• Proceedings of the KSME Conference
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• 2001.06d
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• pp.360-364
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• 2001

Numerical Aanlysis is made on the thermal performance of micro heat pipe in a axial flat grooved channel. The flow of liquid and vapor is investigated in trapezoidal grooves and the effect of variable shear stress along the interface of the liquid and vapor considered. The results from this study are obtained in the axial variation of pressure difference between vapor and liquid, contact angle, velocity of liquid and vapor and so forth. In addition, maximum heat transport capacity of micro-heat pipe is provided by varying the operation temperature, and compared with that from Schneider and Devos's model in which the interfacial shear stress is neglected.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.82-88
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• 2006

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1499-1505
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• 2003

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices. So, in this paper, characteristics on oscillating heat pipe according to operating conditions(environment temperature, charging ratio of working fluid, inclination) based on experimental study was investigated. From the experimental results, $25^{\circ}C$environment temperature), R-141b(working fluid)40%(charging ratio) was best performace at others of inclination angle and The top heating mode of OCHP performed 80% efficiency of the bottom heating mode.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.164-173
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• 2006

The cooling capacity of a micro-heat pipe is mainly governed by the magnitude of capillary pressure induced in the wick structure. For microchannel wicks, a higher capillary pressure is achievable for narrower and deeper channels. In this study, a metallic micro-heat pipe adopting high-aspect-ratio microchannel wicks is fabricated. Micromachining of high-aspect-ratio microchannels is done using the laser-induced wet etching technique in which a focused laser beam irradiates the workpiece placed in a liquid etchant along a desired channel pattern. Because of the direct writing characteristic of the laser-induced wet etching method, no mask is necessary and the fabrication procedure is relatively simple. Deep microchannels of an aspect ratio close to 10 can be readily fabricated with little heat damage of the workpiece. The laser-induced wet etching process for the fabrication of high-aspect-ratio microchannels in 0.5mm thick stainless steel foil is presented in detail. The shape and size variations of microchannels with respect to the process variables, such as laser power, scanning speed, number of scans, and etchant concentration are closely examined. Also, the fabrication of a flat micro-heat pipe based on the high-aspect-ratio microchannels is demonstrated.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.353-358
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• 2000

This paper presents the experimental investigation about miniature heat pipe for notebook PC. The focus of analysis is the operating temperature not to exceed $65^{\circ}C$ maximum allowable CPU surface temperature. Copper is used to heat pipe material and brass is wick material, and working fluid is selected to water. This cooling system is heat spreader method using a aluminum plate, since this method is most commonly used. According to the present study, heat for 3mm heat pipe, 8W, and for 4mm heat pipe, 10W, is found to power dissipation limit respectively, Soon after this investigation, sufficient long term life test should be followed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.659-660
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• 2006

High-aspect-ratio(max. 12.5) microchannels with excellent surface quality and good shape uniformity have been realized utilizing laser-induced etching technique. Etch width and depth variations depend largely upon process variables such as laser power and etchant concentration. Etchant concentration in association with viscosity also influence on the cross-sectional profile of the channels. The optimum process conditions for the fabrication of high-aspect-ratio microchannels applicable to micro thermal devices are demonstrated.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.10
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• pp.823-831
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• 2007

This paper presents the experimental and simulation study of a loop heat pipe (LHP) that can be applied to present electronics, space missions and thermal control systems. The present experimental study was carried out employing sintered alumina ceramic wick ($d=2.96\;{\mu}m$, ${\phi}=0.61$). High purity R-134a, R-22 and water were also used as alternative working fluids in addition to ammonia. The experimental study showed that the maximum heat transfer performance for the test LHP in the vertical top heating mode was over 100 Watts when ammonia was used as the working fluid. The simulation results have been compared with the experimental results to validate a simulation model based on the thermal resistance network that was developed to evaluate the performance of LHPs, focusing on their prospective applications in electronics. The simulation model is based on the loop overall energy, mass, and momentum balance. The simulation program can predict the effects of various parameters which affect the performance of LHP within 5% compared with the experimental results.

• Proceedings of the SAREK Conference
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• 2004.11a
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• pp.130-130
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• 2004

• Tribology and Lubricants
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• v.38 no.5
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• pp.185-190
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• 2022

Among the operating limits of a heat pipe, the capillary limit is significantly affected by the characteristics of the wick, which is determined by the capillary performance. The major parameters for determining capillary performance are the maximum capillary pressure and the spreading characteristics that can be expected through the wick. A well-designed wick structure improves capillary performance and helps improve the stability of the heat pipe by enhancing the capillary limit. The capillary performance can be improved by forming a porous microstructure on the surface of the wick structure through surface modification techniques. In this study, a microstructure is formed on the surface of the wick by using a surface modification method (i.e., an electrochemical etching process). In the experiment, specimens are prepared using stainless-steel screen mesh wicks with various fabrication conditions. In addition, the spreading and capillary rise performances are observed with low-surface-tension fluid to quantify the capillary performance. In the experiments, the capillary performance, such as spreading characteristics, maximum capillary pressure, and capillary rise rate, improves in the specimens with microstructures formed through surface modification compared with the specimens without microstructures on the surface. The improved capillary performance can have a positive effect on the capillary limit of the heat pipe. It is believed that the surface microstructures can enhance the operational stability of heat pipes.