• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.5
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• pp.174-182
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• 2020

The printed electronics field using ink-jet printing technology is in the spotlight as a next-generation technology, especially ink-jet 3D printing, which can simultaneously discharge and precisely control various ink materials, has been actively researched in recent years. In this study, complex structure of an insulating layer and a conductive layer was fabricated with photo-curable silica ink and PVP-added Cu nano ink using ink-jet 3D printing technology. A precise photocured silica insulating layer was designed by optimizing the printing conditions and the rheological properties of the ink, and the resistance of the insulating layer was 2.43 × 10¹³ Ω·cm. On the photo-cured silica insulating layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the PVP-added nano Cu ink was performed using an IPL flash sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Finally, it was confirmed that the resistance of the PVP-added Cu conductive layer was very low as 29 μΩ·cm under 100℃ annealing temperature and 700 V of IPL applied voltage, and the adhesion to the photo-cured silica insulating layer was very good.

• Journal of Aerospace System Engineering
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• v.11 no.5
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• pp.42-49
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• 2017

The solid rocket motor(SRM) consists of a motor case, igniter, propellants, nozzle, insulation, controller, and driving device. The liquid rocket propulsion systems(LRPSs) cools the nozzle by the fuel and oxidizer but SRM does not cool the nozzle. The nozzle of SRM is high temperature condition and high velocity condition so occurs the erosion by combustion gas. This erosion occurs the change of nozzle throat and reduces thrust performance of rocket. The material of Rocket nozzle is minimization of erosion and insulation effect and endure the shear force, high temperature and high pressure. The purpose of this study is to investigate the erosion characteristics of solid rocket nozzles by each combustion time. Through the structure inspection of Graphite and C-C composite, identify the characteristics of the microstructure before and after erosion.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.2
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• pp.102-105
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• 2009

The accelerated life time test of the MLCCs with different $BaTiO_3$ particle sizes were conducted at $150^{\circ}C$, 75 V condition and the effect of $BaTiO_3$ particle size on the breakdown voltage and degradation characteristics of MLCCs was investigated. The MLCCs were prepared by using the $BaTiO_3$ particles having the size of $0.525{\mu}m$, $0.555{\mu}m$, $0.580{\mu}m$ and Ni-electrode, respectively. The MLCCs which have the particle size of $0.525{\mu}m$, $0.555{\mu}m$, and $0.580{\mu}m$, respectively were confirmed to meet the standard requirements of X5R(change capacitance within ${\pm}15%$ at $-55{\sim}85^{\circ}C$) by TCC(Temperature Coefficient of Capacitance). The effect of the $BaTiO_3$ particle size on the insulation resistance behavior of MLCCs was confirmed by BDV(Breakdown Voltage) measurements and the cause and degree of degradation of MLCCs were characterized by XPS analysis after the accelerated life test. The MLCCs with $0.525{\mu}m-BaTiO_3$ showed better insulation resistance and BDV characteristics compare to other MLCCs and XPS analysis revealed that the MLCCs degradation is caused by the NiO peak and $BaTiO_3$ peak decrease.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.82.1-82.1
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• 2012

란타늄 산화물 ($La_2O_3$) 박막은 하프늄 산화물 ($HfO_2$) 박막보다 높은 유전 상수와 높은 밴드 오프셋으로 인해 dynamic random access memory(DRAM)에서 유전체 재료로써 연구되어 왔다. 그리고 Lanthanum이 도핑된 HfO2이 더 높은 유전 상수와 낮은 누설 전류 밀도를 갖는 다는 사실이 이전에 보고 된 바 있다. 본 연구에서 우리는 ALD를 이용하여, TiN 하부 전극 위에 $La_2O_3$의 위치를 달리하는 $La_2O_3/HfO_2$의 나노 층상조직 구조(두께 10 nm)를 금속 - 절연체 - 금속 (MIM) 구조로 제작 하였다. ALD는 좋은 comformality와 넓은 지역 균일성을 가지며, 원자수준의 두께를 조절할 수 있다는 장점을 갖고 있다. 또한, 다양한 화학 물질들을 이용한 복합적 계층구조를 만들 수 있는 점과 $HfO_2$ 및 $La_2O_3$ 계층의 수직 위치를 정확하게 조절할 수 있는 점으로 본 연구에 적합한 증착 방법이다. HfO2 속에 $La_2O_3$ 층을 깊이에 따라 삽입함으로써 $HfO_2$ 계층에 La 도핑의 효과와 더불어 TiN 하부 전극 위의 $La_2O_3$과 $HfO_2$의 차이점을 확인 하였다. $HfO_2$은 $250^{\circ}C$에서 TDMAH와 물을 사용하여, $La_2O_3$은 동일한 온도에서 $La(iPrCp)_3$와 물을 사용하여 제작되었다. 화학적 구성 및 binding 구조는 X선 광전자 분광법 (XPS)을 통해 분석하였다. 전기적 특성(유전 상수 및 누설 전류)은 Capacitance-Voltage (CV)와 Current-Voltage (IV) 측정으로 확인하였다. 결과적으로, $La_2O_3$ 또는 $HfO_2$을 한 종류만 사용한 절연층의 전기적 특성보다, $La_2O_3/HfO_2$의 나노 층상조직 구조가 더 나은 특성 (누설 전류 밀도 : $5.5{\times}10^{-7}\;A/cm^2$ @-1MV/cm, EOT : 14.6)을 갖는다는 것을 확인했고, 더불어 $La_2O_3$의 흡습 성질로 인한 화학 구조와 전기적 특성의 일부 차이를 확인하였다. 본 연구에서는 $HfO_2$ 속에 $La_2O_3$층이 TiN 하부 전극 바로 위에 위치할 때, 즉, 공기 중에 노출되지 않은 $La_2O_3/HfO_2$ 구조에서 가장 좋은 특성의 MIM capacitor를 얻을 수 있었다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.9
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• pp.815-820
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• 2016

An elastic polymer (e.g., PDMS) blended with EFG particles is a promising conductive composite for fabricating soft sensors that can detect an object's deformation up to or more than 50%. Here, we develop large-strain, sprayable soft sensors using a mixture of PDMS and EFG particles, which are used as a host elastomer and electrically conductive particles, respectively. A solution for a conductive composite mixture is prepared by the microwave-assisted graphite exfoliation, followed by ultrasonication-induced fragmentation of the exfoliated graphite and ultrasonic blending of PDMS and EFG. Using the prepared solutions for composite and pure PDMS, 1-, 2-, and 3-axis soft sensors are fabricated by airbrush stencil technique where composite mixture and pure PDMS are materials for sensing and insulating layers, respectively. We characterize the soft strain sensors after investigating the effect of PDMS/EFG wt% on mechanical compliance and electrical conductance of the conductive composite.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

• Journal of the Korean Electrochemical Society
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• v.27 no.1
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• pp.47-54
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• 2024

In this study, ZIF67/rGO was used to minimize the battery life degradation due to the insulating properties of sulfur and the elution of lithium polysulfide. ZIF67 wrapped in rGO creates more space within the carbon sponge and can hold a large amount of sulfur. The sulfur@ZIF67/rGO composite was synthesized and prepared as a sponge to enhance the sulfur retention capacity. The result showed a high initial capacity, with a value of about 1093 mAh g^-1 and a capacity retention rate of 84% after 100 cycles. The high interaction with sulfur through the complexation of cobalt and carbon confirmed that ZIF67/rGO exhibits high performance as a carrier for sulfur, the anode active material of lithium-sulfur batteries, and the high initial capacity and improved capacity retention rate were confirmed.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.