• Applied Chemistry for Engineering
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• v.30 no.2
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• pp.212-218
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• 2019

To investigate the effect of the oxyfluorination of carbon nanotubes (OF-CNTs) on electroless Ni deposition and electromagnetic interference shielding efficiency (EMI SE), CNTs were treated with a mixture of oxygen and fluorine gases and sequentially deposited with nickel. These samples were then manufactured into thin films on a polyimide film to evaluate their EMI SE. The surface chemical property of OF-CNTs was investigated by X-ray photoelectron spectroscopy. From the results of thermogravimetric and scanning electron microscopic analyses, it was found that both the amount of deposited Ni and the surface morphology changed depending on oxyfluorination. Moreover, the Ni-deposited CNTs pretreated with $O_2:F_2=1:9vol%$ exhibited the maximum EMI SE as approximately 19.4 dB at 1 GHz. These results were attributed to the formation of oxygen and fluorine functional groups on the surface of CNTs due to the oxyfluorination, and the functional groups enabled to deposit a suitable amount of Ni and improve the dispersion in the deposited solution.

• Applied Chemistry for Engineering
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• v.8 no.5
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• pp.742-748
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• 1997

Diamond films which have high hardness and thermal conductivity can be used to improve the performance of WC-Co as a cutting tool material. However, it is difficult to get such coatings of good uniformity and adhesiveness due to the surface characteristics of WC-Co. To get better coatings, some techniques, such as the surface treatment of substrate or the formation of interlayer between substrate and diamond film, have been tried. In the present work, the nickel interlayer is formed onto WC-Co by electroless Ni-P plating, which is introduced as a new method, and then diamond film is deposited on the interlayer. Formation and uniformity of three layers, i.e., substrate, electroless plate, and diamond film, and the adhesiveness of interlayers were studied. To investigate the effects of pretreatment on electroless plating, two different methods such as acid treatment and diamond powder treatment were used. The effects of heat treatment of the electroless plated surface on adhesiveness between the substrate and the interlayer were examined. It was found that as the temperature increases, the Ni crystals grow and then result in improved adhesiveness. Diamond film coatings of pure diamond phase were obtained at $800^{\circ}C$. It is concluded that the heat treated electroless Ni-P plating can be effectively used as a interlayer between WC-Co substrate and diamond film.

• Applied Chemistry for Engineering
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• v.25 no.3
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• pp.268-273
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• 2014

In this study, multi-walled carbon nanotubes (MWCNT) were treated with nickel by electroless plating method for improving electromagnetic interference (EMI) shielding performance of MWCNT. The physical properties of electroless plated MWCNT were analyzed by using ultra-high resolution scanning electron microscope (UHR-SEM), thermogravimetry (TGA), sheet resistance analyzer and EMI shielding analyzer. EMI shielding efficiencies of nickel electroless plated MWCNT were measured to be 16 dB from 800 MHz band, which was 1.6 times increased compared to that of the activated MWCNT. Also, the average sheet resistance of nickel electroless plated MWCNT was measured to be $70{\Omega}/sq$, which was 56% decreased compared to that of the activated MWCNT. This result could be attributed to the plating morphology on the surface of MWCNT. This result could be attributed to uniformity of plating morphology on the surface, which has more effect on EMI shielding efficiency than the amount of nickel plating.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.39-44
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• 2020

Recently, numerous researches are being conducted in flexible substrate to apply to wearable devices. Particularly, Conductive substrate researches that can implement the wearable devices on clothing are massive. In this study, we formed fiber substrate spraying CNT and Pd mixed solution on it and plated metal layer with electroless plating. Used SEM equipment and EDS analysis to analysis structure of the plated fiber substrate and discovered Ni layer was created. For check electrical properties, mapping was performed to check surface resistance and distribution of resistance of electroless plated fiber substrate with 4-point probe. It was confirmed that conductivity was improved as the duration of electroless plating was increased, and it was found that distribution of resistance by surface location was uniform. Changes in resistance due to mechanical stress were measured through tensile, bending, and twisting tests. As a result, it was confirmed that resistance change of flexible substrate gradually disappeared as plating time increased. Using UTM (Universal testing machine), it was analyzed mechanical properties of the electroless plated substrate with respect to changes in plating time were improved. In the case of conductive fiber substrate in which electroless plating was performed for 2 hours, tensile strength was increased by 16 MPa than fiber substrate. Based on these results, we found that Ni-CNT-Fabric flexible substrate is adequate for clothing-intergrated conductive substrate and we positively expect that this experiment shows flexible substrate can adapt to and develop not only a wearable device technology but also other fields needing flexibility such as battery, catalyst and solar cell.

• Proceedings of the KAIS Fall Conference
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• 2004.11a
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• pp.103-106
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• 2004

플라스틱 무선부품에서 발생하는 전자파를 차폐하기 위한 도금연구를 하였다. ABS 수지상에 습식도금법과 기상도금법을 이용하여 전기전도도가 우수한 Ag를 도금하였다. Sputtering공정시 압력, 시간, 전력이 증가함에 따라 Ag 입자가 조대화되고 증착속도가 증가되었다. 그리고 탈지 후 plasma, 탈지 후 Etching, 인가 전력 70W$\~$110W, 증착압력 4×10-2torr이하, 증착시간 5min$\~$6min에서 5B의 밀착력과 100dB 이상의 차폐효과가 계산되었다. 무전해 Ag 도금의 경우 최고 0.47$\mu$m/min의 도금속도와 plasma를 이용한 도금 전처리가 깨끗한 도금표면을 나타냈고 모든 조건에서 5B의 밀착력을 나타냈으며 100dB 이상의 차폐효과가 계산되었다.

• Polymer(Korea)
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• v.30 no.6
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• pp.471-477
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• 2006

Ion exchange metal composite(IPMC) has toughness equivalent to the range of human's muscle, transformation-actuation force by relatively low voltage and the fast response time. Thus, as a new method for preparing thicker IPMC, the solution casting method to make the films of various thicknesses out of liquid nation was attempted in this study. To reduce the surface resistance of electrode, the first plated electrode prepared by Oguro method was replated with Au and Ir using ion beam assisted deposition(IBAD). The microstructures of electrode surfaces before and after IBAD plating were investigated using SEM. The change of water and ion-conductivity in IPMC were measured under applied voltage. The displacement and driving force of IPMCs with various thicknesses were measured to evaluate the driving properties.

• Polymer(Korea)
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• v.33 no.1
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• pp.33-38
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• 2009

Monodisperse polystyrene and its copolymer beads containing amine function were prepared for the electroless silver plating using reduction of silver alkylcarbamate complex in organic solvent. Soap-free emulsion polymerization was adopted for the polymerization of styrene, divinylbenzene (DVB), and 2-(N,N-dimethylamino) ethyl methacrylate (DAEMA) in the presence of poly (vinyl alcohol) in a water/methanol solvent. The resulting poly (styrene/DVB/DAEMA), containing 30/0$\sim$1.5/0$\sim$3 wt% in monomer composition, were found to be a sphere-type particle with diameter of 1 ${\mu}m$. Silver Ag-coated polystyrene beads were prepared by in sito reduction of a silver 2-ethylhexylcarbamate (Ag-EHCB) complex solution with hydrazine without pretreatment of polystyrene beads. Robust Ag/polystyrene beads were analyzed by SEM, UV -visible spectrometer and XRD.

• Journal of the Korean Society of Clothing and Textiles
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• v.29 no.1 s.139
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• pp.149-156
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• 2005

The purpose of this study was to produce the high quality of electromagnetic wave shielding fabrics. In this study, we have produced polyester fabrics by electroless Ag plating. The untreated polyester was etched with $4\%$ NaOH solution added accelerant(Benzyl Dimethyl Dodecyl Ammonium Chloride) then it was catalyzed by $SnCl_2$ solution and activated by $PdCl_2$ solution. Electroless Ag plating was carried out by changing conditions such as temperature. time, weight loss rate of polyester and kind of reducing agents. The electromagnetic wave shielding effectiveness of polyester fabric by electroless Ag plating was measured by RF Impedance Analyzer and element of electromagnetic wave shielding substance was measured using Electron probe micro analyzer. The results were as follows; The plating bath using potassium sodium tartrate by reducing agent was excellent electromagnetic wave shielding effectiveness. Element of electromagnetic wave shielding substance was silver. Electromagnetic wave shielding effectiveness was shown over 64dB at the temperature of $40^{\circ}C$, treating time 30min., weight loss rate $20\%$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.148-149
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• 2007

현재 전자부품 시장은 RoHS 규정으로 인하여 lead free화가 진행되고 있으며 많은 주목을 받고 있다. 본 논문에서는 반도체 패키지 및 부품표면일장에서 사용 되는 무전해 주석 도금과정 중 산 탈지 후 막의 표면 거칠기 정도가 도금 후의 표면 거칠기 정도에 미치는 영향을 평가 한다. 실험의 효율성을 높이기 위해 통계적인 실험계획법을 사용하였으며 실험의 횟수를 줄이고 표면 거칠기 정도는 이미지 프로세싱을 통하여 분석하였으며 통계적인 모델링을 통해 micro etch가 도금 표면의 거칠기에 주는 영향을 분석하였다.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.274-281
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• 1999

Usually sputtering and electroless plating methods were used for manufacturing metal-alloy thin film magnetic memory devices. Since electroless plating method has many merits in mass production and product variety com­pared to sputtering method, many researches about electroless plating have been performed in the United State of America and Japan. However, electroless plating method has not been studied frequently in Korea. In these respects the purpose of this research is manufacturing Co-Mn-P alloy thin film on the corning glass 2948 by electroless plating method using sodium hypophosphite as a reductant, and analyzing deposition rate, alloy composition, microstructure, and magnetic characteristics at various pH's and temperatures. For Co-P alloy thin film, the reductive deposition reaction 0$\alpha$urred only in basic condition, not in acidic condition. The deposition rate increased as the pH and temperature increased, and the optimum condition was found at the pH of 10 and the temperature of $80^{\circ}C$. Also magnetic charac­teristics was found to be most excellent at the pH of 9 and the temperature of $70^{\circ}C$, resulting in the coercive force of 8700e and the squareness of 0.78. At this condition, the contents of P was 2.54% and the thickness of the film was $0.216\mu\textrm{m}$. For crystal orientation, we could not observe fcc for $\beta$-Co. On the other hand,(1010), (0002), (1011) orientation of hcp for a-Co was observed. We could confirm the formation of longitudinal magnetization from dominant (1010) and (1011) orientation of Co-P alloy. For Co-Mn-P alloy deposition, coercive force was about 1000e more than that of Co P alloy, but squareness had no difference. For crystal orientation, (l01O) and (lOll) orientation of $\alpha$-Co was dominant as same as that of Co- P alloy. Likewise we could confirm the formation of longitudinal magnetization.