• Title/Summary/Keyword: 마이크로 인장시험기

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Development of a Fatigue Testing System for Micro-Specimens (마이크로시험편용 피로시험기 개발)

  • Kim, Chung-Youb;Sharpe, W.N.
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.9
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    • pp.1201-1207
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    • 2010
  • In this study, a fatigue testing system capable of performing load-controlled tension-tension tests for micro-specimens was developed by using an electro-magnetic actuator. Using this system, fatigue testing as well as tensile testing can be performed over a wide range of loading frequencies. Further, a new laser interferometric strain/displacement gage was used during fatigue testing to obtain high-resolution measurements of the cyclic deformation of thin films. Since the testing machine and the displacement gage are stable and show quick responses, the displacement can be measured instantaneously and continuously during fatigue testing, and high-resolution results can be obtained.

Measurement of Tensile Properties for Thin Aluminium Film by Using White Light Interferometer (백색광간섭계를 이용한 알루미늄 박막의 인장 물성 측정)

  • Kim, Sang-Kyo;Oh, Chung-Seog;Lee, Hak-Joo
    • Journal of the Korean Society for Nondestructive Testing
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    • v.30 no.5
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    • pp.471-478
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    • 2010
  • Thin films play an important role in many technological applications including microelectronic devices, magnetic storage media, MEMS and surface coatings. It is well known that a thin film's material properties can be very different from the corresponding bulk properties and thus there has been a strong need for the development of a reliable test method to measure the mechanical properties of a thin film. We have developed an alternative and convenient test method to overcome the limitations of previous membrane deflection experiment and uniaxial tensile test by adopting a white light interferometer having sub-nanometer out-of-plane displacement resolution. The freestanding aluminium specimens are tested to verity the effectiveness of the test method developed and get the tensile properties. The specimens are 0.5 rum wide, $1{\mu}m$ thick and fabricated through MEMS processes including sputtering. 1 to 5 specimens are fabricated on Si dies. The membrane deflection experiments are carried out by using a homemade tester consisted of a motor-driven loading tip, a load cell, and 6 DOF alignment stages. The test system is compact enough to set it up beneath a commercial white light interferometric microscope. The white light fringes are utilized to align a specimen with the tester. The Young's modulus and yield point stress of the aluminium film are 62 GPa and 247 MPa, respectively.

Development of Micro Tensile Tester for High Functional Materials (고기능 소재용 마이크로 인장시험기 개발)

  • 최현석;한창수;최태훈;이낙규;임성주;박훈재;김승수;나경환
    • Transactions of Materials Processing
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    • v.11 no.7
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    • pp.561-568
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    • 2002
  • Micro tensile test is the most direct and convenient method to measure material properties such as Young's modulus and fracture strength. It, however, needs more accurate measurement system, mote stable and repetitive alignment and more sensitive gripping than conventional tensile test. Many researchers have put their effort on overcoming these difficulties for tile development of micro tensile tester, fabricating micro specimens of functional materials and measuring their properties. This paper will review the related vigorous researches over the world in the recent decade and explain how to apply them to a design of the fester which is under our own development.

Study on Characteristics of Sn-0.7wt%Cu-Xwt%Re Solder (Sn-0.7wt%Cu-Xwt%Re 솔더의 특성에 관한 연구)

  • Noh, Bo-In;Won, Sung-Ho;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.4
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    • pp.21-25
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    • 2007
  • In this study, the properties of Sn-0.7wt%Cu-Xwt%Re(X=$0.01{\sim}1.0$) older were investigated by using DSC(differential scanning calorimetry), wetting balance, victors hardness and tensile testers. The melting temperature of solder was increased with increasing the contents of rare earth element, and the melting temperature range of Sn-0.7Cu-($0.01{\sim}1.0$)Re solder was $233.9{\sim}234.7^{\circ}C$. The wettability with Sn-0.7Cu-0.1Re solder was higher than that of Sn-0.7Cu-0.01Re and Sn-0.7Cu-1.0Re solders, and the wettability of Sn-0.7Cu-0.1Re solder was higher than that of Sn-0.7wt%Cu-0.01w%P solder. Also, the hardness and tensile strength of solder were increased with increasing the contents of rare earth element.

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A Study on Tensile Properties of Laminated Nanocomposite Fabricated by Selective Dip-Coating of Carbon Nanotubes (탄소나노튜브의 선택적 딥코팅을 이용해 제작된 적층 복합재료의 인장 물성에 대한 연구)

  • Kang Tae-June;Kim Dong-Iel;Huh Yong-Hak;Kim Yong-Hyup
    • Composites Research
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    • v.19 no.3
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    • pp.23-28
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    • 2006
  • Carbon nanotubes reinforced copper matrix laminated nanocomposites were developed and the mechanical properties were evaluated by using micro-tensile testing system. Sandwich-type laminated structure constituted with carbon nanotube layers as a reinforcement and electroplated copper matrix were fabricated by a new processing approach based on selective dip-coating of carbon nanotubes. The mechanical properties of nanocomposites were improved due to an enhanced load sharing capacity of carbon nanotubes homogeneously distributed within the in-plane direction, as well as a bridging effect of carbon nanotubes along the out-of-plane direction between the upper and lower matrices. The universality of the layering approach is applicable to a wide range of functional materials, and here we demonstrate its potential use in reinforcing composite materials.

Fatigue Characteristic of High Impact Polystyrene(HR-1360) Materials (HIPS(HR-1360) 재료의 피로 특성 평가)

  • Kang, Min-Sung;Koo, Jae-Mean;Seok, Chang-Sung;Park, Jae-Sil
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.6
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    • pp.763-769
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    • 2010
  • In recent times, there has been considerable interest in HIPS (High Impact Polystyrene) materials for their use in construction of office equipments, home electronics, housing for electronics appliances, packing containers, etc. However, these materials suffer from problems caused by fatigue fracture. Further, their strength is substantially affected by environmental conditions. Therefore, in this study, the effect of temperature was analyzed by performing a tensile test and a fatigue test. It was observed that the yield strength, the ultimate strength, and the fatigue life decreased relatively with an increase in temperature. Further, an S-N curve can be predicted by using the results of the tensile test and a micro-Vickers hardness test.

Friction Welding of Ni-Base ODS Alloy Prepared by Mechanical Alloying (기계적 합금법으로 제조된 Ni기 산화물 분산강화 합금의 마찰압접에 관한 연구)

  • 강지훈;박성계;김지순;권영순
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 1994.10b
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    • pp.15-15
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    • 1994
  • M MA ODS 합금의 보다 폭넓용 실용확훌 위해 크게 요구되고 있는 적정 접합기술 개발의 한 방안£로, 마찰압접(Friction Welding) 방법의 가능성옳 조사하기 위하여 마찰압력과 시간, 마 찰 후 접촉압력(Upset Pressure) 풍을 다양하게 변화시켜 접합체톨 제조한 후, 접합체 강도에 대한 인장시험과 접합계연의 결합 및 미세구조에 대한 현미경 관찰, EDS에 의한 원소분석, 접 합이옴부의 경도분포와 파단면 분석 풍율 행하였다. 실험에 사용된 모재는 기계적 합금법으로 제조된 Inca사의 Ni기 MA 754 합금이었으며, 직경 l 10 mm, 길이 50 mm로 가공한 후, 아세통£로 초음파 세척하여 접합에 사용하였다. 접합온 브 레이크식 마찰압접기틀 사용하여 행하였으며, 회전시험편의 회전수는 2400 rpm이었A며, 다른 한쪽의 고정시험편과의 마찰압력 및 마찰시간온 각각 50 - 500 MPa과 1-5초로, 또한 업셋압 력도 50 - 600 MPa로 변화시켰다. 이때 업셋압력은 모든 시편에 대해 일정하게 6초동안 가하 였다. 얻어진 접합체는 각 압접조건 당 2개 이상의 접합시험편에 대해 상온 인장강도톨 측정하 였으며, 파단이 일어난 위치를 확인한 후 파면에 대한 분석율 주사전자현미경(SEM)과 에너지 분산형 분광분석기mDS)릎 사용하여 행하였다. 컵합이옴부의 첩합성올 확인하기 위하여, 접합 체를 접합변에 수직으로 절단, 연마한 후 광학현미경과 SEM, EDS 퉁으로 관찰, 분석하여 접 합부의 형상과 결합형성 여부, 접합계면의 미세조직 퉁옳 조사하였다. 또한 마찰압접에 따론 모재와 접합계연부의 경도분포훌 접합이옴부로부터 모재쪽으로 일정 간격율 두어 마이크로 비 커스 경도기로 측정, 조사하였다. 이상의 설험 결과, 다옴과 같온 결론옳 얻었다. ( (1) 접합체 강도가 모채 강도의 95% 이상이 되는 양호한 렵합체흩 얻기 위한 마찰압력 조건 온, 2400 rpm의 회전속도와 6초의 업셋압력 유지시간에서 마찰압력과 업셋압력, 그리고 마찰시 간이 각각 400 MPa 이상과 500 MPa 이상,2초입율 확인하였다. ( (2) 컵합이옴부의 관찰 결과, 모든 마찰압접 조건에서 컵합이옴부는, 기폰 모재의 texture 조직 을 유지하고 있는 모재부 영역(영역 ill)과 첩합계면부에 인접하여 업셋압력이 주어질 때 단조 효과에 의해 계연 외부로 metal flow가 일어나면서 형성된 영역 II, 매우 미세한 결정립으로 구성된 중앙부의 영역 1 로 이투어져 있옴융 확인하였다. ( (3) 최적접합조건이 충족되지 않온 경우, 접합부의 영역 I 에서 관찰된 void와 균열, 불균일한 접합계면 통의 접합결함에 Al과 Y. Ti 퉁£로 구성된 산화물률이 용집되어 있옴을 확인하였 다-( (4) 접합체의 파단 양상온 크게 접합부 파단과 모재부 파단, 이률의 혼합형 파단i로 나눌수 있었다. 모재부 파단의 경우, 파단면이 매끄럽고 파변상의 결정립도 매우 미세하였으며, 산확물 의 용집도 찾아보기 어려웠 나, 접합부 파단의 경우에는 파변의 굴곡이 비교척 심하고 연성 입계파괴의 형태를 보였£며, 결정립도 모채부 파단의 경우에 비해 조대하였다. 조대하였다.

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Evaluation of Fracture Toughness of Copper Thin Films by Combining Numerical Analyses and Experimental Tests (해석과 실험을 결합한 구리 박막의 파괴인성 평가)

  • Kim, Hyun-Gyu;Oh, Se-Young;Kim, Kwang-Soo;Lee, Haeng-Soo;Kim, Seong-Woong;Kim, Jae-Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.2
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    • pp.233-239
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    • 2013
  • In this paper, a method of combining numerical analyses and experimental tests is used to evaluate fracture toughness of copper thin films of $15{\mu}m$ thickness. Far-field loadings of a global-local finite element model are inversely estimated by matching crack opening profiles in experiments with numerical results. The fracture toughness is then evaluated using the J-integral for cracks in thin films under far-field loadings. In experiments, Cu thin films attached to Aluminum sheets are loaded indirectly, and crack opening profiles are observed by microscope camera. Stress versus strain curves of Cu thin films are obtained through micro-tensile tests, and the grain size of Cu thin films is observed by TEM analysis. The results show that the fracture toughness of Cu thin films with $500nm{\sim}1{\mu}m$ sized grains is $6,962J/m^2$.