• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.97-101
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• 2005

The ZnO:Al thin films were prepared on glass by Facing Target Sputtering (FTS) system. We investigated electrical, optical, and structural properties of AZO thin film with sputter ins current 0.1[A]-0.6[A]. We obtained the lowest resistivity $2.3{\times}\;10^{-4}[{\Omega}-cm]$ at sputtering current 0.6[A] from the 4-point probe and the strong (002) peak at sputtering current 0.3[A] from the X-ray Diffractometer (XRD). The optical transmittance of AZO thin films show a very high transmittance of $80\~95\%$ in the visible range and exhibit the absorpt ion edge of about 350 nm.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.106-109
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• 2005

The ITO thin films for Top-Emitting Organic Light Emitting Devices (TOLEDs) were prepared on cell(LiF/Organic Layer/Bottom Electrode : ITO ) by FTS (Facing Targets Sputtering) system under different sputtering conditions which were varying gas pressure, input current and distance of target to target($D_{T-T}$). As a function of sputtering conditions, I-V characteristics of prepared ITO thin films on cell were measured by 4156A (HP). In the results, when the In thin films were deposited at $D_{T-T}$ 70mm and working pressure 1mTorr, the leakage current of ITO/cell was about 11[V] and 5E-6[$mA/cm^2$].

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.124-128
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• 2005

To produce a highly sensitive uncooled microbolometer, the development of a high-performance thermometric material is essential. In this work, amorphous vanadium-tungsten oxide was developed as a thermometric material at a low temperature of $300^{\circ}C$, and the microbolometer, coupled with the material, was designed and fabricated using surface micromachining technology. The vanadium-tungsten oxide showed good properties for application to the microbolometer, Such as a high temperature coefficient of resistance of over -4.0 $\%$/K and good compatibility with the surface micromachining and integrated circuit fabrication process due to its low fabrication temperature. As a result, the uncooled microbolometer could be fabricated with high detectivity over $1.0\;{\times}\;10^9\;cmHz^{1/2}/W$ at a bias current of $7.5\;{\mu}A$ and a chopper frequency of 10-20 Hz

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.147-150
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• 2005

We process a novel approach cal led combined nanoimprint and photolithography (CNP) to greatly simplify the fabrication in conventional nanoimprint lithography (NIL). In this study, a novel HMM with anti-sticking $SiO_2$ layer is introduced to improve the quality of transferred pattern. The surface property was investigated using contact angle measurement and spectrophotometer. Replicate pattern with CNP using HMM showed complete pattern transfer without defect.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.151-154
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• 2005

In this paper, we present the enhanced performance of resistive RAM devices with multi-step deposited and annealed oxides. By using multi-step deposition and low temperature multi-step annealins, forming-free Re-RAM is achieved with lower operation voltages and larger resistive ratio than those of conventional Re-RAM with typical single deposited oxide.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.160-164
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• 2005

In this paper, MEMS inductor was integrated on a 5GHz VCO using BCB as low-k dielectric layer for MEMS inductor. The VCO core circuit is realized by IBM SiGe process. We varied the spiral inductor's suspension height and posit ion on circuit, and studied their circuit interference effect on VCO performance. The VCO with inductor placed on BCB with More height and the VCO with inductor that was not positioned above active area showed better characteristics.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.175-177
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• 2005

본 연구에서는 fresnoite ($Ba_{2}TiSi_{2}O_{8}$) 결정화 유리를 $xK_{2}O-(33.3-x)BaO-16.7TiO_{2}-50SiO_{2}$ ($0{\le}x{\le}\;20mol\%$)으로 부터 제조하였으며, 특성평가를 하였다. $K_{2}O$의 치환량이 증가함에 따라, 유리전이 온도와 결정화 온도는 감소하였으며, 유리의 안정화를 나타내는 ${\Delta}$T는 증가하였다. $Ba_{2}TiSi_{2}O_{8}$ 결정상의 형성은 XRD와 SEM분석을 통하여 관찰하였고, LCR meter를 사용하여 열처리에 의하여 제조된 결정화 유리의 유전율은 측정하였으며, 결정화 유리는 $Ba_{2}Si_{2}TiO_{8}$ 단결정 보다 낮은 유전율은 보였다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.197-202
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• 2005

Due to high permeability of the ferrite core, the characteristics of the ICP are expected to be greatly improved. We investigated the effect of the ferrite cores on conventional inductively coupled plasma. It was observed that the current and voltage in ike ICP antenna are slightly decreased and the power transfer efficiency is increased. However, due to eddy current and hysterisis loss, plasma density in the ICP with the ferrite cores is not increased. It seems that the ICP with the ferrite cores at low frequency (${\~}$100kHz) will be greatly improved since the losses at the low frequency can be negligible.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.78-82
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• 2005

펄스 플라즈마 원자층 증착 방법 (PPALD : Pulse Plasma Atomic Layer Deposition)을 이용하여 삼원계 박막인 W-C-N 박막을 ILD layer인 TEOS 위에 제조하였다. 실험은 $WF_6,\;N_2.\;CH_4$ 가스의 순차적 주입과 $N_2$를 이용한 퍼징으로 이루어지며 $N_2$와 $CH_4$ 가스 주입 시에 pulse plasma가 적용되었다. 일반적인 ALD 증착 기구를 그대로 따르는 PPALD 방법에 의해 제조된 W-C-N 박막은 $H_2/N_2$ 플라즈마 초기 표면 처리에 의해 incubation cycles 없이 초기 cycles부터 0.2 nm/cycle의 일정한 증착율을 가지고 증착되므로 정확한 두께의 control이 가능하며 $300\;{\mu}{\Omega}-cm$의 매우 낮은 비저항 특성을 나타내었다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.47-50
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• 2003

잉크젯 헤드의 발열체에 적용하기 위해 $poly-Si/SiO_2/Si$ 의 다층기판 위에 결정화된 안정한 $SiO_2$ 코발트 실리사이드 박막을 증착하여 발열체를 제작하고 이들 발열체의 구조적 형상과 온도저항계수 등 전기적 특성을 조사하였다. $SiO_2$ 코발트실리사이드 박막의 형성은 금속 Co 박막을 급속 열처리장치를 이용하여 $800^{\circ}C$에서 20 초 동안 질소 분위기에서 열처리하여 실리사이드 박막을 형성하였다. 발열체의 온도저항계수 값은 약 $^0.0014/{\circ}C$ 값을 얻을 수 있었다. 인가전압 10V, 주파수 10 kHz 및 펄스간격 $1\mu\textrm{s}$ 인가시 발열체의 순간전력은 최대 2 watt를 나타내었다.