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An ECG monitoring system using a conductive thread-based wearable antenna (전도성 섬유 웨어러블 안테나를 기반으로 한 심전도 모니터링 시스템 설계)

  • Chung, Jae-Young
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.5
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    • pp.10-15
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    • 2017
  • Research interest has strongly focused on developing a method for effectively transmitting bio-signals over a distance using a wireless wearable device. In this paper, we describe a procedure for the design and fabrication of a wearable antenna based on embroidering conductive threads to clothing capable of transmitting electrocardiogram signals. 3D electromagnetic simulation software and embroidery software were used to design and fabricate the conductive thread-based antenna, respectively. The measurement results show that the reflection coefficient of the fabricated antenna prototype exhibits excellent antenna impedance matching characteristics of less than -10dB in the Zigbee 2.4GHz frequency band. We also verified that the electrocardiogram data could be effectively received and monitored in real-time by a receiver 220m away from the transmitter.

Design Scheme of A Micro Real-Time Control System with CAN and RTOS (CAN과 RTOS를 내장한 소형 실시간 시스템 설계 기법)

  • Lim, Young-Gyu;Kim, Dong-Seoung
    • Journal of the Institute of Electronics and Information Engineers
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    • v.51 no.5
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    • pp.207-215
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    • 2014
  • In this paper, we propose a Micro Real-Time Control System (MRTCS) for decreasing the delay during interrupts processing and data transfer on sensor nodes. The MRTCS consists of a control, sensor nodes based on Controller Area Network (CAN) device. The control node was designed with Real Time Operating System (RTOS) on top of the small Micro Control Unit (sMCU). Sensor nodes have the CAN device without sMCU, which have multiple Digital Inputs, Outputs (DI/DO) and the CAN controller. We have evaluated with OCTAVE v3.6.4 from open source for system performance. Simulation results show that the system performance was increased through the delay reducing for interrupt processing and internal data transfer. We verify that a proposed MRTCS approach will be adapted to various real-time control system.

Design of a Smart Pillow for Sleep Quality Measurement using Accelerometer (가속도계를 이용한 수면 품질 측정을 위한 스마트 베개 설계)

  • Suwandi, Endang;Kim, Beom-Joon
    • The Journal of the Korea institute of electronic communication sciences
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    • v.15 no.3
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    • pp.603-610
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    • 2020
  • The sleep measurement system is important to detect sleep disturbances as early as possible to be diagnosed and treat the diseases quickly. This paper presents design of system to measure the quality of sleep by using nine accelerometer sensors embedded in the pillow to detect the acceleration of limb movement, e.g. head movements. The participants were asked to sleep using a smart pillow for five days. While sleeping, participants are recorded using a camera on a computer. After awakening, participants were asked to fill out a post-sleep questionnaire. Spearman's correlation was performed to test the correlation of gross body movement per minute rate with post-sleep questionnaire questions. Finally, the seven score of sleep quality were tested with gross body movement per minute rate. The result is the higher gross body movement per minute during sleep represented lower sleep quality.

Ethanol Concentration Sensor Using Microfluidic Metamaterial Absorber (에탄올의 농도를 검출하기 위한 미세유체 메타물질 흡수체)

  • Kim, Hyung Ki;Yoo, Minyeong;Lim, Sungjoon
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.26 no.5
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    • pp.506-513
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    • 2015
  • In this paper, we proposed a novel ethanol concentration sensor using microfluidic metamaterial absorber. The metamaterial absorber comprises a split-ring-cross resonator(SRCR) and a microfluidic channel. The SRCR can generate LC resonance that is very sensitive to changes in the effective dielectric constant around the capacitive gap. In addition, microfluidic channels can change the effective dielectric constant of the dielectric substrate by using an infinitesimal quantity of a liquid on the order of microliters. The proposed absorber can detect the electrical properties of different concentration of ethanol. The performance of the proposed absorber is demonstrated using the absorption measurements of a fabricated prototype sample with waveguides. In addition, the simulated results and measurement results show good agreement.

A Study on Protective Control System for Electrical Fire using Characteristics of SCR and Multilayer-Type PTC Thermistor (SCR과 적층형 PTC 서미스터의 전기적 특성을 이용한 전기화재 보호제어시스템에 관한 연구)

  • Kwak Dong-Kurl
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.1 s.38
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    • pp.31-35
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    • 2006
  • This paper is studied on a protective control system for electrical fire used electrical characteristics of SCR and multilayer-type PTC thermistor. The PTC thermistor has characteristic or positive resistivity temperature coefficient according to the temperature variation, which is construction of a regular square and cube demarcation with $BaTiO_{3_}$Ceramics of positive temperature coefficient. Also PTC shows the phenomenon which is rapidly increased in the resistivity if the temperature is increased over Curie temperature point. This paper is proposed on a protective control system used multilayer-type PTC which is protected from electrical fire due to electric short circuit faults or overload faults. Some experimental results of the proposed apparatus is confirmed to the validity of the analytical results.

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Study of Failure Mechanisms of Wafer Level Vacuum Packaging for MEMG Gyroscope Sensor (웨이퍼 레벨 진공 패키징된 MEMS 자이로스코프 센서의 파괴 인자에 관한 연구)

  • 좌성훈;김운배;최민석;김종석;송기무
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.3
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    • pp.57-65
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    • 2003
  • In this study, we carry out reliability tests and investigate the failure mechanisms of the anodically bonded wafer level vacuum packaging (WLVP) MEMS gyroscope sensor. There are three failure mechanisms of WLVP: leakage, permeation and out-gassing. The leakage is caused by small dimension of the leak channel through the bonding interface and internal defects. The larger bonding width and the use of single crystalline silicon can reduce the leak rate. Silicon and glass wafer itself generates a large amount of outgassing including $H_2O$, $C_3H_5$, $CO_2$, and organic gases. Epi-poly wafer generates 10 times larger amount of outgassing than SOI wafer. The sandblasting process in the glass increases outgassing substantially. Outgassing can be minimized by pre-baking of the wafer in the vacuum oven before bonding process. An optimum pre-baking temperature of the wafers would be between $400^{\circ}C$ and $500^{\circ}C$.

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Development on Electrical Fire Prevention System of Small Size and High Speed by using PTC Thermistor (PTC 서미스터를 이용한 소형 고속응성의 전기화재 방재시스템 개발)

  • Kwak, Dong-Kurl
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.51-58
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    • 2008
  • This paper is studied on a prevention system for electrical fire and electrical faults by using electrical temperature characteristic of PTC thermistor. The PTC thermistor has characteristic of positive resistivity temperature coefficient according to the temperature variation, which is construction of a regular square and cube demarcation with $BaTiO_3$ ceramics of positive temperature coefficient. Also PTC shows the phenomenon which is rapidly increased in the resistivity if the temperature is increased over Curie temperature point. This paper is proposed on a protective control system used with temperature sensor of PTC thermistor. The proposed prevention system will prevent electrical fires due to electric short circuit faults or overload faults. And the prevention system will solve the problems that circuit breakers to be commonly used at existing are happened frequently electrical fires and electrical disasters due to incapable operation, weak reliability and low speed response. Some experimental results of the proposed apparatus are confirmed to the validity of the analytical results.

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Kinetic Analyses on Thermal Degradation of Epoxy Based Adhesive for Packaging Application (센서 패키지용 고분자 접착제의 열화 거동 분석)

  • Kim, Yeong K.;Lee, Yoon-Sun
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.67-73
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    • 2017
  • An analysis of thermal degradation of epoxy based adhesive performed by thermogravimetry tests are presented in this study. Six different heating rates were employed for the weight change measurements. Based on the data, an Arrhenius type modeling equation was developed by calculating activation energies and proportional constants, and $n^{th}$ polynomial function was adopted to predict the weight change rates. The prediction results by the modeling was compared with the data using the average activation energy. It was found that the activation energy at the each heating rate was not same due to the different degradation kinetics, especially at the high heating rate. To overcome this pitfall, a new approach using exponential function series was introduced and employed. The calculation results showed very good agreements with the test data regardless of the heating rates.

Deformation Behavior of MEMS Gyroscope Package Subjected to Temperature Change (온도변화에 따른 MEMS 자이로스코프 패키지의 미소변형 측정)

  • Joo Jin-Won;Choi Yong-seo;Choa Sung-Hoon;Kim Jong-Seok;Jeong Byung-Gil
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.4 s.33
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    • pp.13-22
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    • 2004
  • In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

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Ultra-Wideband Tapered Slot Antennas for Millimeter-Wave Systems (밀리미터파 시스템 응용을 위한 초광대역 테이퍼 슬롯 안테나 설계)

  • Woo, Dong-Sik;Kim, Young-Gon;Cho, Young-Ki;Kim, Kang-Wook
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.8
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    • pp.913-919
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    • 2008
  • A new design and its experimental results of a microstrip-fed ultra-wideband tapered slot antenna(TSA) for millimeter-wave systems are presented. By utilizing the ultra-wideband microstrip-to-CPS transition(balun), ultra-wideband characteristics of the inherent TSA are retrieved. Also, the design procedure of the TSA is simplified by performing simple impedance matching between balun and antenna. The proposed TSA is shaped by using the Fermi-Dirac tapering function and corrugated at the outer edge. The implemented antenna demonstrates ultra-wideband performance for frequency ranges from 23 to over 58 GHz with the relatively high and flat antenna gain of 12 to 14 dBi and low sidelobe levels. In addition, a 4-element linear antenna array for phased-array systems and mm-wave sensor applications is also presented.