• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.22-28
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• 1998

Signal transmission and crosstalk of coupled bondwires buried in plastic packages are analyzed using the Method of Moments and the Fourier Transform algorithm. It is also shown that the quasi-static crosstalk model of SPICE is inappropriate for designing the high-speed plastic packages. Plastic packaging material, increasing the self and mutual capacitances, is found to be helpful for the signal transmission integrity due to the dielectric compensation effect. However, it is also observed that the plastic material increases the crosstalk due to the radiation-enhanced mutual coupling effect. By investigating the geometrical and material dependence of the pulse transmission and crosstalk, it is found that the radiation-enhanced coupling effect is significant for most of typical bondwire geometries and plastic package materials. These calculation results can be effectively used for designing plastic packages of high-speed digital IC's and monolithic RFIC's.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.59-64
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• 2021

System-in-package (SIP) technology using heterogeneous integration is becoming the key of next-generation semiconductor packaging technology, and the development of low temperature Cu bonding is very important for high-performance and fine-pitch SIP interconnects. In this study the low temperature Cu bonding and the anti-oxidation effect of copper using porous Ag nanolayer were investigated. It has been found that Cu diffuses into Ag faster than Ag diffuses into Cu at the temperatures from 100℃ to 200℃, indicating that solid state diffusion bonding of copper is possible at low temperatures. Cu bonding using Ag nanolayer was carried out at 200℃, and the shear strength after bonding was measured to be 23.27 MPa.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.384-384
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• 2008

그라핀 기판 제작을 위해서는 그라파이트의 탈착이 가장 핵심 기술이다. 본 연구에서는 신뢰성 있는 그라핀 기판 제작을 위해서, HOPG(Highly Ordered Pyrolytic Graphite) 기판에 고농도의 이온을 주입하고, HOPG를 이형기판에 본딩한후, 후속 열처리를 통해 HOPG를 탈착시켜 그리핀을 얻는 일련의 기본 실험에 대한 결과를 보여 주고자 한다. 기대하는 효과는 고농도의 수소/산소 이온의 경우 주입된 고농도의 수소/산소가 후속 열처리동안 이동 및 뭉침현상을 통해 HOPG기판 내에 수소압력(혹은 CO2 발생)을 증가시켜 HOPG를 자르는 것을 기대하고 있다. 일차 수소이온 주입의 실험결과, 기대와는 달리 $900^{\circ}C$ 열처리에도 절단현상이 발견되지 않아서 산소이온주입에 대한 추가실험을 진행 중이다. 그라핀 본딩의 경우 그라핀의 큰 roughness로 인해 $SiO_2$만의 Fusion 본딩은 불가능함을 여러 실험을 통해 알 수 있었고, 현재 SiO2/SOG 혹은 SiO2/Fox를 이용한 본딩실험을 진행중이다.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.389-396
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• 2008

The effect of thermal cycling on bond strength and residual stress at the interface between benzocyclobutene (BCB) and plasma enhanced chemical vapor deposited (PECVD) silicon dioxide ($SiO_2$) coated silicon wafers were evaluated by four point bending and wafer curvature techniques. Wafers were bonded using a pre-established baseline process. Thermal cycling was done between room temperature and a maximum peak temperature. In thermal cycling performed with 350 and $400^{\circ}C$ peak temperature, the bond strength increased substantially during the first thermal cycle. The increase in bond strength is attributed to the relaxation in residual stress by the condensation reaction of the PECVD $SiO_2$: this relaxation leads to increases in deformation energy due to residual stress and bond strength.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.619-625
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• 2008

The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

• Journal of the Korean Geosynthetics Society
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• v.15 no.4
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• pp.33-42
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• 2016

Discrete Element Method was conducted for rock and coarse-grained materials in development of granular mechanics and related numerical model due to analyze and apply micromechanical property. And it was verified that the analysis to consider bonding effect was insufficient. In this study, to overcome limits of existing method, it was conducted to analyze difference between indoor test result and bonding effect using $PFC^{3D)}$. For indoor test of mixed soil, uniaxial compression tests by curing time and by cement content were performed. And, DEM to suitable for each condition of indoor test was conducted. In the result of this study, in terms of geotechnics, it was verified that DEM can be used for application as numerical laboratory as well as prediction of micro and macro behavior about bonding effect of mixed soil.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.2074-2075
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• 2007

본 연구에서는 침수된 저압 지중함에서 발생될 수 있는 누전 사고시 지중함내의 접지조건이 주변의 대지전위분포에 미치는 영향을 고찰하였다. 저압 지중함 실증실험장을 설계 구축하였으며 3가지 접지조건의 경우에 대해 대지전위 측정 실험을 실시하였다. case 1과 case2와 같은 실증실험을 통해 저압 지중함에 설치되어 있는 접지선은 저압 지중함에서 대지전위 분포에 거의 영향이 없음을 확인하였으며, case 3과 같은 실증실험을 통해 저압 지중함 철재틀에 접지단자를 본딩 할 경우 저압 지중함 주변의 대지전위 상승이 거의 발생되지 않음을 확인하였다. 따라서 저압 지중함 철재틀에 접지단자를 본딩 할 경우 혹시 발생될 수 있는 지중함의 누전에 의한 감전사고를 매우 효과적으로 방지할 수 있을 것이다.

• Journal of Ocean Engineering and Technology
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• v.26 no.3
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• pp.39-45
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• 2012

This paper investigates the strength characteristics and stress-strain behaviors of waste fishing net (WFN)-added lightweight soil. The lightweight soil, which consisted of dredged soil, crumb rubber, and cement, was reinforced with WFN in order to increase its shear strength. Glue treated WFN was also added to lightweight soil to improve the interlocking between the soil mixture and WFN. Three kinds of test specimens were prepared: unreinforced lightweight soil, reinforced lightweight soil without glue treatment, and reinforced lightweight soil with glue treatment. Several series of laboratory tests were carried out, including flow value tests, unconfined compression tests, and SEM analyses. From the experimental results, it was found that the peak strength of the reinforced lightweight soil with glue treatment was increased by the increased interlocking between the soil mixture and WFN, which was induced from the bonding effect. The stress-strain relation of the reinforced lightweight soil, irrespective of the glue treatment, showed a more ductile behavior than that of the unreinforced lightweight soil.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.27-27
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• 2003

최근 탄소나노튜브를 전계방출 표시소자(FED, field omission display)용 에미터 재료로 사용한 캐소드 개발에 대한 연구가 활발히 진행되고 있다. 캐소드전극으로는 투명전도성 반도체 박막인 ITO를 사용하고, 에미터용 재료로는 탄소나노튜브를 사용해서 스크린 인쇄법으로 2극(diode type)형 전계방출 소자용 캐소드를 제작하였다. 본딩재(bonding materials)의 종류와 공정변수를 달리해서 에미터용 탄소나노튜브와 ITO 캐소드 전극 사이의 전기적 접촉방법을 변화시켰을때 탄소나노튜브 캐소드의 전계방출 특성을 체계적으로 연구하였다. 첫째로, 본딩재의 전기전도성 (electrical conductivity)을 변수로 해서 탄소나노튜브 에미터의 전계강화(fold enhancement) 효과를 연구한 결과 본딩재의 구성 성분중 부도체(insulator)의 분율이 높을수록 전계강화 효과가 크게 나타남을 확인하였다. 두 번째로, ITO박막 캐소드전극과 탄소나노튜브 잉크 사이에 중간층(inter layer)을 형성시켜서 중간층이 전계방출 특성에 미치는 영향을 연구하여, 중간층의 존재가 탄소나노튜브의 전계방출 전류의 균일성과 전류밀도의 증가에 기여하는 것을 확인하였다. 본 연구의 결과 전계방출 전류가 안정적이면서 동시에 전계방출 효율이 크게 개선된 탄소나노튜브 캐소드를 제작하는 공정기술이 개발되었다. 개발된 기술은 기존의 방법에 비해서 탄소나노튜브 캐소드의 진공패키징시 아웃개싱(outgassing)의 양도 현격하게 작았으며, 에미터와 캐소드 전극 사이의 본딩력(adhesion)도 우수해서 항후 탄소나노튜브 전계방출 표시소자의 개발에 크게 기여할 것으로 판단된다.luminum 첨가량이 증가함에 따라 세라믹 수율도 증가하였음을 확인하였다. 합성된 aluminum-contained polycarbosilane은 20$0^{\circ}C$에서 1시간 동안 불융화과정을 거쳐 환원 및 진공 분위기에서 고온 열처리하였으며 이로부터 얻어진 시료에 대해 XRD분석을 수행하였다. SEM과 TEM을 이용하여 미세구조를 관찰하였다./100 duty로 구동하였으며, duty비 증가에 따라 pulse의 on-time을 고정하고 frequency를 변화시켰다. dc까지 duty비가 증가됨에 따라 방출전류의 양이 선형적으로 증가하였다. 전압을 일정하게 고정시키고 각 duty비에서 시간에 따라 방출전류를 측정한 결과 duty비가 높을수록 방출전류가 시간에 따라 급격히 감소하였다. 각 duty비에서 방출전류의 양이 1/2로 감소하는 시점을 에미터의 수명으로 볼 때 duty비 대 에미터 수명관계를 구해 높은 duty비에서 전계방출을 시킴으로써 실제의 구동조건인 낮은 duty비에서의 수명을 단시간에 예측할 수 있었다. 단속적으로 일어난 것으로 생각된다.리 폐 관류는 정맥주입 방법에 비해 고농도의 cisplatin 투여로 인한 다른 장기에서의 농도 증가 없이 폐 조직에 약 50배 정도의 고농도 cisplatin을 투여할 수 있었으며, 또한 분리 폐 관류 시 cisplatin에 의한 직접적 폐 독성은 발견되지 않았다이 낮았으나 통계학적 의의는 없었다[10.0%(4/40) : 8.2%(20/244), p>0.05]. 결론: 비디오흉강경술에서 재발을 낮추기 위해 수술시 폐야 전체를 관찰하여 존재하는 폐기포를 놓치지 않는 것이 중요하며, 폐기포를 확인하지 못한

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.8-16
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• 2023

The importance of next-generation packaging technologies is being emphasized as a solution as the miniaturization of devices reaches its limits. To address the bottleneck issue, there is an increasing need for 2.5D and 3D interconnect pitches. This aims to minimize signal delays while meeting requirements such as small size, low power consumption, and a high number of I/Os. Hybrid bonding technology is gaining attention as an alternative to conventional solder bumps due to their limitations such as miniaturization constraints and reliability issues in high-temperature processes. Recently, there has been active research conducted on SiCN to address and enhance the limitations of the Cu/SiO₂ structure. This paper introduces the advantages of Cu/SiCN over the Cu/SiO₂ structure, taking into account various deposition conditions including precursor, deposition temperature, and substrate temperature. Additionally, it provides insights into the core mechanisms of SiCN, such as the role of Dangling bonds and OH groups, and the effects of plasma surface treatment, which explain the differences from SiO₂. Through this discussion, we aim to ultimately present the achievable advantages of applying the Cu/SiCN hybrid bonding structure.