• Journal of Advanced Marine Engineering and Technology
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• v.38 no.1
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• pp.48-55
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• 2014

These Xenon flashlamp power supply for Ultra Violet has converter with high voltage conversion ratio. General model is composed of transformer with high voltage conversion ratio and voltage doubler rectifier circuit. Purpose of power supply leads dielectric breakdown of Xenon flashlamp and passes current rapidly. When passing current, it has to limit current to avoid over-heat, damage of electrode and acceleration of gas oxidation which are cause of performance degradation of lamps. Generally, inductors and resistors, which are called as "Ballast," are used to limit currents. Generally, Transformer has high turn ratio to make high voltages. But we can get high voltages using the transformer with low turn ratio which is driven with self resonance. Also, an advantage of self resonance is to make a circuit simply through impedance of transformer in resonance frequency which filters output voltage. As using an unique impedance of transformer, the circuit does not need other impedance elements like the ballast. So the power supply assures high efficiency of the arc discharge.

• Journal of the Korean Electrochemical Society
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• v.8 no.4
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• pp.155-161
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• 2005

In this paper, commercial CFD program FLUENT v5.3 is used for simulation of MCFC stack. Besides using conservation equations included in FLUENT by default, mass change, mole fraction change and heat added or removed due to electrochemical reactions and water gas shift reaction are considered by adding several equations using user defined function. The stacks calculated are 6 and 25 kW class coflow stack which are composed of 20 and 40 unit cells respectively. Simulation results showed that pressure drop took place in the direction of gas flow, and the pressure drop of cathode side is more larger than that of anode side. And the velocity of cathode gas decreased along with the gas flow direction, but the velocity of anode gas increased because of the mass and volume changes by the chemical reactions in each electrodes. Simulated temperature profile of the stack tended to increase along with the gas flow direction and it showed similar results with the experimental data. Water gas shift reaction was endothermic at the gas inlet side but it was exothermic at the outlet side of electrode respectively. Therefore water gas shift reaction played a role in increasing temperature difference between inlet and outlet side of stack. This results suggests that the simulation of large scale commercial stacks need to consider water gas shift reaction.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1254_1255
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• 2009

The composites were fabricated by adding 30, 35, 40, 45[vol.%] Zirconium Diboride(hereafter, $ZrB_2$) powders as a second phase to Silicon Carbide(hereafter, SiC) matrix. The physical, mechanical and electrical properties of electroconductive SiC ceramic composites by Spark Plasma Sintering(hereafter, SPS) were examined. Reactions between $\beta$-SiC and $ZrB_2$ were not observed in the XRD analysis. The relative density of SiC+30[vol.%]$ZrB_2$, SiC+35[vol.%]$ZrB_2$, SiC+40[vol.%]$ZrB_2$ and SiC+45[vol.%]$ZrB_2$ composites are 88.64[%], 76.80[%], 79.09[%] and 88.12[%], respectively. The XRD phase analysis of the electroconductive SiC ceramic composites reveals high of SiC and $ZrB_2$ and low of $ZrO_2$ phase. The electrical resistivity of SiC+30[vol.%]$ZrB_2$, SiC+35[vol.%]$ZrB_2$, SiC+40[vol.%]$ZrB_2$ and SiC+45[vol.%]$ZrB_2$ composites are $6.74{\times}10^{-4}$, $4.56{\times}10^{-3}$, $1.92{\times}10^{-3}$ and $4.95{\times}10^{-3}[{\Omega}{\cdot}cm]$ at room temperature, respectively. The electrical resistivity of SiC+30[vol.%]$ZrB_2$, SiC+35[vol.%]$ZrB_2$, SiC+40[vol.%]$ZrB_2$ and SiC+45[vol.%]$ZrB_2$ are Positive Temperature Coefficient Resistance(hereafter, PTCR) in temperature ranges from 25[$^{\circ}C$] to 500[$^{\circ}C$]. It is convinced that SiC+40[vol.%]$ZrB_2$ composite by SPS can be applied for heater or electrode.

• Fire Science and Engineering
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• v.34 no.4
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• pp.1-6
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• 2020

In this study, the authors measured voltage and current waveforms in real time during a serial arc discharge. The analysis results of the arc discharge radiation patterns exhibited intermittent discharge, arc growth, creation of a heat generating area, occurrence of plume, and formation of a red heat area, which proceeded in that order. When the serial arc discharge was introduced, the current and voltage waveforms exhibited periodicity as sine waves. It was also observed that a restriking transient voltage occurred when the waveform changed from positive (+) to negative (-) and vice versa. When the discharge proceeded, the amount of heat generated for 1 s and 600 s was approximately 0.317 mJ, and 190 mJ, respectively. The duration of the short circuit was approximately 1.66 ms, and in the case of the voltage waveform, it was evident that the electric potential increased to 49.9 V in the same cycle. Furthermore, when the discharge proceeded, the effective value (RMS value) of the current was approximately 1.72 A with a maximum current of approximately 2.53 A, whereas the effective value of the voltage was approximately 42.8 V with a maximum of approximately 208 V.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.72-72
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• 2000

ITO(Indium-Tin-Oxide)는 n-type 전도 특성을 갖는 산화물 반도체로서 가시광 영역에서의 높은 광투과율 및 낮은 전기 비저항을 나타내기 때문에 태양전지, 액정디스플레이(liquid crystal display), 터치스크린(touch screen) 등의 투명전극 재료, 전계 발광(electroluminescent) 소자, 표면발열체, 열반사 재료 등 다양한 분야에 응용되고 있다. 본 연구에서는 타겟 제작에 드는 비용을 줄이고, 타겟 이용의 효율성을 높이기 위해 기존의 세라믹 타겟 대신 분말 타겟을 사용하여 유리 기판 상에 ITO 박막을 DC magnetron sputtering법에 의해 제조하고, 열처리 온도 및 열처리 분위기에 따른 ITO 박막의 전기적 광학적 특성을 조사하였다. 열처리 온도가 10$0^{\circ}C$이하인 경우 열처리하지 않은 시편과 동일하게 In2O3의 (411)면에 해당하는 peak가 관찰되었다. 그러나 20$0^{\circ}C$의 온도로 열처리 할 경우 (411)면 peak의 세기는 상대적으로 감소하고 대신 이전에 나타나지 않았던 (222)면에 대응하는 peak 세기가 현저하게 증가함을 알 수 잇다. 이것은 ITO 박막의 경정성장이 열처리 전 (411)면 방향으로 이루어지나 20$0^{\circ}C$의 온도로 열처리 후 재결정화에 의해 (222)면 방향으로의 우선방위를 갖고 성장함을 의미한다. 또한 주로 높은 기판온도에서 관찰되었던 (211), (400), (411), (440), (622)면 등에 해당하는 peak가 나타남을 볼 수 있었다. 열처리 온도를 더욱 증가시킴에 따라 결정구조에는 큰 변화 없이 (222)면 peak 세기가 증가하였다. 한편 열처리 온도를 더욱 증가시킴에 따라 (222)면 peak 세기가 상대적으로 조금 감소할뿐 XRD회절 결과에는 큰 변화를 관찰할 수 없었다. 이러한 결과로부터 기판을 가열하지 않고 증착한 ITO 박막의 재결정화에 필요한 최소의 열처리 온도는 20$0^{\circ}C$이며, 그 이상의 열처리 온도는 ITO박막의 결정구조에 큰 영향을 미치지 않음을 알 수 있었다. 열처리 전 비저항은 1.1$\times$10-1 $\Omega$-cm 의 값을 가지거나 10$0^{\circ}C$의 온도로 열처리함에 따라 9.8$\times$102$\Omega$-cm 로 약간 감소하였다. 열처리 온도를 20$0^{\circ}C$로 높임에 따라 비저항은 급격히 감소하여 1.7$\times$10-3$\Omega$-cm의 최소값을 나타내었다. 열처리 온도가 10$0^{\circ}C$인 경우 가시광 영역에서의 광투과율은 열처리하지 않은 시편과 비교해 볼 때 약간 증가하였다. 열처리 온도는 20$0^{\circ}C$로 증가시킴에 따라 투과율은 크게 향상되어 흡수단 이상의 파장영역에서 90% 이상의 투과율을 나타내었다. 이러한 광투과율의 향상은 앞서 증착된 ITO 박막이 열처리 중 재결합에 의해 우선 성장 방위가 (411)면 방향에서 (222)면 방향으로 변화되었기 때문으로 생각된다. 그러나 열처리 온도를 20$0^{\circ}C$이상으로 증가시켜도 광투과율은 큰 변화를 나타내지 않았다.