• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1047-1055
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• 2006

We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

• Korean Journal of Optics and Photonics
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• v.14 no.3
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• pp.312-320
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• 2003

The basic mechanistic aspects of the interaction and practical considerations related to polymer ablation were briefly reviewed. Photochemical and photothermal effects, which highly depend on laser wavelength have close correlation with each other. In this study, multi-scanning laser ablation processing of polymer with a DPSS (Diode Pumped Solid State) 3rd harmonic Nd:YVO$_4$ laser (355 nm) was developed to fabricate a three-dimensional micro shape. Polymer fabrication using DPSSL has some advantages compared with the conventional polymer ablation process using KrF and ArF laser with 248 nm and 193 nm wavelength. These advantages include pumping efficiency and low maintenance cost. And this method also makes it possible to fabricate 2D patterns or 3D shapes rapidly and cheaply because CAD/CAM software and precision stages are used without complex projection mask techniques. Photomachinability of polymer is highly influenced by laser wavelength and by the polymer's own chemical structure. So the optical characteristics of polymers for a 355 nm laser source is investigated experimentally and theoretically. The photophysical and photochemical parameters such as laser fluence, focusing position, and ambient gas were considered to reduce the plume effect which re-deposits debris on the surface of substrate. These phenomena affect the surface roughness and even induce delamination around the ablation site. Thus, the process parameters were tuned to optimize for gaining precision surface shape and quality. This maskless direct photomachining technology using DPSSL could be expected to manufacture tile prototype of micro devices and molds for the laser-LIGA process.

• Korean Journal of Optics and Photonics
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• v.17 no.5
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• pp.437-446
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• 2006

A fabrication method fur high-aspect-ratio microchannels in stainless steel using laser-assisted thermochemical wet etching is reported in this paper. The fabrication of deep microchannels with an aspect ratio over ten is realized by applying a multiple etching process with an optimization of process conditions. The cross-sectional profile of the microchannels can be adjusted between rectangular and triangular shapes by properly controlling laser power and etchant concentration. Excellent dimensional uniformity is achieved among the channels with little heat-affected area. Microchannels with a width ranging from 15 to $50{\mu}m$ can be fabricated with an aspect ratio of ten and a pitch of 150 m or smaller. The effects of process variables such as laser power, scan speed, and etchant concentration on the fabrication results, including etch width, depth, and cross-sectional profile are closely examined.

• Electrical & Electronic Materials
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• v.3 no.3
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• pp.161-177
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• 1990

최근의 재료합성기술 및 미세가공기술의 발전은 종래의 천연물질에는 없는 새로운 기능을 가진 신물질이나 새로운 디바이스의 제작을 가능하게 하고 있다. 여러가지 초박막 물질의 다층막이나 초격자는 그 형상 및 물질의 조합에 따라 모체의 물질과는 새로운 성질을 나타내는 것으로 크게 관심을 모으고 있다. 본 논문에서는 현재 연구가 활발히 진행되고 있는 반도체초격자에 관하여 그 종류 및 전자상태, 결정성장 및 평가법, 기초적 물성, 디바이스 응용 그리고 앞으로의 전망을 간단하게 총망라하여 소개해 보고자 한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.918-921
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• 2000

Micro-machining, one of the non-traditional machining techniques, can achieve a wanted shape of the surface using metal dissolution with electrochemical reaction and can be applied to the metal such as high tension, heat resistance and hardened steel. The workpiece dissolves when it is positioned close to the tool electrode in electrolyte and the current is applied. Traditional machining has been used in the industries such as cutting, deburring, drilling and shaping. The aim of this work is to develop Micro-machining techniques for micro shape by establishing appropriate machining parameters of micro-machining

• 기계와재료
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• v.23 no.3
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• pp.82-95
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• 2011

다결정압연판재는 열가공공정을 거쳐서 생산되므로 공정의 특성을 반영하는 미세조직/집합조직 특성을 가지게 된다. 결정립들은 특정방향으로 배향하고 결정립의 형상과 크기도 변화한다. 이러한 변화는 거시적으로 다결정판재의 이방성으로 귀결이 되는데, 근본적으로 판재를 구성하는 단결정들의 기계적 물성이 각각의 방향별로 이방성을 띄기 때문이다. 본 자료에서는 압연공정시 다결정판재의 수직/평면이방성의 발생원인을 집합조직과 결정소성학을 이용하여 제시하고자 하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.149-149
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• 2004

반도체 산업이 급속하게 발전함에 따라 고집적, 대용량이 요구되고 있으며, 이에 따라 선폭의 미세화, 웨이퍼 크기의 증가, 패턴의 다층화가 필수적인 조건으로 대두되고 있다. 이러한 요구를 만족시키기 위해서는 고정도의 표면상태와 칩과 웨이퍼 전면에서의 균일한 가공이 필요하다. 따라서 화학 기계적 연마를 통한 안정하고 고성능의 평탄화는 고집적 소자형성에 있어서 핵심 기술이 되고 있다.(중략)

• Journal of the Korean Society for Precision Engineering
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• v.21 no.12
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• pp.160-166
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• 2004

Self-Assembled Monolayers(SAMs) by alkanethiol adsorption to thin metal film are widely being investigated fer applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecule and bio molecule. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance of Self-Assembled Monolayers in selective etching of thin metal film. In this report, we present the several machining method to form the nanoscale structure by Mask-Less laser patterning using alknanethiolate Self-Assembled Monolayers such as thin metal film etching and heterogeneous SAMs structure formation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.219-222
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• 2003

Self-Assembled Monolayers(SAMs) by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecular and bio molecular. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance in selective etching of thin metal film of Self- Assembled Monolayers. In this report, we present the micromachining thin metal film by Mask-Less laser patterning of alknanethiolate Self-Assembled Monolayers.

• Proceedings of the KAIS Fall Conference
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• 2004.06a
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• pp.42-46
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• 2004

0.5mm thick steel is used to manufacture nail files. The first process is blanking the blank and then make about 300 holes of 0.8$\~$1.0mm in diameter. This process depends mainly on etching which takes $33\%$ of manufacturing cost and it can make manufacturing cost rise. The residual etching reagent is not environmentally friendly and the steel material is apt to rust as well. The key accomplishments of this research are to change the material from steel to stainless and develop a progressive perforating die in place of etching process.