• Polymer(Korea)
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• v.27 no.1
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• pp.52-60
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• 2003

In this work, two types of Ni-plating, namely electrolytical and electroless Ni-platings on carbon fiber surfaces, were carried out to enhance the impact resistance of composites. And the comparison between electrolytical and electroless methods on their impact properties of composite system was studied. The surface properties of carbon fibers were characterized using XRD, SEM, and contact angle measurements. The impact behaviors were investigated using an Izod type impact tester. As experimental results, it was observed that electrolessly plated Ni layers had Ni-P alloys on carbon fiber surfaces as revealed by XRD, and electrolytically Ni-plated carbon fibers showed higher surface free energies than those of the electrolessly Ni-plated carbon fibers. In particular, the impact strengths of electrolessly Ni-plated carbon fibers-reinforced plastics were strongly increased. These results were probably due to the difference of wettabilities according to the different types of Ni-plating methods.

• Journal of Korean Society of Environmental Engineers
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• v.38 no.1
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• pp.1-7
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• 2016

In order to treat electrolysis nickel plating pickling wastewater to meet the effluent limit less than 3.0 mg/L, the electrolysis process by using soluble and insoluble electrode were studied. Electrolysis using soluble electrodes has a characteristic of easy elution from the electrode which the insoluble electrodes close not release metal from the electrode. For these reasons, there exist different characteristics in nickel removal efficiency, purity of nickel sludge. With this connection, the feasibility test were concluded to develop optimal conditions for the treatment of pickling wastewater electrolysis by using soluble electrodes, insoluble electrodes. Optimal condition of current density, pH were derived from the pickling wastewater using insoluble electrodes. It was concluded the highest removal efficiency of nickel at the operation condition of at pH 9, current density of $15mA/cm^2$. At these conditions, 95.3% purity of nickel sludge was achieved, iron content was 2.9%. Optimal condition when using soluble electrodes was derived current density of $10mA/cm^2$, pH 9. Purity of nickel sludge was 77.3%, iron content was 21.0%. 50.7% and 24.2% of operating cost can be saved by the use of soluble electrodes and the use of insoluble electrodes, respectively.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.316-317
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• 2015

무전해 도금은 금속이온을 수용액 상태에서 석출시키는 방법으로서 전기를 사용하지 않고 환원제의 자기촉매 방법에 의해 금속을 도금하는 방법이다. 두께를 확보하기 위한 화학적 무전해 도금에서는 환원제를 사용하지만 선택적 도금에서는 환원제를 사용하지 않는 치환도금법이 주로 사용되고 있다. 최근 전자파 차폐, 포장기술의 응용이 확대되면서 정보 통신 스마트폰, 전자기술과 자동차 산업에 많은 고분자 복합도금이 널리 확대되고 있다. 최근 해외에서도 고분자와 비금속재료의 복합도금 기술이 관심을 끌고 있다. 2013년 중국의 J. B. Fei 등은 Ag나노체인 합성물에 필요한 비대칭형의 공유결합으로써 나선형의 자기배열 $AgNO_3$와 멜라민 특성을 보고하였다. 무전해 니켈 복합도금은 내마모성, 내식성과 비금속재료의 선택적인 첨가로 다양한 고분자 첨가물을 적용할 수 있다. 유전상수가 낮고 열적 안정성이 우수하여 노트북 컴퓨터나 스마트폰 표면에 니켈-폴리이미드 복합도금도 개발되고 있다.

• Journal of the Korean Electrochemical Society
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• v.2 no.3
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• pp.138-143
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• 1999

Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.93.2-93.2
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• 2018

최근 기후 변화 문제로 $CO_2$배출량 억제 정책에 따라 열전재료가 다양한 분야에 크게 주목 받고 있다. 열전 모듈은 전류를 흘려 온도차를 발생시키는 펠티어 효과와 온도차를 전력으로 변환하는 제백 효과를 이용한다. 열전발전용에 적용되는 상용 열전모듈의 경우, 열전소자의 접합부의 수는 수십 개 이상이다. 따라서 단 한 개의 접합 불량 열전소자가 모듈 전체의 열전성능에 큰 영향을 미친다. 현재 상용화 된 Bi-Te계 열전 모듈은 Bi-Te의 Te와 Sn계 솔더의 주성분인 Sn이 $250^{\circ}C$ 부근에서 취성의 Sn-Te계 금속 화합물을 형성한다고 알려져 있다. 이 때 생성된 Sn-Te 화합물은 열전모듈의 접합강도를 약화시키고 이로 인해 열전모듈의 접합 신뢰성을 크게 저하 시킬 수 있다. 이를 해결하기 위해 솔더와 소자 사이에 확산방지층이 적용되고 있으며, 이 중에서 니켈합금이 가장 널리 적용되고 있다. 니켈층을 형성시키는 방법 중에서, 무전해 도금법은 간단하게 열전소자 표면 위에 도금 층을 균일한 두께로 만들어 낼 수 있다. 하지만, 니켈 도금층과 Bi-Te 소자 간에 화학적 결함이 존재하지 않기 때문에, 무전해 니켈 도금층의 밀착성이 떨어진다. 이 때. 소자 표면에 거칠기 효과(anchor effect)를 부여하기 위해 물리적 샌딩법을 사용하는데 이 방법의 경우 소자에 크랙 같은 손상을 미쳐 열전모듈의 신뢰성 저하를 가져온다. 그러므로 거칠기 효과를 부여하면서 소자에 손상을 최소화하는 습식 식각법을 개발하여 Bi-Te계 열전소자의 표면 조도를 조절하고 무전해 Ni-P 도금을 실시하였다. 그리고 열처리 유무에 따른 열전모듈의 접합강도를 측정하였으며, 제작한 열전 모듈의 접합부 및 파단부의 계면 분석하여 무전해 Ni-P도금을 위한 습식식각법(wet etching법)에 대하여 검토하였다. N-type은 질산과 구연산의 혼합수용액에, P-type은 왕수에 습식 식각처리를 해서 적당히 표면 조도를 조절한 후에 EPMA로 분석을 해본 결과 니켈 도금층과 Bi-Te 소자 간에 anchor effect가 부여 된 것을 확인했다. 습식 식각에 의해서 제조된 열전모듈의 접합강도는 종래의 알루미나 샌딩법으로 제조한 열전모듈 보다 높은 접합강도를 나타내었다.

• Korean Journal of Materials Research
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• v.9 no.11
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• pp.1095-1101
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• 1999

Electroless Ni plating is applied to form bumps and UBM layer for flip chip interconnection. Characteristics of electroless Ni are also investigated. Zincate pretreatment is analyzed and plated layer characteristics are investigated according to variables like temperature, pH and heat treatment. Based on these observations, characteristics dependence to each variables and optimum electroless Ni plating conditions for flip-chip interconnection are suggested. Electroless Ni has 10wt% P, $60\mu\Omega$-cm resistivity, 500HV hardness and amorphous structure. It changes crystallized structure and hardness increases after heat treatment After interconnection of electroless Ni bumps by ACF flip chip method, we show their advantages and possibility in microelectronic package applications.

• Polymer(Korea)
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• v.25 no.2
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• pp.218-225
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• 2001

The electroless plating of a metallic nickel on PAN-based carbon fiber surfaces was carried out to improve mechanical interfacial properties of the carbon fiber/epoxy resin composites which were unidirectionally fabricated by a prepregging method. In this work, the influence of Ni-P alloy concentration showing brittle-to-ductile transition was investigated on interlaminar shear strength (ILSS) and impact strength of the composites. The surface properties of carbon fibers were also measured by X-ray photoelectron spectroscopy (XPS). As the result, the $O_{ls}$ /$O_{ls}$ ratio or Ni and P amounts were increased with increasing electroless nickel plating time but the ILSS were not significantly improved. However, the impact properties was significantly improved in the presence of Ni-P alloy in the carbon fiber surface, resulting in an increase of the ductility of the composites.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.132-132
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• 2013

본 연구는 R/F-PCB(Rigid/Flexible Printed circuit Board)의 Cu Pattern에 최종 표면처리 방법으로 사용되는 ENIG(Electroless Ni/Immersion Gold) 공정을 대체하여 ECIG(Electroless Co/Immersion Gold)공정을 적용하고자 하는 것으로 무전해 니켈 도금의 장점인 고경도, 내마모성, 납땜성, 내식성을 가지면서 니켈 도금의 취약점인 연성을 개선한 도금액을 개발하고자 하였다. 개발된 도금액을 이용하여 Cu Pattern에 도금할 경우 일반 무전해 니켈 도금에서 나타나는 불량 원인 중 하나인 Space 부분에 도금이 되는 현상이 현저히 감소하였으며, 연성 또한 향상됨을 관찰할 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.49-56
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• 2007

Effects of post-baking treatment conditions on the interfacial adhesion between electroless plated Ni and polyimide film were evaluated using $180^{\circ}C$ peel test. Measured peel strength values monotonically decrease from $38.6{\pm}1.1g/mm\;to\;26.8{\pm}2.2g/mm$ for the variations of post-baking treatment temperatures from $80^{\circ}C\;to\;180^{\circ}C$, respectively. Wet chemical treatment on the polyimide surface produces carboxyl and amide functional groups on the surface which is closely related to the change in interfacial adhesion between electroless Ni and polyimide films. It is speculated that interfacial adhesion seems to be controlled by carbonyl oxygen bonding near cohesive failure region during post-baking treatment.

• Polymer(Korea)
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• v.37 no.4
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• pp.449-454
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• 2013

In this work, the effect of electroless Ni-plating of multi-walled carbon nanotubes (MWCNTs) on thermal conductivity and fracture toughness properties of MWCNTs/$Al_2O_3$/epoxy composites was investigated. The surface properties of the Ni-plated MWCNTs were determined by scanning electron microscopy (SEM), X-ray photoelectron spectrometry (XPS), and X-ray diffraction (XRD) analyses. Thermal conductivity was tested using a thermal conductivity measuring system. The fracture toughness of the composites was carried out through the critical stress intensity factor ($K_{IC}$) measurement. As a result, the electroless Ni-plated MWCNTs led to a significant change of surface characteristics of the MWCNTs. Thermal conductivity and fracture toughness of the MWCNTs/$Al_2O_3$/epoxy composites were greater than those of non-treated ones. These results were probably due to the improvement of intermolecular interaction between the Ni-MWCNTs and the matrix resins.