1 |
Lan, H., Ding, Y., Liu, H. and Lu, B., 2007, "Review of the Wafer Stage for Nanoimprint Lithography," Microelec. Eng. Vol. 84, No. 4, pp. 684-688.
DOI
ScienceOn
|
2 |
Becker, J. and Heim, U., 2000, "Hot Embossing as a Method for the Fabrication of Polymer High Aspect Ratio Structures," Sens. Actuators A, Vol. 83, No. 1-3, pp. 130-135.
DOI
ScienceOn
|
3 |
Giboz, J., Copponnex, T. and Mele, P., 2007, "Micro- Injection Molding of Thermoplastic Polymers: a Review," J. Micromech. Microeng. Vol. 17, No. 6, R96-109.
|
4 |
Park, K. and Lee, S. I., 2010, "Localized Mold Heating with the Aid of Selective Induction for Injection Molding of High Aspect Ratio Microfeatures," J. Micromech. Microeng. Vol. 20, No. 3, 035002.
DOI
ScienceOn
|
5 |
Lin, C. H. and Chen, R., 2007, "Effects of mold Geometries and Imprinted Polymer Resist Thickness on Ultrasonic Nanoimprint Lithography," J. Micromech. Microeng., Vol. 17, No. 7, pp. 1220-1231.
DOI
ScienceOn
|
6 |
Yu, H. W., Lee, C. H., Ko, J. S., Shin, B. and Rho, C. H., 2008, "Polymer Replication Using Ultrasonic Vibration," Trans. Korean Soc. Mech. Eng. A, Vol. 32, No. 5, pp. 419-423.
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DOI
ScienceOn
|
7 |
Mekaru, H. and Takahashi, M., 2009, "Frequency and Amplitude Dependences of Molding Accuracy in Ultrasonic Nanoimprint Technology,"J. Micromech. Microeng., Vol. 19, No. 12, 125026.
DOI
ScienceOn
|
8 |
Seo, Y. S. and Park, K., 2012, "Direct Patterning of Micro-Features on a Polymer Substrate Using Ultrasonic Vibration,"Microsyst. Technol., Vol. 18, No. 12, pp. 2053-2061.
DOI
|
9 |
Jung, W., Ra, J. and Park, K., 2012, "Design Optimization of Ultrasonic Horn for Micro-pattern Replication,"Int. J. Precis. Eng. Manuf., Vol. 13, No. 12, pp. 2195-2201.
DOI
ScienceOn
|
10 |
Seo, Y. S., Lee, K. Y., Cho, Y. H. and Park, K., 2012, "Replication Characteristics of Micro-Patterns According to the Vibration Transmission Direction in the Ultrasonic Imprinting Process," Proc. J. Kor. Soc. Prec. Eng., Vol. 29, No. 11, pp. 1256-1263.
|
11 |
Scheer, H. C., Bogdanski, N., Wisseen, M. and Mollenbeck, S., 2007, "Imprintability of Polymers for Thermal Nanoimprint,"Microelec. Eng., Vol. 85, No. 5-6, pp. 890-896.
|
12 |
Wang, X., Yan, J., Li, R. and Yang, S., 2006, "FEM Investigation of the Temperature Field of Energy Director During Ultrasonic Welding of PEEK Composites,"J. Thermoplast. Compos. Mater., Vol. 19, pp. 593-607.
DOI
|