• Title/Summary/Keyword: 미소결함

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A Study on the Method of Magnetic Flux Leakage NDTfor Detecting Axial Cracks (축방향 미소결함 검출을 위한 자기누설 비파괴 검사 방법에 관한 연구)

  • Yun, Seung-Ho;Park, Gwan-Soo
    • Journal of the Korean Magnetics Society
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    • v.21 no.1
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    • pp.23-31
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    • 2011
  • From among the NDT (nondestructive testing) methods, the MFL (magnetic flux leakage) method is specially suitable for testing pipelines because pipeline has high magnetic permeability. The system applied to MFL method is called the MFL PIG. The previous MFL PIG showed high performance in detecting the metal loss and corrosions. However, MFL PIG is highly unlikely to detect the cracks which occur by exterior-interior pressure difference in pipelines and the shape of crack is long and very narrow. In MFL PIG, the magnetic field is performed axially and there is no changes of cross-sectional area at cracks that the magnetic field passes through. Cracks occur frequently in the pipelines and the risk of the accident from the cracks is higher than that from the metal loss and corrosions. Therefore, the new PIG is needed to be researched and developed for detecting the cracks. The circumferential MFL (CMFL) PIG performs magnetic fields circumferentially and can maximize the magnetic flux leakage at the cracks. In this paper, CMFL PIG is designed and the distribution of the magnetic fields is analyzed by using 3 dimensional nonlinear finite element method (FEM). In CMFL PIG, cracks, standards of NACE, are detectable. To estimate the shape of crack, the leakage of magnetic fields for many kinds of cracks is analyzed and the method is developed by signal processing.

A micridefects determination method of the interface by ultrasonic testing image processing (초음파탐상 화상에 의한 이종재 경계면의 미소결함 결정법)

  • 김재열;박환규;조의일
    • Journal of the korean Society of Automotive Engineers
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    • v.14 no.5
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    • pp.107-116
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    • 1992
  • Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circle and medical world. An Ultrasonic wave transmitted from a focused beam tranducer is being expected as a powerful tool for NDE of the delamination. The Ultrasonic NDE of the delamination is based on the form of the wave reflected from the interface. In this study results, automatically repeated discrimination analysis method can be devided in the category of all kinds of defects on semiconductor package, and also can be possible to have a sampling of partial delamination.

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A Study on the Microdefect Detection of Semiconductor Package by Digital Ultrasonic Image Processing (디지탈 초음파 화상처리에 의한 반도체 패키지의 미소결함 검출에 관한 연구)

  • Kim, J.Y.;Han, E.K.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.10 no.2
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    • pp.43-49
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    • 1990
  • Ultrasonic testing is one of the most useful NDT method for detection of microdefect in the opaque materials. Recently, many applications of the ultrasonic techniques have been extended widely in the new field like electron is and advanced materials. From the result of the experiment, we have hardly found out a crack in the internal parts of the resin and a delamination between chip and resin because of poor performance of the system.

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Flaw Detection in a Conductor Using Sensor Head of Amorphous Wire (비정질 와이어를 센서헤드로 이용한 금속의 미세결함 검출)

  • Kim, Y.H.;Shin, K.H.
    • Journal of the Korean Magnetics Society
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    • v.12 no.5
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    • pp.174-178
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    • 2002
  • Ac magnetic field was changed in the vicinity of a flaw because of the distribution of eddy current within a conductor, when the magnetic field was applied to a conductor having a flaw. The flaw detection was performed by using Co-based amorphous wire sensor head. The wire has almost 0 magneto-striction and high permeability. An comparative uniform magnetic field was applied to a 1㎜ thick copper plate and a 25㎛ thick aluminum sheet conductor using spiral typed coil. The size of the coil has 40㎜$\times$40㎜ outer width and 8㎜$\times$8㎜ inner width. The copper plate and the aluminum sheet has 0.5㎜ and 0.1㎜ wide gap, respectively. The frequency range of applied field was 100㎑∼600㎑. The induced voltage difference of 2.5㎷ was obtained in the maximum voltage and minimum one measured across the gap of the 1mm thick conductor. In the case of aluminum sheet, 0.4㎷ was obtained. From this results, the effectiveness of Co-based amorphous wire was confirmed in the ECT technique.

A Study on the Thickness Measurement of Thin Film and the Flaw Detection of the Interface by Digital Signal Processing (디지털 신호처리에 의한 박판두께측정 및 접합경계면의 결함검출에 관한 연구)

  • Kim, Jae-Yeol;Yiu, Shin;Kim, Byung-Hyun
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.123-127
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    • 1997
  • Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circles and medical world, An Ultrasonic wave transmitted from a focused beam transducer is being expected as a powerful tool for NDE of micro-defect. The ultrasonic NDE of the defect is based on the form of the wave reflected form the interface In this study, regarding to the thickness of film which is in opaque object and thickness measurement was done by MEM-cepstrum analysis of received ultrasonic wave. In measument results, film thickness which is beyond distance resolution capacity was measured accurately. Also, automatically repeated discrimination analysis method can be decided in the category of all kinds of defects on semiconductor package.

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Epitaxial Growth of Nickel Silicide $(NiSi_2)$ in Vacuum Deposited Nickel and Gold Films on (III) Silicon Single Crystals (규소(III) 단 결정에 진공 증착한 닉켈과 금 박막에서 $NiSi_2$의 적층성장)

  • 윤기현;이희수
    • Journal of the Korean Ceramic Society
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    • v.13 no.3
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    • pp.55-62
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    • 1976
  • 순수한 닉켈과 금 박막을 (III)규소 단 결정위에 진공 증착시켰다. Ni/Au/Si나 Au/Ni/Si시료를 진공중에서 약 55$0^{\circ}C$로 가열하였을 때 육방정 혹은 변형된 육방정의 미소 결정들이 규소 기질위에 형성되었다. 이들 미소 결정들의 형성과정 및 조성은 X-선 회절법, scanning electron microscopy 및 scanning Auger microprobe 법을 사용하여 결정하였다. 이들 미소 결정은 NiSi2임이 확인되었다. Ni/Au/Si 시료에서는 Au-Si 공융점(37$0^{\circ}C$) 이상으로 온도가 증가됨에 따라 닉켈과 규소가 Au-Si 공융체 속으로 이동한 후 반응하여 NiSi2를 형성하였다. Au/Ni/Si 시료에 있어서의 Au-Si 공융체 형성은 닉켈 박막에 있는 바늘구멍형의 표면 결함과 관련 지을 수 있겠다. 금이 닉켈 박막의 grain boundary를 통하여 Ni/Si 계면으로 확산되어 그 계면을 습윤시킨 다음 Au-Si 공융체를 형성하였다. 이런 Au-Si 공용체는 닉켈과 규소 원자에 대한 높은 확산 매질로서 작용하여 NiSi2 형성을 촉진시켰다. 표면에 평행한 (III)규소면 위의 NiSi2 미소 결정은 유사한 육방정으로 나타났으며, 경사진 미소결정은 부등변 사변형과 유사하였다. Auger 스펙트럼 및 Ni, Au 및 Si에 대한 내층조성(indepth Composition Profiles)은 NiSi2 미소 결정이 Au-Si 공융체의 matrix에 미소 부분으로 나타났음을 보여주었다.

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The Effect of the Microdefects in Czoscralski Si wafer on Thin Oxide Failures (Thin Oxide 불량에 미치는 Czochralski Si 웨이퍼의 미소결함의 영향)

  • 박진성;이우선;김갑식;문종하;이은구
    • Journal of the Korean Ceramic Society
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    • v.34 no.7
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    • pp.699-702
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    • 1997
  • The cross sectional image of thin oxide failure of MOS device could be observed by Emission Microscope and Focused Ion Beam at the weak point. The oxide failures in low electric field was associated with the presence of a particle or abnormal pattern. The failures occuring at medium field are related to a pit of Si substrate. The pits could be originated from the microdefects of Cz Si wafer.

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공명초음파분광법을 활용한 광컨넥터용 결합소자의 결함 평가

  • 김성훈;이길성;양인영
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.48-48
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    • 2004
  • RUS(공명초음파분광법)는 비파괴 검사법의 하나로서 공명 주파수와 주파수 응답을 매우 정확하게 측정할 수 있으며, 탄성학적인 성질과 이방성을 결정하는데 이용 가능하다. Paul Heyliger와 Hassel Ledbetter는 steel block의 표면 크랙과 복합적층물의 내부 손상을 검출하는데 RUS를 사용하였으며, Jay G. Saxton은 RUS를 이용하여 chops, cracks, voids등을 검출하므로써 RUS의 비파괴 검사기능으로서의 가능성을 찾았다. 현재 광섬유 응용 제품에 많이 이용되고 있는 광커넥터는 초정밀 가공을 필요로 하는 중요한 부품으로서 optical fiber, ball lense로 구성되어진다.(중략)

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Study on the Recovery and Recrystalligation of Cold-lolled Zr-based Alloys by Thermoelectric Power Measurement During Isothermal Annealing (TEP 분석을 이용한 냉간가공된 Zr-based 합금의 등온열처리에 따른 회복 및 재결정 거동에 관한 연구)

  • O, Yeong-Min;Jeong, Heung-Sik;Kim, Seon-Jin
    • Korean Journal of Materials Research
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    • v.11 no.6
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    • pp.483-491
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    • 2001
  • The recovery and recrystallization behavior of cold-rolled Zr-based alloys during isothermal annealing at temperatures from $575^{\circ}C$ to $650^{\circ}C$ was studied by thermoelectric power and Vickers microhardness measurement. The recovery and recrystallization resulted in the increase of TEP doe to the extinction of lattice defect, vacancy, dislocation and stacking fault during isothermal annealing after cold- rolling. The completion of recrystallization could be determined much clearly by TEP behavior than by microhardness change in Zr-based alloys. Especially, the recovery and recrystallization were classified separately by TEP behavior in Zr-0.4Nb-xSn alloys. From the analysis of TEP behavior and microhardness, the addition of Sn caused to form the interaction between stain field and dislocation, which resulted in the delay of recovery in Zr-based alloys. The precipitation due the addition of Nb suppressed the grain growth after recrystallization effectively in Zr-based alloys.

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