39 no.4
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• pp.213-224
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• 2009

Objective: The aim of this study was to find out whether Er:YAG laser can aid in debonding ceramic brackets, and to see what kind of method will be the most appropriate for debonding. Methods: One hundred and ninety teeth, monocrystalline brackets ($MISO^{TM}$, HT, Ansan-Si, Korea), polycrystalline brackets ($Transcend^{TM}$ series 6000, 3M Untek, Monrovia, CA, USA) and the KEY Laser3 (KavoDental, Biberach, Germany) were used. Experimental groups were classified according to the type of ceramic brackets, and the amount of laser energy (0, 140, 300, 450, 600 mJ). After applying laser on the bracket at two points at 1 pulse each, the shear bond strength was measured. The effect of heat caused by laser was measured at the enamel beneath the bracket and pulp chamber. After measuring the shear bond strength, adhesive residue was evaluated and enamel surface was investigated using SEM. Results: All ceramic bracket groups showed a significant decrease in shear bond strength as the laser energy increased. The greatest average temperature change was $3.78^{\circ}C$ on the enamel beneath the bracket and $0.9^{\circ}C$ on the pulp chamber. Through SEM, crater shape holes caused by the laser was seen on the enamel and adhesive surfaces. Conclusions: If laser is applied on ceramic brackets for debonding, 300 - 450 mJ of laser energy will be safe and efficient for monocrystalline brackets ($MISO^{TM}$), and about 450 mJ for polycrystalline brackets ($Transcend^{TM}$ series 6000).