• Proceedings of the Optical Society of Korea Conference
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• 2000.08a
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• pp.128-129
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• 2000

3차원 형상측정에서 많이 쓰이고 있는 모아레 간섭계에는 그 setup에 따라 Projection Type과 Shadow Type이 있다. 이러한 모아레 간섭계는 광원과 측정 카메라의 각도에 의해 물체의 형상을 측정하게 된다. 그러나, 이러한 광원과 측정 카메라의 각도에 의해 생겨나는 그림자에 의한 영향 때문에 물체의 형상이 굴곡이 심한 곳은 측정하기 어렵다. 본 논문에서는 아래 그림과 같이 두 개 이상의 광원을 사용하여 그 영향을 줄이기 위한 방법을 제안하였다. 이 방법은 projection type이나 shadow type에서 동일하게 적용 가능할 것으로 예상된다. (중략)

• Journal of the Korean Society for Precision Engineering
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• v.22 no.5 s.170
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• pp.21-27
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• 2005

• Proceedings of the Optical Society of Korea Conference
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• 2001.08a
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• pp.56-57
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• 2001

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.1-8
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array (CBGA) package assembly are characterized by high sensitive moire interferometry. Moir fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation (warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. Analysis of the solder interconnections reveals that inelastic deformation accumulates on only eutectic solder fillet region at high temperatures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.724-724
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• 2004

• Proceedings of the Optical Society of Korea Conference
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• 2005.07a
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• pp.268-269
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• 2005

• Proceedings of the Optical Society of Korea Conference
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• 2004.02a
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• pp.32-33
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• 2004

• Proceedings of the Optical Society of Korea Conference
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• 2003.07a
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• pp.274-275
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• 2003

광통신 분야의 연구 중 근거리 광통신 분야에 적용하기 위한 Plastic Optical Fiber(POF)에 관한 연구와 개발이 활발히 이루어지고 있다. POF의 광전송 특성을 결정짓는 요소 중 가장 중요한 특성이 바로 굴절률 분포이다. 이에 따라 그동안 다양한 형태의 POF 굴절률 측정 방법이 연구되어 왔다. 기존 Glass Optical Fiber의 굴절률 분포 측정 방법 중 가장 일반적이고 효과적인 방법 중 하나는 coherent 빛의 간섭을 이용한 transverse interferograms을 분석하는 방법으로 Fizeau 간섭계와 같은 간섭계를 이용하여 위상변화를 측정하고 측정한 위상을 tomography적인 해석방법을 통해 굴절률 분포를 계산하는 방법이다. (중략)

• Journal of the Computational Structural Engineering Institute of Korea
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• v.24 no.1
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• pp.97-106
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• 2011

In this study, viscoplastic material properties of solder alloy which is used in the electronics packages are inversely estimated. A specimen is fabricated to this end, and an experiment is conducted to examine deformation by Moir$\acute{e}$ interferometry. As a result of the experiment, bending displacement of the specimen and shear strain of the solder are obtained. A viscoplastic finite element analysis procedure is established, and the material parameters are determined to match closely with the experiments. The uncertainties which include inherent experimental error and insufficient data of experiments are addressed by using the method of computer model calibration. As a result, material parameters are identified in the form of confidence interval, and the displacements and strains using these parameters are predicted in the form the prediction interval.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.90-95
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• 2001

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) are characterized by high sensitive $moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed at several various bending loads and temperature steps. At the temperature higher that $100^{\circ}C$, the inelastic deformation in solder balls became more dominant. As a result the bending of the molding compound decreased while temperature increased. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder. The results also show that $moir{\acute{e}}$ interferometry is a powerful and effective tool in experimental studies of electronic packaging.