• Title/Summary/Keyword: 미세 전해 가공

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NO Reduction Mechanism of Electrolytically Cu-plated Activated Carbon Fibers (전해 구리도금된 활성탄소섬유의 NO 환원반응 메카니즘)

  • 신준식;박수진;김학용;이덕래
    • Proceedings of the Korean Fiber Society Conference
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    • 2003.04a
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    • pp.309-310
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    • 2003
  • 활성탄소 (activated carbons, ACs)는 넓은 비표면적을 가지고 있어 흡착용량이 크며, 발달된 미세공을 가지고 있기 때문에 오염물질의 제거능력이 높을 뿐만 아니라 경제적, 환경 친화적인 측면에서도 유리하다. 특히 섬유화된 할성탄소섬유 (activated carbon fibers, ACFs)는 균일한 세공이 표면에 노출되어 있어 흡착속도가 빠르며, 안정성과 재생성이 좋고 섬유상이기 때문에 가공이 용이하며 직포, 부직포, 시트 등의 형태로 만들어져 용매회수, 공업제품의 정제, 오폐수의 처리시설, 소각시설의 유해 배기가스의 흡착등에 널리 사용되고 있다.[1,2] (중략)

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Residual Stress Measurement of Micro Gold Electroplated Structure (마이크로 금 전해 도금 구조물의 잔류응력 측정)

  • Baek, Chang-Wook;Ahn, Yoo-Min
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.12
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    • pp.195-200
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    • 2000
  • In order to find a residual stress in the micro-machined beam, first natural frequency of the beam that has the residual stress inside is analyzed using the Rayleigh's energy method. Micro gold electroplated structure is fabricated by surface micro-machining process. The made structure is clamped-clamped beam and its 1st natural frequency is measured by resonance method. For the better estimation of the residual stress, an equivalent length of micro-machined beam to ideal beam is calculated by FEM. The residual stress is estimated from the equivalent length and the measured natural frequency.

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Effects of Shear Strains on the Developement of Texture and Microstructure of $90\%$ Drawn Copper Wire during Annealing ($90\%$ 단면감소율로 인발된 전해동의 어닐링시 집합조직과 미세조직 발달에 미치는 전단 변형의 영향)

  • Park, Hyun;Lee, Dong-Nyung
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2001.11a
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    • pp.55-62
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    • 2001
  • An electrolytic copper rod was drawn up to $90\%$ in area reduction and annealed under various conditions. The EBSD measurement of the drawn wire showed that in the center region the <111> + <100> fiber duplex texture was dominant, while in the middle and surface regions relatively defused textures developed with a little higher density in <11w>//wire axis. The inhomogeneous texture in the deformed wire gave rise to the inhomogeneous microstructure and texture after annealing. The annealing texture could be classified into the recrystallization texture developed during low temperatures and at the early stage at a high temperature and the growth texture developed after a prolonged annealing at the high temperature. The recrystallization temperature could be explained by the strain energy release maximization model and the growth texture was discussed based on the grain boundary mobility anisotropy.

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The fabrication of electro-chemical discharge machine for drilling microscopic glass hole (유리 미세 구멍 가공을 위한 전해 방전 가공기 제작)

  • Lee, Wang-Hoon;Lee, Young-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.05b
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    • pp.12-15
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    • 2002
  • In this paper, we fabricated a electro-chemical discharge machine for drilling microscopic glass hole. In this research, we used a glass plate and NaOH solution. From the experimental result, we knew that the change of voltage wave was caused by drilling microscopic hole of glass using electro-chemical discharge method. So, we can give a function of the power auto stop to electro-chemical discharge machine with the change of voltage wave.

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Micro-hole Machining Technology for using Micro-tool (마이크로 공구를 이용한 미세 구멍 가공기술)

  • 허남환;이석우;최헌종
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1897-1901
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    • 2003
  • Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

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Micro-hole Machining Technology for using Micro-tool (마이크로 공구를 이용한 미세구멍가공기술)

  • Heo, N.H.;Lee, S.W.;Choi, H.Z.
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.1787-1792
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    • 2003
  • Recently with the development of semiconductor technology, the miniaturization of parts and products as well as their high precision is required. In addition, as the national competitiveness is increasingly affected by the development of the micro parts through micro machining technology, the study of the micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tools under the size of $20{\mu}m$ and to machine micro holes using them. The fabrication is done by grinding and the application of ELID to the grinding wheel. The surface roughness of the micro tools is measured to evaluate the study.

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Review of Micro Electro-Chemical Machining (미세 전해가공 기술 동향)

  • Shin, HongShik
    • Journal of Institute of Convergence Technology
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    • v.2 no.2
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    • pp.25-29
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    • 2012
  • Micro machining technologies have been required to satisfy various conditions in a high-technology industry. Micro electrochemical process is one of the most precision machining methods. Micro electrochemical process has been divided into electrochemical etching through protective layer and electrochemical machining using ultrashort voltage pulses. Micro shaft can be fabricated by electrochemical etching. The various protective layers such as photo-resist, oxide layer and oxidized recast layer have been used to protect metal surface during electrochemical etching. Micro patterning on metal surface can be machined by electrochemical etching through protective layer. Micro hole, groove and structures can be easily machined by electrochemical machining using ultrashort voltage pulses. Recently, the groove with subnanometer was machined using AFM.

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Vibration Electrochemical Polishing for Localized Surface Leveling (미세표면 평활화를 위한 진동 전기화학 폴리싱)

  • Kim, Uksu;Kim, Youngbin;Park, Jeongwoo
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.2
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    • pp.148-153
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    • 2013
  • This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.

Microscopic hole fabrication of glass using electro-chemical discharge method (전해 방전법에 의한 유리의 미세 구멍 가공)

  • Lee, Wang-Hoon;Lee, Young-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.89-92
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    • 2001
  • In this paper, we studied on drilling a microscopic hole of glass using electro-chemical discharge methode. In this research, we fabricated a electro-chemical discharge machine for drilling glass hole. The used parameters to get a fine microscopic hole are the concentration of NaOH solution from 5wt% to 50wt%, the supply voltage from 10V to 40V and the fabricating time from 5 second to 50 second. Also, we used a 0.16mm glass plate. We learned from our experiment that, the fabrication most efficient when supply voltage is 25V-30V and concentration of NaOH solution 35wt% or less.

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