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Interfacial Properties with Kind of Surface Finish and Sn-Ag Based Lead-free Solder

Sn-Ag계 무연솔더 및 표면처리 종류에 따른 계면특성

  • Published : 2009.02.28

Abstract

Keywords

References

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  2. The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders vol.7, pp.12, 2017, https://doi.org/10.3390/met7120540