• Title/Summary/Keyword: 미세성형

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Fabrication of micro lens array using micro-compression molding (미세압축성형을 통한 플라스틱 미세렌즈의 성형)

  • Moon, Su-Dong;Kang, Shin-Il;Yee, Young-Joo;Bu, Jong-Uk
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.743-746
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    • 2000
  • Plastic microlenses play an important role in reducing the size, weight, and the cost of the systems in the fields of optical data storage and optical communication. In the present study, plastic microlens arrays were fabricated using micro-compression molding process. The design and fabrication procedures for mold insert were simplified by using silicon instead of metal. A simple but effective micro compression molding process, which uses polymer powder, were developed for microlens fabrication. The governing process parameters were temperature and pressure histories and the micromolding process was controlled such that the various defects developing during molding process were minimized. The radius and magnification ratio of the fabricated microlens were $125{\mu}m$ and over 3.0, respectively.

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Fabrication of Micro Lens Array Using Micro-Compression Molding (미세압축성형을 통한 플라스틱 미세렌즈의 성형)

  • Gang, Sin-Il;Mun, Su-Dong;Lee, Yeong-Ju;Bu, Jong-Uk
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.8
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    • pp.1242-1245
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    • 2001
  • Plastic microlenses play an important role in reducing the size, weight, and the cost of the systems in the fields of optical data storage and optical communication. In the present study, plastic microlens arrays were fabricated using micro-compression molding process. The design and fabrication procedures for mold insert were simplified by using silicon instead of metal. A simple but effective micro compression molding process, which uses polymer powder, were developed for microlens fabrication. The governing process parameters were temperature and pressure histories and the micromolding process was controlled such that the various defects developing during molding process were minimized. The radius and magnification ratio of the fabricated microlens were 125$\mu\textrm{m}$ and over 3.0, respectively.

Simulation of liquid crystal polymer injection molded parts with thin wall and multi holes (다공성 액정고분자 박판의 사출성형 전산모사)

  • 정만석;김성훈
    • Proceedings of the Korean Fiber Society Conference
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    • 2001.10a
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    • pp.287-290
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    • 2001
  • 최근 정보통신 산업의 급속한 발전으로 이동 통신용 단말기 및 반도체 칩 케리어 등의 플라스틱 부품의 초소형 경량화 요구가 증대되고 있다. 미세 사출성형용(micro injection molding) 박판의 사출을 위한 미세사출 성형 고분자 재료는 매우 우수한 용융 유동 특성을 가져야 하고, 반도체나 소형 엔지니어링 부품으로 사용하려면 높은 인장강도, 충격강도 및 치수안정성을 가져야 한다. (중략)

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Effects of Consolidation Methods and Surface Modified Layer on the Packing Structure of Nanometer Scale Alumina Powder (알루미나 나노분말의 충전구조엣 미치는 충전방법 및 표면개질층의 영향)

  • 이해원;전형우;박종구;이종호;송휴섭
    • Journal of the Korean Ceramic Society
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    • v.37 no.11
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    • pp.1078-1083
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    • 2000
  • 정전안정화 및 입체안정화를 동시에 적용한 복합안정화기구에 의하여 25 부피%의 나노 $Al_2$O$_3$슬러리를 제조하고, 이로부터 얻은 주입성형체, 원심성형체, 진공성형체의 기공구조 분석을 통하여 입자충전거동을 살펴보았다. 나노 알루미나 분말의 습식 성형체의 충전구조는 성형방법에 의하여 가해지는 외력의 영향을 크게 받지만, 반발력을 제공하는 표면장벽층의 상호작용에 의해서도 현저한 차이를 보이는 것으로 나타났다. 예비소결실험을 통하여 나노분말에서도 기공크기가 작고, 크기분포가 좁으며, 높은 밀도를 가진 균일성형체의 미세구조가 소결미세구조를 균일하게 하는데 필수적인 조건임을 확인하였다.

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Fabrication of Anisotropic Hexagram Particles by using the Micromolding Technique and Selective Localization of Patch (미세성형 기술과 패치의 선택적 제거방법을 이용한 이방성의 육각별 입자 제조)

  • Shim, Gyurak;Yeom, Su-Jin;Jeong, Seong-Geun;Kang, Kyoung-Ku;Lee, Chang-Soo
    • Clean Technology
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    • v.24 no.2
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    • pp.105-111
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    • 2018
  • This study presents a novel and eco-friendly process that can precisely control the location of the patches on the patch particles. The method of manufacturing these anisotropic hexagram patch particles consists of sequential combinations of two separate methods such as a sequential micromolding technique for fabricating patch particles and a selective localization method for controlling the location of patches on the patch particles. The micromolding technique was carried out using physicochemically stable material as a micromold. In order to fabricate the highly stable patch anisotropic hexagram particles, the perfluoropolyether (PFPE) micromold was used to the process of the micromolding technique because they could prevent the problem of diffusion of hydrophobic monomers while conventional poly(dimethylsiloxane) (PDMS) micromold is limited to prevent the problem of diffusion of hydrophobic monomers. Based on combination methods of the micromolding technique and the selective localization method, the reproducibility and stability have been improved to fabricate 12 different types of anisotropic hexagram patch particles. This fabrication method shows the unique advantages in eco-friend condition, easy and fast fabrication due to less number of process, the feasibility of a mass production. We believe that these anisotropic hexagram patch particles can be widely utilized to the field of the directional self-assembly.

Binderless Consolidation of Fine Poly-Si Powders for the Application as Photovoltaic Feedstock (태양전지(太陽電池) 원재료(原材料)로 사용(使用)하기 위한 폴리실리콘 미세분말(微細粉末)의 무점결제(無粘結劑) 성형(成形))

  • Shin, Je-Sik;Kim, Dae-Suk;Kim, Ki-Young;Shon, In-Jin;Moon, Byung-Moon
    • Resources Recycling
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    • v.18 no.1
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    • pp.38-43
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    • 2009
  • In this study, binderless consolidation processes of ultra foe Si powder, by-products of making high purity poly-Si in the current method, were systematically investigated for use as economical solar-grade feedstock. The average diameter of the silicon powder was $7.8{\mu}m$. The main contaminants of the fine silicon powder were $SiO_2$ type oxide and humidity. The chemical pretreatment using the HF solution was observed to be effective for the improvement of the compactability of the silicon powder and the density ratio and the strength of the silicon powder compacts. The yield of the binder-free consolidation process increased by 20% under a vacuum condition. In as-received state, the silicon powder were not pure enough to be used as solar grade feed-stock material. After the dry chemical treatments, a sufficiently high purity above solar-grade was able to be achieved.

Replication Characteristics of Micropatterns According to Mold Temperature in Ultrasonic Imprinting (초음파 임프린팅에서 금형온도에 따른 미세패턴의 전사특성 연구)

  • Min, Kyeong Bin;Park, Jong Han;Park, Chang Yong;Park, Keun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.1
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    • pp.51-57
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    • 2014
  • Ultrasonic imprinting is a novel process for replicating micropatterns on thermoplastic polymer substrates with low energy consumption and short cycle time. The polymer substrate is softened by the frictional heat and repetitive deformation energy under ultrasonic excitation; thus, a number of micropatterns are replicated on the softened polymer substrate. In the present work, the effect of mold temperature on the replication characteristics of ultrasonic imprinting is investigated. The temperature change in the patterned region is measured by varying the mold temperature. Numerical simulation is then performed for investigating pattern replication characteristics under various mold temperatures. In addition, pattern replication ratio and uniformity are compared through various experimental measurements. Through the results of these comparisons, it is found that the mold temperature has a significant positive effect on the replication characteristics of ultrasonic imprinting.

특집: 미래주도형 성형공정과 수치 해석기술 - 비정질 합금 온간 성형 공정에서의 미세 조직 연계 해석 기술

  • Lee, Gwang-Seok;Jeon, Hyeon-Jun
    • 기계와재료
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    • v.23 no.3
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    • pp.16-29
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    • 2011
  • 결정 합금 대비 비정질 합금은 높은 경도를 갖기 때문에 마모 저항성도 좋고 내부 식성 등 환경에 대한 저항성도 월등하며, 또한 과냉된 액상 상태까지 재가열하게 되면 낮은 점성도를 갖게 되므로 복잡한 3차원적인 형상을 가지는 부품을 환경에 대한 저항성, 피로 저항성, 강도 및 경도 등을 모두 고려하여 높은 정밀도를 가지고 제조하는 것이 가능하므로 우수한 물성을 갖는 구조 및 기능성 재료로의 다양한 응용이 타진되고 있다. 이러한 비정질 합금의 변형 거동에 대한 연구는 대부분 유리 천이 온도 이하에서의 전단 및 파단에 이르는 이른바 불균일 변형(Inhomogeneous Deformation) 거동에 대한 이해를 위한 실험 및 해석적 연구에 집중되어 왔다. 반면 상업화의 기반이 되는 고상 기반 2차 정형 성형은 과냉 액상 영역에서의 구조 완화 및 결정화롤 대표되는 미세 구조 제어 균일 변형(Homogeneous Deformation)에 대한 이해 없이는 불가능하므로, 이러한 관점에서 비정질 합금 특유의 점성 유동 특성을 이용한 균일 변형 응용 예시 및 미세구조 변화 연계 해석 기술의 현황을 소개하고자 한다.

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