• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.6
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• pp.4013-4018
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• 2014

A 0.45 $cm^2$ DSSC device with a glass/FTO/blocking layer/$TiO_2$/N719(dye)/electrolyte/50 nm-Pt/50 nm-Au/FTO/glass was prepared to examine the stability of the Au/Pt bilayered counter electrode (CE) with electrolyte and the energy conversion efficiency (ECE) of dye-sensitized solar cells (DSSCs). For comparison, a 100 nm-thick Pt only CE DSSC was also prepared using the same method. The photovoltaic properties, such as the short circuit current density ($J_{sc}$), open circuit voltage ($V_{oc}$), fill factor (FF), and ECE, were checked using a solar simulator and potentiostat with time after assembling the DSSC. The microstructure of the Au/Pt bilayer was examined by optical microscopy after 0~25 minutes. The ECE of the Pt only CE-employed DSSC was 4.60 %, which did not show time dependence. On the other hand, for the Au/Pt CE DSSC, the ECEs after 0, 5 and 15 minutes were 5.28 %, 3.64 % and 2.09 %, respectively. The corrosion areas of the Au/Pt CE determined by optical microscopy after 0, 5, and 25 minutes were 0, 21.92 and 34.06 %. These results confirmed that the ECE and catalytic activity of Au/Pt CE decreased drastically with time. Therefore, a Au/Pt CE-employed DSSC may be superior to the Pt only CE-employed one immediately after integration of the device, but it would degrade drastically with time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.6
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• pp.493-501
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• 2000

The microstructure and electrical properties of ZnO-Pr$_{6}$/O$_{11}$-CoO-Er$_{2}$/O$_{3}$ based varistors were investigated with Er$_{2}$/O$_{3}$ additive content of the range 0.0 to 2.0 mol%. Most of the added Er$_{2}$/O$_{3}$ were segregated at the nodal points and grain boundaries and it coexisted with Pr$_{6}$/O$_{11}$ in the bulk intergranular layer. The average grain size was decreased in the range of 7.44 to 5.62${\mu}{\textrm}{m}$ at 130$0^{\circ}C$ and 18.36 to 9.11 at 135$0^{\circ}C$ with increasing Er$_{2}$/O sub 3/ additive content. The density of ceramics was in the range 4.87 to 5.08 g/cm$^3$ at 130$0^{\circ}C$ and 5.35 to 5.62 g/cm$^3$at 135$0^{\circ}C$. At 130$0^{\circ}C$ the varistors without Er$_{2}$/O$_{3}$ exhibited 29.66 in the nonlinear exponent and 28.23 $\mu$A in the leakage current whereas the varistors with 0.5 mol% Er$_{2}$/O$_{3}$ exhibited a high nonlinearity which is 52.78 in thenonlinear exhibited and 9.75 $\mu$A in the leakage current. At 135$0^{\circ}C$ the varistors without Er$_{2}$/O$_{3}$ exhibited a very poor nonlinearity indicating 2.08 in the nonlinear exponent and 133.79 $\mu$A in the leakage current whereas the varistors with 1.0mol% Er$_{2}$/O$_{3}$ exhibited a relatively high nonlinearity which is 36.79 in the nonlinear exponent and 5.92 $\mu$A in the leakage current. Therefore Er$_{2}$/O$_{3}$ was additive which greatly improve the nonlinearity. It is believed that ZnO-0.5 mol% Pr$_{6}$/O$_{11}$-1.0 mol% CoO-0.5 mol% Er$_{2}$/O$_{3}$ based ceramicss will be usefully used as a basic composition to develop the advanced pr$_{6}$/O$_{11}$-based ZnO varistors.ristors.ristors.

• Journal of the Korean Electrochemical Society
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• v.15 no.4
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• pp.222-229
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• 2012

We studied the electrochemical phenomena and increase of capacity according to the polymer composite electrode of two different polymeric materials with different the voltage range and capacity. Polyaniline (PANI) with relatively high voltage and small capacity and poly [1,2] bis-thio[1,8]-naphthylidine (PTND) with slightly low voltage and large capacity were used as polymer composite electrode materials. After PTND was synthesized, PANI was synthesized on the surface of PTND. The synthesis and the fine structure were analyzed by FT-IR, XPS, FE-SEM, and FE-TEM. Charge/discharge capacity and cyclic voltammetry measurements were carried out for the electrochemical performance as a polymer cathode active material for lithium secondary batteries. The discharge capacities of PANI/PTND after 1,5, and 10 cycles at 1.3~4.0 V voltage range and room temperature 167 mAh/g, 90 mAh/g, and 81 mAh/g. When we compared with PANI (80, 67, and 62 mAh/g), the discharge capacity after 10 cycles was improved about 30%. After 50 cycles, the discharge capacity of PANI/PTND was 67 mAh/g.

• Journal of the Korean Ceramic Society
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• v.34 no.2
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• pp.202-208
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• 1997

Bi-layered SrBi2Ta2O9(SBT) films were deposited on Pt/Ti/SiO2/Si sibstrates by rf magnetron sputt-ering at room temperature and then were annealed at 75$0^{\circ}C$, 80$0^{\circ}C$ and 85$0^{\circ}C$ for 1 hour in oxygen at-mosphere. The film composition of SrBi2Ta2O9 was obtained after depositing at room temperature and annealing at 80$0^{\circ}C$. Excess 20mole% Bi2O3 and 30 mole% SrCO3 were added to the target to compensate for the lack of Bi and Sr in SBT film. 200 nm thick SBT film exhibited and dense microstructure, adielectric constant of 210, and a dissipation factor of 0.05 at 1 MHz frequency. The films exhibited Curie temperature of 32$0^{\circ}C$ and a dielectric constant of 314 at that temperature under 100 kHz frequency. The remanent polarization(2Pr) and the coercive field(2Ec) of the SBT films were 9.1 $\mu$C/$\textrm{cm}^2$ and 85 kV/cm at an applied voltage of 3V, resspectively and the SBT film showed a fatigue-free characteristics up to 1010 cy-cles under 5V bipolar pulse. The leakage current density of the SBT film was about 7$\times$10-7A/$\textrm{cm}^2$ at 150 kV/cm. Fatigue-free SBT films prepared by rf magnetron sputtering can be suitable for application to non-volatile memory device.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.37-45
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• 2008

In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip chip assemblies were investigated for the flip chip interconnections on organic substrates with 100 um pitch. After multiple reflows at $250^{\circ}C\;and\;280^{\circ}C$, bump contact resistances were almost same regardless of number of reflows and reflow temperature. In the high temperature storage test, there was no bump contact resistance change at $125^{\circ}C$ up to 2000 hours. However, bump contact resistances slightly increased at $150^{\circ}C$ due to Kirkendall voids formation. In the electromigration test, Cu/SnAg double-bump flip chip assemblies showed no electromigration until about 600 hours due to reduced local current density. Finally, in the thermal cycling test, thermal cycling failure mainly occurred at Si chip/Cu column interface which was found out the highest stress concentration site in the finite element analysis. As a result, Al pad was displaced out under thermal cycling. This failure mode was caused by normal compressive strain acting Cu column bumps along perpendicular direction of a Si chip.

• The Journal of Korean Physical Therapy
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• v.18 no.1
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• pp.1-10
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• 2006

Purpose: This study was to investigate how induced microcurrent shoes affect relief of feet pain, which often occurs to persons who are more than fifty years old and how they prevent fatigue of feet generated during everyday life. The subjects of this study were comprised af five males and five females, who agreed with this research and ate more than fifty years old. And they all have plantar faciitis and pain in their feet. Methods: Subjects ware the induced microcurrent shoes far more than 4 hours everyday during the test. When they wore those shoes, they also wore the specially produced shacks made of silver-mixed thread and they were asked to avoid serious exercise. Prior to starting test and after the test, assessments were carried out two times. In the examination before the test, general shoes were used and in examination after the test, induced microcurrent shoes used. Muscle fatigue was measured by electromyography(MP150, Biopac, USA). When the walking rate of subjects on a treadmill was increased from 2.Km/h to 3Km/h for 10 minutes, muscle activities of a lower leg were measured during the whale walking process by MP150 remote monitoring system(TEL 100C). And pain was measured by VAS. Results: The results are as follows. 1. Comparisons of VAS before and after experimentation showed that degree of pain was significantly decreased(p < .05). 2. Degree of fatigue of Tibialis anterior was significantly decreased after 6 weeks of treatment(p < .05). 3. Degree of fatigue of Soleus was slightly decreased after 6 weeks of treatment, but did not show significant difference (p > .05). Conclusion: The above results suggest that induced microcurrent shoes is helpful decreasing fatigue of feet and relief of feet pain.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.148-148
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• 1999

다이아몬드에 버금가는 높은 경도뿐만 아니라 높은 화학적 안정성 및 열전도성 등 우수한 물리화학적 특성을 가진 입방정 질화붕소(cubic Boron Nitride)는 마찰.마모, 전자, 광학 등의 여러 분야에서의 산업적 응용이 크게 기대되는 자료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 기대되는 재료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 크게 기대된다. 이 때문에 각종의 PVD, CVD 공정을 이용하여 c-BN 박막의 합성에 대한 연구가 광범위하게 진행되어 많은 성공사례들이 보고되고 있다. 그러나 이러한 c-BN 박막의 유용성에도 불구하고 아직 실제적인 응용이 이루어지지 못한 것은 증착직후 급격한 박리현상을 보이는 c-BN 박막의 밀착력문제때문이다. 본 연구에서는 평행자기장을 부가한 ME-ARE(Magnetically Enhanced Activated Reactive Evaporation)법을 이용하여 c-BN 박막을 합성하고, 합성된 c-BN 박막의 밀착력에 미치는 공정인자의 영향을 규명하여, 급격한 박리현상을 보이는 c-BN 박막의 밀착력 향상을 위한 최적 공정을 도출하고자 하였다. BN 박막 합성은 전자총에 의해 증발된 보론과 (질소+아르곤) 플라즈마의 활성화반응증착(activated reactive evaporation)에 의해 이루어졌다. 기존의 ARE장치와 달리 열음극(hot cathode)과 양극(anode)사이에 평행자기장을 부여하여 플라즈마를 증대시켜 반응효율을 높혔다. 합성실험용 모재로는 p-type으로 도핑된 (100) Si웨이퍼를 30$\times$40 mm크기로 절단 후, 100%로 희석된 완충불산용액에 10분간 침적하여 표면의 산화층을 제거한후 사용하였다. c-BN 박막을 얻기 위한 주요공정변수는 기판바이어스 전압, discharge 전류, Ar/N가스유량비이었다. 증착공정 인자들을 변화시켜 다양한 조건에서 c-BN 박막의 합성하여 밀착력 변화를 조사하였다. 합성된 박막의 결정성 분석을 FTIR을 이용하였으며, Bn 박막의 상 및 미세구조관찰을 위해 투과전자현미경(TEM;Philips EM400T) 분석을 병행하였고, 박막의 기계적 물성 평가를 위해 미소경도를 측정하였다. 증착된 c-BN 박막은 3~10 GPa의 큰 잔류응력으로 인해 증착직후 급격한 박리현상을 보였다. 이의 개선을 위해 증착중 기판바이어스 제어 및 후열처리를 통해 밀착력을 수~수백배 향상시킬 수 있었다. c-BN 박막의 합성을 위해서는 증착중인 박막표면으로 큰 에너지를 갖는 이온의 충돌이 필요하기 때문에 기판 바이어스가 요구되는데, c-BN의 합성단계를 핵생성 단계와 성장 단계로 구분하여 인가한 기판바이어스를 달리하였다. 이 결과 그림 1에서 나타낸 것처럼 c-BN 박막의 핵생성에 필요한 기판바이어스의 50% 정도만을 인가하였을 때 잔류응력은 크게 경감되었으며, 밀착력이 크게 향상되었다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.43-49
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• 2010

Direct printing technology is an attractive metallization method, which has become immerging as "Green technology" to the conventional photolithography, on account of low cost, simple process and environment-friendliness. In order to commercialize the printed electronics in industry, it is essential to evaluate the electrical properties of conductive circuits using direct printing technology. In this contribution, we focused on the electrical characteristics of inkjet-printed circuits. A Cu nanoink was inkjet-printed onto a Bisaleimide triazine(BT) substrate with parallel transmission line(PTL) and coplanar waveguide(CPW) type, then was sintered at $250^{\circ}C$ for 30 min. We calculated the resistivity of printed circuits through direct current resistance by the measurement of I-V curve: the resistivity was approximately 0.558 ${\mu}{\Omega}{\cdot}cm$ which is about 3.3 times that of bulk Cu. Cascade's probe system in the frequency range from 0 to 30 GHz were employed to measure the Scattering parameter(S-parameter) with or without a gap between the substrate and the probe station chuck. The result of measured S-parameter showed that all printed circuits had over 5 dB of return loss in the entire frequency range. In the curve of insertion loss, $S_{21}$, showed that the PTL type circuits had better transmission of radio frequency (RF) than CPW type.

• Journal of the Korean Ceramic Society
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• v.42 no.2 s.273
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• pp.104-109
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• 2005

To study the role of PbO as the buffer layer, Pt/PZT/PbO/Si with the MFIS structure was deposited on the p-type (100) Si substrate by the r.f. magnetron sputtering with $Pb_{1.1}Zr_{0.53}Ti_{0.47}O_3$ and PbO targets. When PbO buffer layer was inserted between the PZT thin film and the Si substrate, the crystallization of the PZT thin films was considerably improved and the processing temperature was lowered. From the result of an X-ray Photoelectron Spectroscopy (XPS) depth profile result, we could confirm that the substrate temperature for the layer of PbO affects the chemical states of the interface between the PbO buffer layer and the Si substrate, which results in the inter-diffusion of Pb. The MFIS with the PbO buffer layer show the improved electric properties including the high memory window and low leakage current density. In particular, the maximum value of the memory window is 2.0V under the applied voltage of 9V for the Pt/PZT(200 nm, $400^{\circ}C)/PbO(80 nm)/Si$ structures with the PbO buffer layer deposited at the substrate temperature of $300^{\circ}C$.

• Korean Chemical Engineering Research
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• v.47 no.1
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• pp.84-88
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• 2009

Al doped $LiMn_2O_4$ cathode powders with fine size were synthesized by an ultrasonic spray pyrolysis method from the spray solution with citric acid and ethylene glycol. The as-prepared powders with spherical shape, porous structure and micron size turned into $LiMn_{11/6}Al_{1/6}O_4$ powders with micron size and regular morphology after post-treatment above $800^{\circ}C$. The $LiMn_{11/6}Al_{1/6}O_4$ powders had low initial discharge capacity of 94 mAh/g at a post-treatment temperature of $700^{\circ}C$. As the post-temperature increased from $750^{\circ}C$ to $1,000^{\circ}C$, the initial discharge capacities of the $LiMn_{11/6}Al_{1/6}O_4$ powders changed from 103 to 117 mAh/g. The $LiMn_{11/6}Al_{1/6}O_4$ powders had the maximum discharge capacity at a post-treatment temperature of $750^{\circ}C$. However, the $LiMn_{11/6}Al_{1/6}O_4$ powders post-treated at a temperature of $900^{\circ}C$ had the good cycle properties. The discharge capacities of the $LiMn_{11/6}Al_{1/6}O_4$ powders dropped from 107 to 100 mAh/g (93% capacity retention) by the 70th cycle at a current density of 0.1 C.