• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.255-259
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• 2003

Moire topography method isa well-known non-contacting 3-D measurement method as afast non-contact test for three-dimension shape measuring method. Recently, it's important to study the automatic three-dimension measurement by moire topography because it is frequently applied to the reverse engineering , the medical , the entertainment fields. Three-dimension measurement using projection of moire topography is very attractive because of its high measuring speed and high sensitivity. In this paper, the classical moire method is computerized-so called digital moire when a virtual grating pattern is projected on a surface, the captured image by the CCD camera has three-dimension information of the objects. The moire image can be obtained through a simple image processing and a reference grating pattern. and it provides similar results without physical grating pattern. digital projection moire topography turn out to be very effective for the three-dimension measurement of objects. Using different N-bucket algorithm method of digital projection moire topography is tested to measuring object with the 2-ambiguity problem. Experimental results prove that the proposed scheme is capable of finding measurement errors that decreased more by using the four-three step algorithm method instead of the same step in the phase shifting of different pitch.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.40-46
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• 2006

This paper presents a novel fiber optic accelerometer system for monitoring vibration of large-size structures. The system is composed of one (or multiple) sensor head, a light control unit and a signal processing unit. The sensing mechanism of the sensor head is based on a novel integration of the moire fringe phenomenon with fiber optics to achieve a robust performance in addition to its immunity to EM interference, easy cabling, and low cost. In this paper, a prototype of the fiber optic accelerometer system has been developed successfully. A low-cost light control unit has been developed to drive the system's optic and electronic components. A unique algorithm has also been developed to derive the sensor's acceleration from the raw signals of the light control unit; it is implemented via a separate signal processing unit. Finally, the shaking table tests successfully demonstrate the performance and the potential of the moire fringe fiber optic sensor system to monitor the health of civil infrastructures.

• Journal of the Korea Fashion and Costume Design Association
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• v.11 no.2
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• pp.11-21
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• 2009

Recently, as custom-made demand about female underwear is increased, securing of a various dimension system is urgent, and satisfaction of each customer cannot be heightened with established dimensions. If we could measure shape of a living body with a fast and simple method, the custom-made demand of customers could be satisfied in the underwear as well as a clothing industry by using the method. One of the alternatives is shape measurement of the living body by a Moire fringe method. If we put a grating in front of an object to be measured and illuminate light, a Moire fringe with contour line shape is generated in the object, so we can conveniently measure object shape without touching directly by using the pattern. The Moire fringe and three-dimensional shape of the breast of the living body was acquired by a PMP method using a polygon mirror, and height and bottom width of the breast of the living body were measured by using obtained data in this study. Data of breast shape measurement through a mannequin was collected in a previous step as basic material for measuring the breast shape measurement of the living body. Three women in the twenties were selected as one of methods for measuring breast shape of a woman. As a result of the breast shape measurement of a living body A, it was measured that height of the breast was about 67.24mm and the bottom width was $13781.60mm^2$. This study is expected to contribute for collecting basic data of a female underwear industry and establishing a specification of a dimension system.

• Journal of the Korean Vacuum Society
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• v.22 no.6
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• pp.285-290
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• 2013

Epitaxial graphene on metal substrates provides excellent platforms to study its atomic and electronic structures, and can be grown either by surface segregation of carbon or by chemical vapor deposition. The growth behaviors of the two methods, however, have not been directly compared each other. Here, we studied domain structures of graphene grown by three different methods, surface segregation, post-annealing with adsorbed ethylene, and high-temperature dose of ethylene, using scanning tunneling microscopy. The first two methods resulted in graphene regions with areas of $100nm^2$, whereas the third method showed large area graphene (> $10^4nm^2$) with regular hexagonal Moire patterns, implying that high-temperature dose of ethylene is preferable for further studies on graphene such as additional growth of organic molecules.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.10
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• pp.3199-3210
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• 1996

The buckling and postbuckling behaviors were sutdied analytically and experimentally for stiffened laminated composite panels under compression loading. The panels with I-, blade, -and hat-shapeed stiffeners were investigated. In the analysis, the stiffened panels were anlyzed using the nonlinear finite element method combined with an improved arc-length method. The progressive failure analysis was done by adopting the maximum stress criterion and complete unloading failure model. The effects of the fiber angles were investigated on the buckling and postbuckling behaviors. In the experiment, the web and the lower cap of each stiffener were formed by the continuous lay-up of the skin for cocuring the stiffened panels. Therefore, the separation between stiffener and skin was not found in the junction part even after postbuckling ultimate load and the stiffened panels had excellent postbuckling load carrying capacity. A shadow moire thchnique was used to monitor the out-of-plane deformations of the panels. The piezoelectric films were attached to the panels to get the failure characteristics of the panel. The analytical results on the buckling load, postbuckling ultimate load, and failure pattern showed good agreement with the experimental results.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.11
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• pp.175-182
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• 2012

The scattered radiation always occurs when X-ray strikes the object. To absorb the scattered X-rays, the antiscatter grids are used, however these grids images are superimposed in the projection radiography images. When those images are displayed on the monitor, moir$\acute{e}$ patterns are overlapped over the images and disturb the anatomical informations. Most of the researches performed to date removed the grid noises by calculating or observing those frequencies in one dimensional frequency domain, two dimensional wavelet transform or Fourier transform. Those methods filtered not only the grid noises but also diagnostic informations. In this paper, we proposed the combined wavelet packet-Fourier method to remove the grid artifact in CR images. For the phantom image, the proposed method achieved from 5.2 to 7.4 dB better than others in SNR and for CR images by rejecting the grid noise bands effectively while leaving the remaining bands unchanged, the loss of images could get minimal results.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.