• Proceedings of the KAIS Fall Conference
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• 2002.11a
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• pp.278-282
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• 2002

This study is object to semiconductor cavity block production technology using CAD/CAM. Semiconductor packaging is require to the high intensity, high temperature and good metals. That raw metals name is ASP23 and high price. This results are propose to one direction of semiconductor cavity block production technology.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.3 no.4
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• pp.290-294
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• 2002

This study is object to semiconductor cavity block production technology using CAD/CAM. Semiconductor packaging is require to the high intensity, high temperature and good metals. That raw metals name is ASP23 and high price. This results are propose to one direction of semiconductor cavity block production technology.

• Proceedings of the CALSEC Conference
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• 2002.01a
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• pp.27-29
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• 2002

◈전방 산업 ·기계공업 자동차, 우주항공, 공작기계, 측정기기 ·전자(전기)공업 가전, 전기용품, 반도체 ·성형가공공업 플라스틱, 고무, 유리 등 ·생활용품공업 완구, 문구, 주방기기 ·건축자재공업 PVC 파이프, 알미늄섀시 ·광학정밀공업 의료기기, 광학기기 ◈후방 산업 ·금형 소재 및 금형부품 금형강, 공구강, 다이세트, 몰드베이스 ·공작기계/공구산업 선반, 밀링, 공구 ·열처리/표면처리산업 담금질, 풀림, 침탄 ·설계/엔지니어링산업 CAD/CAM/CAE ·산업디자인산업 프로토타입, 목형(중략)

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.12 no.2
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• pp.42-46
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• 2003

• Design & Manufacturing
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• v.8 no.1
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• pp.27-30
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• 2014

Alloy tool steel such as SKD11 and SKD61 or high speed tool like SKH51 are used as materials for semiconductor dies. Cavities, curl blocks, pot blocks and housings are made from those materials. To make those parts from alloy tool steel or high speed tool, one utilizes discharge machining, and mechanical machining including machining center, milling, drilling, forming grinding and others. In the process of cutting machining and polishing, the die materials become unsuitable for machining owing to bubbles and foreign substances in them, which hinders production process. Therefore, this study focuses on die material selection criteria, and on analysis and comparison of material characteristics to help companies to solve their problems, make die manufacture less burdensome and extend die life.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.7
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• pp.36-44
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• 2000

X-선 사진식각공정(이하 LIGA 기술이라 함)을 이용한 초소형, 초정밀 금형 및 3차원 구조물 제작 가공기술은, 생산기반 기술 중 금형기술 및 가공기술 분야에 해당하는 기술로 포항가속기와 같은 방사선 가속기에서 생성되는 수 보대 파장의 X-선을 이용하는 기술이다. 짧은 파장을 사용하는 연유로, 일반 반도체 공정으로는 실현할 수 없는 높고, 광학적 용도까지 가능한 거울정도의 벽면 거칠기(수백${\AA}$이하)를, 그러면서도 서브 마이크론의 정밀도 (1$\mu\textrm{m}$이하)를 가지는 금형 및 3차원 구조물을 일괄 가공할 수 있는 기술이다.(중략)

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.4-4
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• 2018

뿌리산업은 주조, 금형, 소성가공, 용접접합, 표면처리, 열처리등 소재를 부품으로 부품을 완제품으로 만드는 6대공정기술을 말하며 자동차, 기계, 전자, 반도체, 의료기기등 주력산업과 신산업 창출에 중요한 역할을 담당하나 3D업종인식, 저부가가치산업, 인력난문제가 있어 이를 해결하는 새로운 방향제시가 필요하므로 이에 대한 뿌리산업의 R&D방향에 대한 기획을 추진함.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.3
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• pp.32-38
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• 2005

Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the electrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1mm to 3.0mm with the error of from 0.02mm to 0.12mm. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.25-29
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• 1999

The lead frame manufactured by press stamping process, is an important part of semiconductor. The recent technical trend of semiconductor, chip sized and high performance package technology, requires the lead frame to be of more multi-leads and of fine ILP (Inner Lead Pitch). As the ILP is getting finer, its corresponding punch of the stamping die is getting narrower. The punch narrower than its stamping limit has been broken due to local buckling. This paper analyzed the phenomena of punch breakdown. Moreover, the punch design was modified to increase the critical limit of buckling force. This paper, also, suggested new design rules of the punch, which asks the modification of its lead frame design that has to be considered in the stage of semiconductor package design. The new design rules of lead frame design yields a good reliability of semiconductor package as well as a good quality of lead frame.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.2
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• pp.102-110
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• 2001

In this paper, methods to analyze wire sweep and paddle shift during the semiconductor ship-encapsulation process have been studied. The analysis of wire sweep includes flow-field analysis in a complicated geometry, drag-force calculation for given flow of fluid, and wire-deformation calculation for given loads. The paddle-shift analysis is used to analyze the deformation of the paddle due to the pressure difference in two cavities. the analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The numerical solution is used for more accurate calculation of wire-sweep. The numerical results of wire sweep show good agreements with the experimental ones.