• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.449-449
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• 2013

최근 반도체 소자의 집적회로는 점점 복잡해지고 있는 반면, 소자의 크기는 작아지고 있으며 그로 인해 패드의 크기가 작아지고 패드사이의 간격 또한 협소해지고 있다. 따라서 웨이퍼 단계에서 제조된 집적회로의 불량여부를 판단하기위한 검사 장비인 프로브카드(Probe Card)의 높은 집적도가 요구되고 있다. 하지만 기존의 MEMS 공법으로 제작되는 프로브 빔은 복잡한 제조 공정과 높은 생산비용, 낮은 집적도의 문제점을 가지고 있다. 본 연구에서는 이러한 문제점을 해결하기 위하여 간단한 제조 공정과 낮은 생산비용, 높은 집적도를 가지는 프로브 빔을 개발하기 위하여 절연절단 방식으로 BeCu (Beryllium-Copper) 프로브 빔을 제작하였다. 낮은 소비 전력으로 우수한 프로브 빔 어레이를 제작하기 위해서 가장 고려해야할 대상은 프로브 빔의 재료와 구조(형상)이다. 절연전단 방식으로 프로브 빔을 형성할 때 요구되는 Fusing current는 프로브 빔의 구조(형상)에 크게 영향을 받는다. 낮은 Fusing current는 소비 전력을 줄여주고, 절연절단으로 형성되는 프로브 빔의 단면(끝)을 날카롭게 하여 프로브 빔과 집적회로의 패드 간의 접촉 저항을 감소시킨다. 프로브 빔의 제작은 BeCu 박판을 빔 형태로 식각하여 제작하였으며, 실리콘 비아 홀(Via hole) 구조의 기판위에 정렬하여 soldering 공정을 통해 실리콘 기판과 BeCu 박판을 접합시켰다. 접합된 프로브 빔의 끝부분을 들어 올린 상태로 전류를 인가하여 stress free 상태로 만들어 내부 응력을 제거하였으며, BeCu 박판에 fusing current를 인가하여 BeCu 박판 프레임으로부터 제거를 하였다. 제작된 프로브 빔의 길이는 1.7 mm, 폭은 $50{\mu}m$, 두께는 $15{\mu}m$, 절단부의 단면적은 1$50{\mu}m^2$로 제작되었다. 그리고 프로브 빔의 절단부의 길이는 $50{\mu}m$ 부터 $90{\mu}m$까지 $10{\mu}m$ 증가시켜 제작되었다. 이후에 절연절단 공정에 요구되는 Fusing current를 측정하였고, 절연절단 후의 절단면의 형상을 SEM (Scanning Electron Microscope)장비를 통하여 확인하였다. 절단부의 길이가 $50{\mu}m$일 때 5.98A의 fusing current를 얻었으며, 절연절단 후 절단부 상태 또한 가장 우수했다. 본 연구에서 제안된 프로브 빔 제작 방법은 프로브카드 및 테스트 소켓(Test socket) 생산에 응용이 가능하리라 기대한다.

• Journal of IKEEE
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• v.25 no.2
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• pp.315-321
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• 2021

In this paper, we have developed the multiple channel measurement system for IC Socket Test. The one can test the current-voltage measurements for pitting the several device specification, which analyze the thin current from several ㎂ to 5A with very low resistor mΩ. The increasement of the IC socket channel with lead pitch under 0.25 mm be need to perform several functions, concurrently. The system to perform these functions be designed to integrate several SMU(source measure unit) on board. So, we can reduce the 2 minutes test time per channel point to 40 sec, with daisy chain test method. Using by graphic interface, I-V curve mode and data logging technologies, we can implement the test flow methods and can make economies the time and cost.

• Korean Journal of Optics and Photonics
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• v.29 no.1
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• pp.19-27
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• 2018

A change in object distance would generally change the magnification of an optical system. In this paper, we have proposed and designed a double-Gauss optical system with a fixed magnification and image surface regardless of any change in object distance, according to moving the lens groups a little bit to the front and rear of the stop, independently parallel to the direction of the optical axis. By maintaining a constant size of image formation in spite of various object-distance changes in a projection system such as a head-up display (HUD) or head-mounted display (HMD), we can prevent the field of view from changing while focusing in an HUD or HMD. Also, to check precisely the state of the wiring that connects semiconductor chips and IC circuit boards, we can keep the magnification of the optical system constant, even when the object distance changes due to vertical movement along the optical axis of a testing device. Additionally, if we use this double-Gauss optical system as a vision system in the testing process of lots of electronic boards in a manufacturing system, since we can systematically eliminate additional image processing for visual enhancement of image quality, we can dramatically reduce the testing time for a fast test process. Also, the Gaussian bracket method was used to find the moving distance of each group, to achieve the desired specifications and fix magnification and image surface simultaneously. After the initial design, the optimization of the optical system was performed using the Synopsys optical design software.

• Journal of IKEEE
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• v.24 no.3
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• pp.735-742
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• 2020

The pick & place module is used as a core module in the process equipment for producing and inspecting semiconductor components. The conventional pick & place module has the disadvantage that the precision and durability of the system are reduced and the size and weight of the module are increased by using a conversion device that converts rotary motion into linear motion. In this study, we proposed a pick & place module that implements up-and-down linear motion without a conversion device by improving such disadvantage and employs a linear motor with no limit on average thrust and travel distance. Design parameter values, that can reduce cogging force while maintaining average thrust by selecting parameters for designing a core type linear motor with a large thrust to volume ratio and analyzing the effect of cogging force according to design parameter changes through magnetic analysis, was selected. Average thrust and cogging force were measured for the pick & place module composed of the manufactured linear motor and compared with the design values.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.37 no.10
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• pp.1017-1026
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• 2009

The solar cell system operates by facing the sun-light. Minor cracks, static discharge, and thermal shock that can happen during production/testing phase can lead to degradation in performance during operation, since solar cells are exposed to extreme thermal/mechanical environment in space. In order to detect small cracks and internal damages in the solar cells due to thermal shocks, which are the core units of a solar cell system, expensive equipment, complicated test process, and much time are required. Therefore, a qualitative method for easily and quickly testing the 'health' of solar cell functionality is required. This dissertation describes a theoretical and technical grounds for quickly and easily evaluating the health of solar cells using electroluminescence effect of Gallium-Arsenide solar cells that are most widely used by spacecrafts in recent years. Also described in the dissertation is the technical issues and constraining factors for applying the proposed method to actual space-rated solar cell systems.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Journal of the Korean Society of Radiology
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• v.6 no.2
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• pp.137-142
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• 2012

This study is investigated dose change on intra-oral radiography when same conditions under the others unit and same unit under the different exposed conditions. Three different radiation devices were studied. Exposure to the upper anterior, premolar and molar on the variant time and dose measure was using semiconductor radiation dose meter. Obtained film density value was analyzed to the belong in the range of diagnosis. Results for dose of each region were less dissimilar between the maximum and minimum. Its value was different 10 times as many as 3 times. In addition, the range of film density was 2.10 ~ 2.95. These values were exceeded on the allow density of diagnostic value '0.25 ~ 2.0'. Even if the same device and the same condition, measured dose was considerable differance and film density was showed show the inappropriate density range. Those can be caused the patient's re-take and patient's diagnostic errors so patients has affected direct and indirect radiological harm. Therefore, dental radiography devices will be required periodical maintenance and also provided standard on the exposure and processing conditions.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.598-603
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• 2019

Three-dimensional shape measurement technology is used in various industries. Among them, optical three-dimensional shape measurement techniques based on the optical trigonometry are mainly used in the field of semiconductor product inspection, where large quantities of three-dimensional shape measurements are made daily in factories and fine measurements are also required. The light source and the drive circuit, which are components of three-dimensional measurement equipment based on this optical trigonometry, produce heat generated by prolonged operation, and may be exposed to conditions where the ambient temperature is not constant, resulting in temperature-induced measurement errors. In this study, the compensation method of the Thermal Errors for Phase Measuring Profilometry is proposed. Three-Dimensional Shape Measurement Equipment based on Phase Measuring Profilometry is implemented to measure the height of an object and ambient temperature for 10 Hours, and a regression line was obtained line by making simple linear regression using measured temperature and height values. This regression line was used to correct the error of the height measurement according to the temperature, and thermal error was from 139.88 um(Micrometer) to 13.12 um.

• Journal of Internet Computing and Services
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• v.25 no.1
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• pp.99-107
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• 2024

Along with economic growth and industrial development, there is an increasing demand for various electronic components and device production of semiconductor, SMT component, and electrical battery products. However, these products may contain foreign substances coming from manufacturing process such as iron, aluminum, plastic and so on, which could lead to serious problems or malfunctioning of the product, and fire on the electric vehicle. To solve these problems, it is necessary to determine whether there are foreign materials inside the product, and may tests have been done by means of non-destructive testing methodology such as ultrasound ot X-ray. Nevertheless, there are technical challenges and limitation in acquiring X-ray images and determining the presence of foreign materials. In particular Small-sized or low-density foreign materials may not be visible even when X-ray equipment is used, and noise can also make it difficult to detect foreign objects. Moreover, in order to meet the manufacturing speed requirement, the x-ray acquisition time should be reduced, which can result in the very low signal- to-noise ratio(SNR) lowering the foreign material detection accuracy. Therefore, in this paper, we propose a five-step approach to overcome the limitations of low resolution, which make it challenging to detect foreign substances. Firstly, global contrast of X-ray images are increased through histogram stretching methodology. Second, to strengthen the high frequency signal and local contrast, we applied local contrast enhancement technique. Third, to improve the edge clearness, Unsharp masking is applied to enhance edges, making objects more visible. Forth, the super-resolution method of the Residual Dense Block (RDB) is used for noise reduction and image enhancement. Last, the Yolov5 algorithm is employed to train and detect foreign objects after learning. Using the proposed method in this study, experimental results show an improvement of more than 10% in performance metrics such as precision compared to low-density images.