• Title/Summary/Keyword: 무연솔더

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Thermal Fatigue Life Prediction of ${\mu}BGA$ Solder Joint Using Sn-37mass%Pb Solder and Sn-3.5mass%Ag Lead-free Solder (Sn-37mass%Pb 솔더 및 Sn-3.5mass%Ag 무연솔더를 이용한 ${\mu}BGA$ 솔더접합부의 열피로수명 예측)

  • 신영의;이준환;하범용;정승부;정재필
    • Journal of Welding and Joining
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    • v.19 no.4
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    • pp.406-412
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    • 2001

  • This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

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Bonding Strength of Cu/SnAgCu Joint Measured with Thermal Degradation of OSP Surface Finish (OSP 표면처리의 열적 열화에 따른 Cu/SnAgCu 접합부의 접합강도)

  • Hong, Won-Sik;Jung, Jae-Seong;Oh, Chul-Min
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.1
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    • pp.47-53
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    • 2012

  • Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

  • https://doi.org/10.6117/kmeps.2012.19.1.047 인용 PDF KSCI