• Journal of the Korean Society for Precision Engineering
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• v.17 no.10
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• pp.132-140
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• 2000

In conventional drilling, burr geometry can be changed according to the variation of drill geometry like point angle, rake angle. Step drilling is proposed to minimize the burr formation in drilling operation. The burr formed in first cutting can be removed in second cutting by the edge in step. The burr formed in second cutting by the edge in step can be minimized according to the change of geometry like, step angle and depth. The mechanism in step drilling is analyzed. Some step drills are applied to drilling the input shaft which is used for vehicle steering. To measure the burr formed in drilling, laser and height gage are used.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.1043-1046
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• 2002

In this paper, drill tests were carried out by modifying drill geometry for burr minimization. Final objective of this study is to develop compatible drill shape for minimization of burr formation. These experimented results with modified drill are measured with laser sensor after performing drilling with variable material. Simultaneously, the cutting force and the torque of various drill geometry have been observed with same cutting condition to judge drill stability. As a result, burr was minimized in step drill with 75$^{\circ}$ step angle at every material.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.11
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• pp.183-191
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• 2002

Drilling tests were carried out using drills with various drill shapes for burr minimization. Final objective of this study is to develop compatible drill shape for minimization of burr formation. For experiments, general carbide drills, round drills, chamfered drills and step drills are designed and manufactured. Burrs are formed by various cutting conditions and in 4 different work materials. Laser sensor is used to measure burr geometries. Cutting forces in drilling are also measured and compared in every drill. As a result of the experiments, step drills with specific step angle and step diameter are suggested for burr minimization.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.911-914
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• 1997

This Experiment was carried out for bur minimization in drilling. New drill geometries are proposed to minimize the burr formation in drilling operation. Three types of drills are made, champer, round and step drill. The burr formed in first cutting by front cutting edge ca be removed in second cutting by the cutting edges in chamfer, round edge and step. New burrs are formed by second cutting and can be minimized according to the change of drill geometry like, chamfer size and angle, corner radius in round drill and step size and angle in step drill. To measure the burr formed in drilling, laser sensor is used.

• Journal of Satellite, Information and Communications
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• v.10 no.4
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• pp.12-16
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• 2015

Unmanned robot system has become a significant part of network centric warfare. Unnlike the commercial wireless system, however, it is tricky to provide reliable communication in the harsh environment: tactical and military communication. Therefore, it needs to be considered when the base station and mobile has poor communication channel. In this paper, we proposed an efficient operating algorithm for unammned robot system with ensuring communication survivability in the harsh environment. From the simulation, we adopted the SUI channel suitable for domestic mountainous area and open terrain with Rician factor K.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.7
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• pp.76-81
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• 2011

A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.