• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.101-101
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• 2009

압전 세라믹스는 진동, 변형, 압력 등의 기계적 에너지를 전기적 에너지로 혹은 전기적 에너지를 기계적 에너지로 변환시키는 소자로서의 기능을 가지며 조성의 개선 및 제조 기술의 진보가 계속되어 큰 관심을 받고 있다. 최근 audio의 고급화 및 자동차, 평면 TV, 고성능 통신기기, 디지털방송, 홈시어터 등 스피커의 성능이 크게 부각되면서 대기업에서부터 중소기업에 이르기까지 고성능 스피커의 개발에 박차를 가하고 있다. 압전 세라믹을 이용하여 음압을 변조하는 압전 스피커는 디스크 형상의 압전 프레이트를 단층 또는 다층으로 형성하여 기존의 마그네틱 스피커와는 차별되는 형태를 가진 스피커로서 응용하는 것이다. PSN-PZT계 조성을 개발하여 $d_{33}$, 전기기계결합계수($k_p$), 온도안정성 및 내구성 향상 및 특성향상을 위한 입경 조절 및 공정을 연구하고자 한다. 디스크 형태의 압전 세라믹을 이용하여 2, 3, 4 layer 이상의 멀티레이어 시편을 제작하였고, 여러 시편에서 크기 및 형상, 접합 방법 등에 따른 특성을 최적화하여 스피커의 특성을 향상 시키고자 한다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.212-217
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• 2022

Large thermal stress due to the difference between silicon carbide and graphite's coefficients of thermal expansion could be formed during crystal growing process of silicon carbide (SiC) at high temperature. The large thermal stress could separate the SiC seed crystals from graphite components, which bring about the drop of the seed crystal during crystal growth. However, the bonding properties of SiC seed crystal module has hardly reported so far. In this study, SiC and graphite were bonded using 3 types of bonding agents and a three-point bending tests using a mixed-mode flexure test were conducted for the bonded samples to evaluate the bonding characteristics between SiC and graphite. Raman spectroscopy, X-ray Photoelectron Spectroscopy, and X-ray Computed Tomography were used to analyze the bonding characteristics and the microstructures of the SiC-graphite interfaces bonded with the bonding agents. As results, an excellent bonding agent was chosen to fabricate SiC seed crystal module with 50 mm in diameter. An SiC single crystal with 50 mm in diameter was successfully grown without falling out during top seeded solution growth of SiC at high temperature.

• Journal of Korean Society of Steel Construction
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• v.18 no.3
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• pp.395-403
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• 2006

Recently constructed bridges often have long spans and simple structure details considering not only the function but other important factors such as aesthetics, maintenance, construction duration and life cycle cost. Therefore, bridges require high-performance steels like extra-thick plate steels and thermo-mechanical control process (TMCP) steels. TMCP stels are now gaining wide attention due to their weldability improved strength and toughness. Recently, SM570-TMC steel, which is a high-strength TMCP steel with a tensile strength of 600 MPa, has been developed and applied to steel structures. However, using this steel in building steel structures requires the elucidation of not only material characteristics but also the mechanical characteristic of welded joints. In this study, high-temperature tensile properties of SM570-TMC steel were investigated through the elevated temperature welded joints of SM570-TMC steel were studied through the three-dimensional thermal elasticplastic analyses on the basis of mechanical properties at high temperatures obtained from the experiment.

• Journal of the Korean Ceramic Society
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• v.39 no.10
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• pp.955-962
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• 2002

The microstructure change of brazed $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer were examined to clarify the effects of brazing process conditions such as brazing time and temperature on the mechanical properties and reliability of brazed joints. For the brazed joint above 900${\circ}C$, the Cu buffer layer was completely dissolved into brazing alloy and the thickness of reaction product formed at $Si_3N_4$/brazing alloy joint interface was abruptly increased, which could increase the amounts of residual stress developed in the joint. The fracture strength of brazed $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer at 950${\circ}C$ was much reduced comparing to those of joints brazed at the lower temperature. But, it was found that the effects of brazing time was not critical on the mechanical properties as well as the reliability of $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer brazed at the temperature below 900${\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.194-195
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• 2006

개인 휴대 통신 기기의 급속한 발달로 인해 부품의 소형화, 고집적화가 중요한 요소로 대두되고 있으며 이를 위해서는 모듈내부에 3차원적인 수동소자의 내장이 가능한 LTCC (Low Temperature Co-fired Ceramics) 공정이 각광받고 있다. Embedded Capacitor를 제조하기 위해 유전율이 7.6과 6.5인 LTCC 재료를 이종접합 하여 제조하였으며 이종재료의 수축거동 차이에 의한 camber가 발생하였다. 이를 해결하고 또한 고주파 부품용 정밀회로 패턴을 구 현하기 위해 PLAS 방식의 Constrained Sintering 공정을 적용하여 camber 문제를 해결하였으며 capacitance 값이 두 이종재료의 유전율과 1:1로 비례하지 않았는데 이는 유전율 65 tape에 잔존하는 기공 때문으로 판단되며 미세구조로써 확인하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.6
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• pp.237-243
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• 2020

In this study, a silane-based coating was applied to improve corrosion resistance and thermal efficiency performance of a brazed plate heat exchanger (BPHE) composed of stainless plate and copper (Cu) brazing. Although the selected coating material was applied to the BPHE by evaluating the corrosion and contact angle according to the coating material, the result of the heat transfer performance evaluation showed that the thermal efficiency was lower than that of the uncoated BPHE. It was analyzed that the adhesion of the coating agent to the flow path inside the BPHE and the residual coating agent on the surface acted as heat resistance, preventing heat transfer. This is due to the structural characteristics of the BPHE in which a fine flow path exists inside, and it is believed that manufacturing after coating the surface of the flow path in advance in the manufacturing process of the BPHE can improve heat transfer performance.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.121-128
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• 2005

Solder joints in microelectronic devices are frequently operated at an elevated temperature in service. They also experience plastic deformation caused by temperature excursion and difference in thermal expansion coefficients. Deformed solders can go through a recovery and recrystallization process at an elevated temperature, which would alter their microstructure and mechanical properties. In this study, to predict the changes in mechanical properties of Pb-free solder joints at high temperatures, the high temperature microhardness of several Pb-free and composite solders was measured as a function of temperature, deformation, and annealing condition. Solder alleys investigated include pure Sn, Sn-0.7Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, Sn-2.8Ag-7.0Cu (composite), and Sn-2.7Ag-4.9Cu-2.9Ni (composite). Numbers are all in wt.$\%$ unless specified otherwise. Solder pellets were cast at two cooling rates (0.4 and $7^{\circ}C$/s). The pellets were compressively deformed by $30\%$ and $50\%$ and annealed at $150^{\circ}C$ for 2 days. The microhardness was measured as a function of indentation temperature from 25 to $130^{\circ}C$. Their microstructure was also evaluated to correlate with the changes in microhardness.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.30 no.5A
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• pp.425-431
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• 2010

The phase distribution in a multi-phase material strongly affects its material properties. Therefore, a proper method to describe the phase distribution of a material is needed. In this research, probability distribution functions, two-point correlation and lineal-path functions, are used to represent the probabilistic phase distributions of a material. The probability distribution function is calculated using a numerical method and is described as an analytical form via exponential curve fitting with three parameters. Application of analytical form of probability distribution function is investigated using two-phase polycrystalline solids and soil samples. It is confirmed that the probability distribution functions can be represented as an exponential form using curve fitting which helps identifying the applicability of a representative volume element(RVE).

• Korean Journal of Materials Research
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• v.1 no.2
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• pp.105-112
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• 1991

In PLZT system, a new type of material for piezoelectric actuator was developed and its properties were investigated. This material consists of three layers : a piezoelectric ceramic layer, an interlayer which composition changes gradually, and another piezoelectric layer. This kind of materials is called functionally Gradient Materials(FGM). The composition of these layers were selected from the $(Pb,\;La)(Zr,\;TiO_3$ system through the concept of materials design. Sintered FGM at $1300^{\circ}C$, 2hr has an interlayer of about $20\mu\textrm{m}$ with no distorted damage. Dielectric and piezoelectic properties of FGM show intervalues of each side composition. The strain-voltage characteristics in FGM system was improved comparison with any single composition. Especially, the FGMs were fabricated which has high piezoelectric-low dielectric composition and low piezoelectric-high dielectric composition. The properties of both FGMs were significantly improved.

• Journal of the Korea Concrete Institute
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• v.21 no.3
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• pp.327-335
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• 2009

In the seismic region, non-ductile structures often form soft story and exhibit brittle collapse. However, structure demolition and new structure construction strategies have serious problems, as construction waste, environmental pollution and popular complain. And these methods can be uneconomical. Therefore, to satisfy seismic performance, so many seismic retrofit methods have been investigated. There are some retrofit methods as infill walls, steel brace, continuous walls, buttress, wing walls, jacketing of column or beam. Among them, the infilled frames exhibit complex behavior as follows: flexible frames experiment large deflection and rotations at the joints, and infilled shear walls fail mainly in shear at relatively small displacements. Therefore, the combined action of the composite system differs significantly from that of the frame or wall alone. Purpose of research is evaluation on the seismic performance of infill walls, and improvement concept of this paper is use of SHCCs (strain-hardening cementitious composites) to absorb damage energy effectively. The experimental investigation consisted of cyclic loading tests on 1/3-scale models of infill walls. The experimental results, as expected, show that the multiple crack pattern, strength, and energy dissipation capacity are superior for SHCC infill wall due to bridging of fibers and stress redistribution in cement matrix.