• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.04a
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• pp.103-110
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• 1991

본 연구에서는 최근들어 첨단 가공기술로서 중요시되고있는 초정밀 경면가공기술의 기본원리를 이해하고 관련지식을 습득하여 향후 보다 나은 상태의 경면가공을 위한 기초를 확립하는데에그 목적을 두었다. 실험을 위한 공작기계는 초정밀 만능 연삭반( high precision universal grinder)에 플라이컷(fly-cut)방식에 의한 절삭가공이 가능 하도록 여러가지장치들을 부착하였으며, 절삭공구는 천연 다이아몬드를 사용하고, 피삭재는 A1-Cu-Ni-Mg 합금을 사용하였다. 본 실험에서는 주어진 조건내에서 어느정도의 표면 조도를 달성할수 있는지를 알아보고 그 과정을 통하여 공작기계, 공구, 피삭재등의 영향과 절삭력, 칩, 표면상태등을 고찰하여 여러가지 현상을 규명하여 향후의 발전을 위한 대책에 활용하고자 한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.129-129
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• 2004

본 연구에서는 나노스케일 절삭가공(nanometric cutting process)시에 미세 팁과 가공표면사이에서 발생하는 현상들에 대하여 분자동역학적 시뮬레이션을 통하여 살펴보았다 본 연구의 목적은 실험적으로는 파악하기 어려운 극미세 가공에서 발생하는 나노트라이볼로지적 현상을 이해하고, 이를 토대로 기계적 가공에 기반하여 개발된 '기계-화학적 나노리소그래피(Mechano-Chemical Scanning Probe Lithography)' 공정을 개선, 발전시키는데 있다. 기계-화학적 나노리소그래피 기술은 극초박막의 리지스트(resist)를 미세탐침을 이용하여 기계적 가공으로 제거하고 이로인해 표면으로 드러난 모재부분을 화학적 에칭에 의해 추가로 가공하여 원하는 패턴형상을 얻어내는 기술이다.(중략)

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.502-506
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• 2001

This paper presents a new method for cutting steel with a diamond tool using electrolysis. The electrolysis is adopted in the diamond cutting to prevent the high chemical activity between a diamond tool and an iron-based workpiece. The basic principle of the method is to oxdize a thin substrate of the workpiece by electrolysis ahead of the diamond tool which cuts the oxidized layer. A desired shape can be obtained by repeating this process. The cutting force is reduced because the diamond tool removes only the weakened material by electroysis. The reduction of the cutting force suppresses the excessive wear of the diamond tool. The oxidization penetrates several micrometers in depth along the previously formed shape. The corrosion rates depend on current density and make suggestions on the optimum cutting conditions.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.198-204
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• 2005

For precise micro V-grooving, ultrasonic elliptical vibration cutting (UEVC) is proposed using two parallel piezoelectric actuators, which are energized by sinusoidal voltages with a phase difference of 90 degrees. Experimental setup is composed of stacked PZT actuators, a single crystal diamond cutting tool, and a precision motorized xyz stage. It is found that the chip formed in the process of UEVC is discontinuous because of the periodic contacts and non-contacts occurring between the tool and workpiece. It is experimentally observed that the cutting force in the process of UEVC significantly reduces compared to the ordinary non-vibration cutting. In addition, the creation of burr during UEVC is significantly suppressed, which is attributable to the decrease in the specific cutting energy.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.11
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• pp.45-51
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• 2008

Successive micro-scale V-grooves and a grid of pyramids were machined by elliptical vibration tufting (EVC) to investigate feasibility of using EVC as an alternative method of creating micro-molds to photo-lithography and electroforming, which have been commonly employed. An elliptical vibration grooving machine was developed which consists of two orthogonally-arranged piezoelectric actuators, a diamond cutting tool, and a motorized xyz stage. The micro-scale features were machined on materials of copper, duralumin, nickel, and hastelloy and it was found that EVC significantly reduces cutting resistance and prohibits generation of side burrs and rollover burrs, thus resulting in improving machining qualify of micro-molds in ail experimented workpiece materials.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.109-110
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.934-937
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• 2001

It is well-known that the micro fabrication technology of micro parts are the high energy beam or silicon-based micro machining method such as LIGA Process, Laser machining, photolithography and etching technology. But, for fabricating complex 3-D structure it is better to use mechanical machining. This machining method by the mechanical machine tool with nanometer accuracy is getting attention in some field-especially micro optics machining such as grating, holographic lens, micro lens array, fresnel lens, encoder disk etc.. In this study, we survey the micro fabrication by mechanical cutting method and set up the mechanical micro machining system. And we carried out micro cutting experiments for micro parts with v-shape groove.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.167-172
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• 2002

Recent years, optical components'are widely used in optical communication industry for high speed and mass storage data processing. Micro grooving of planar lightwave circuit and glass, those are widely used in optical component, are realized by polycrystalline diamond tool with ultrasonic vibration. To know the characteristics of brittle materials cutting, ultrasonic vibration cutting tool and machining system are built for the experiment. Grooving on planar lightwave circuit and glass experiments are performed and their shape are measured by photograph with microscope. It reveals that better groove shape with low chipping of planar lightwave circuit and glass are obtained by micro grooving machining with ultrasonic vibration. These experiments are considered as a possibility to the micro grooving of optical communication components.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.249-254
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• 2004

광의 효율적 사용을 위해 표면에 마이크로 그루브가 새겨진 고성능 광학 부품의 개발이 활발하고, 이들 부품의 다량 생산을 위한 초정밀 금형제조기술이 각광을 받고 있다. 최근의 초정밀 미세 기계가공의 경우 간단한 공정으로 이러한 마이크로 그루브 금형을 제작할 수 있다. 특히 조명각 변조용 렌티큘러 렌즈와 같이 실린더형 그루브 금형의 경우에는 기존의 Lithography, MEMS, LIGA 등 광 에너지를 이용한 다른 제조방법들에서는 가공하기 어려운 점이 있으나, 기계가공에서는 쉽게 제작가능한 장점이 있다. 본 연구에서는 이러한 미세기계가공기술의 장점을 활용하여 U 형 마이크로 그루브를 가진 Lenticular 렌즈용 금형을 가공하고자 하였다. 가공에는 3 축 구동의 초정밀 미세 복합가공기와 단결정 천연 다이아몬드공구가 사용되었고, 가공방식은 마이크로 세이핑 공정을 적용하였으며, 가공 금형 재료에는 Brass와 무전해 Nickel이 사용되었다. 실험을 통하여 금형가공시의 절삭력, 칩 형상, 가공표면 등의 분석이 수행되었으며 이를 기반으로 여러 가지 가공문제점을 해결하고, 최종적으로 양호한 렌티큘러렌즈용 금형을 가공하였다.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.170-175
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• 1998