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http://dx.doi.org/10.5781/KWJS.2011.29.4.373

Relaibility Validation Methodology for Implementation Pb-free Solder to Military Electronics  

Jeong, Jaes-Seong (전자부품연구원)
Oh, Chul-Min (전자부품연구원)
Goo, Gi-Young (국방기술품질원)
Yoon, Young-Ho (국방기술품질원)
Hwang, Un-Hee (국방기술품질원)
Hong, Won-Sik (전자부품연구원)
Publication Information
Journal of Welding and Joining / v.29, no.4, 2011 , pp. 11-20 More about this Journal
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Times Cited By KSCI : 4  (Citation Analysis)
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1 Katsuaki Suganuma : The development and commercialization of lead-Free soldering, MRS Bulletin/NOVEMBER (2001), 880-884
2 IDEALS : Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering, IDEALS synthesis report (Project BE95-1994) (1999)
3 A. Arbor : NCMS lead-free solder project final report, No. 0401RE96 (1997)
4 H. I. Cha : Problem and solution of Pb-Free Solder, K. Reliability Conference Proceeding, 2010 (in Korean)
5 D. Cavasin : Yellow Solder: An Assessment of the Quality and Reliability of Pb-free Lead Finishes and Solder Ball Alloys Exhibiting Excessive Sn Oxidation, ECTC Proceeding, (2006), 1060-1063.
6 R. Schueller, N. Blattau, J. Arnold, and C. Hillman : Second generation Pb-free alloys, SMTA Conference Proceedings, (2009)
7 C.M. Oh, N. C Park, and W. S Hong : Solder joints fatigue life of BGA package with OSP and ENIG surface finish, J. Kor. Inst. Met. & Mater 46-2 (2008), 80-87 (in Korean)   과학기술학회마을
8 G. S. Wable, S. Chada, B. Neal, and R. A. Fournelle : Solidification shrinkage defects in electronic solders, JOM, 57-6 (2005), 38-42   DOI
9 Gordon Whitten : Lead-free Solder Implementation for Automotive Electronics, ECTC Proceedings, (2000), 1410-1415
10 Commission of the european communities, directives of the european parliament and of the council on waste electrical and electronic equipment (WEEE) (2008)
11 D. Napp : Lead-Free Interconnect Materials for the Electronic Industry : Proceeding of the 27th International SAMPE Technical Conference (1995)
12 Directive 2009/125/EC Of the European parliament and of the council : Official J. of the European Union, L285 (2009), 10-35
13 State of california environmental protection agency : Chemicals known to the state to cause cancer or reproductive toxicity, Proposition 65 List of Chemicals (2011)
14 W. S. Hong, W. S. Kim, N. C. Park, K. B. Kim, "Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints", Journal of Korean Welding and Joining Society, 25-2 (2007), 84-190 (in Korean)   과학기술학회마을   DOI   ScienceOn
15 J. W. Yoon, S. W. Kim, and S. B. Jung : IMC morphology, interfacial reaction and joint reliability of Pb-free SnAgCu solder on electrolytic Ni BGA substrate, J. Alloys and Compounds, 392 (2005), 247-252   DOI   ScienceOn
16 W. S. Hong : Relaibility Validation Methodology for Implementation Pb-free Solder of Electronic Devices, Project report, Korea Electronics Technology Institute (KETI), 2005 (in Korean)
17 K. suganuma : Lead-free soldering in electronics, ISBN 0824741021, Marcel dekker Inc, USA, (2004)
18 Y. Fukuda, M. G. Pecht, K. Fukuda, and S. Fukuda : Lead-Free Soldering in the Japanese Electronics Industry, IEEE T. on components and package Tech., 26-3 (2003), 616-624   DOI   ScienceOn
19 G. Henshall, R. H. Ranjit, S. Pandher, K. Sweatman, K. Howell, R. Coyle, T. Sack, P. Snugovsky, S. Tisdale and F. Hua : iNEMI(National Electronic Manufacturing Initiative) Pb-free alloy alternatives project report, state of the industry, J. of SMTA, 21-4 (2008), 109-122
20 Jack Fellman : A study of the lead-free hot air solder levelling process, Circuit World, 31-2 (2005), 3-9   DOI   ScienceOn
21 www.ipc.org, IPC-TM 650, Method 2.6.13 Assessment of susceptibility to metallic dendriti growth: uncoated printed wiring
22 www.ipc.org, IPC-TM 650, Method 2.6.14 Solder mask - resistance to electrochemical migration
23 JIS 3197, Testing methods for soldering fluxes, Japanese Industrial Standard, Japanese Standards Association, 1999
24 www.jedec.org, JESD22-A110D Highly accelerated temperature and humidity stress test (HAST)
25 United States Army's Developmental Test Command : MIL-STD 810G Method department of defense test method standard for environmental engineering considerations and laboratory tests
26 Infrastructure establishment and supporting project for lead-free soldering in electronic products, Project report, Korea Electronics Technology Institute (KETI) (2007) (in Korean)
27 W. S. Hong, B. C. Kang, B. S. Song, K. B. Kim : "A study on the metallic ion migration phenomena of PCB", Kor. J. Mater. Res., 15-1 (2005), 54-60 (in Korean)   과학기술학회마을   DOI   ScienceOn
28 Takeshi Yanagisawa : History of ionic migration and factor for its growth, J. of the Surface Finishing Society of Japan, 5-5 (2000), 479-483
29 H. Tanaka, F. ueta, S. Yoshihara, T. Shitakashi : Effects of reflow processing and flux residue on ionic migration of lead-free solder plating using the quartz crystal Microbalance method" Materials Transactions, 42-9, (2001), 3401-3406,
30 R. Strauss, SMT Soldering Handbook, 2nd ed., Newnes, Oxford (1998) 148
31 W. S. Hong, W. S. Kim, B. S. Song and K B. Kim, "Thermal Shock Cycles Optimization of Sn-3.0Ag-0.5Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components", Kor. J. Mater. Res., 17-3 (2007), 152-159 (in Korean)   과학기술학회마을   DOI   ScienceOn
32 Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003)
33 H. Tanak, M. Yamashita, Hi. Hiramatsu, M. nakamura, F. ueta, S. Yoshihara, T. Shitakashi : Investigation on Ionic Migration Phenomenon of Hot Dipped Lead-free Solders Using QCM method, The Journal of Japan Institute of Electronics Packaging, 5-2 (2002), 135-139   DOI
34 H. Qi, S. Ganesan, M. Pecht, "No-fault-found and intermittent failures in electronic products" Microelectronics Reliability 48 (2008), 663-674   DOI   ScienceOn
35 JP002 : Current Tin Whiskers Theory and Mitigation Practices Guideline, JP002, JEDEC/IPC Joint Publication, (2006)
36 Military and commercial specification unification project : Korea Electronics Technology Institute (KETI), DTAQ-07-1374-R (2007)
37 www.jedec.org, JESD22-A106B Thermal Shock
38 IPC-9701, Performance Test Methods and Qua I ification Requirements for Surface Mount Solder Attachments, Northbrook, IL, (2002)
39 M. Ramirez, L. Henneken, S. Virtanen : Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder, Applied Surface Science, 257-15 (2011), 6481-6488   DOI   ScienceOn
40 C. Handwerker, J. Bath, E. Benedetto, E. Bradley, R. Gedney, T. Siewert, P. Snugovsky, J. Sohn: NEMI Lead-Free Assembly Project: Comparison Between PbSn and SnAgCu Reliability and Microstructures, SMTAI Conference Proceeding, (2003), 664-669
41 NEDO Research and Development on Lead-Free Soldering, JEIDA Report No. 00-ki-17 (2000)