• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.247-248
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• 2007

컴퓨터의 발전은 철도 산업에 큰 영향을 끼치고 있다. 특히 기계식이나 수동식 신호 장치들이 마이크로프로세서를 탑재하면서 전자식, 자동식으로 변경되면서 철도 신호 시스템에 큰 변화를 가져왔다. 이로 인해 안전성은 더 높아지고 수송력 또한 증가하게 되었다. 이런 변화에 핵심적인 역할을 하는 것이 바로 열차집중제어장치이다 열차집중제어장치는 기본적인 역할은 운행되는 열차들의 운전정보를 획득하고 이 정보들을 이용하여 효율적으로 차량을 운행하게 제어하는 것이다. 하지만, 다양한 철도 차량들이 생겨나고 신호 시스템이 발전하게 되면서 열차집중제어장치도 더 다양한 기능과 처리 능력을 가지도록 설계되어져야 한다. 특히, 현재 큰 관심을 받고 있는 무인운전, 무선을 이용한 철도 시스템에서는 열차집중제어장치의 역할이 매우 중요한 부분이 되고 있다. 본 논문에서는 이런 상황을 고려하여 실시간으로 정보를 처리하고, 차량을 안전하게 제어하며, 모든 상황들을 정보화할 수 있는 열차집중제어장치에 대한 설계를 하고자 한다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.6
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• pp.959-964
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• 2001

An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.1-10
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• 2020

This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.12
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• pp.5412-5419
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• 2011

The need is growing for high-speed spindle because various equipment are becoming more precise, miniaturization and high speed with the development of industries. Air-lubricated dynamic bearings are widely used in the optical lithographic manufacturing of wafers to realize nearly zero friction for the motion of the stage. Air-lubricated dynamic bearing can be used in high-speed, high-precision spindle system and hard disk drive(HDD) because of its advantages such as low frictional loss, low heat generation, averaging effect leading better running accuracy. In the paper, numerical analysis is undertaken to calculate the performance of air-lubricated dynamic bearing with herringbone groove. The static performances of herringbone groove bearings which can be used to support the thrust load are calculated. Electrochemical micro machining($EC{\mu}M$) which is non-contact ultra precision machining method has been developed to fabricate the air-lubricated dynamic bearing and optimum parameters which are inter electrode gap size, concentration of electrolyte, machining time are simulated using numerical analysis program.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.125-135
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• 2001

A 8$\times$4 microstrip antenna array is designed at 5.3 GHz and its characteristics are investigated with respect to the application in dual polarized synthetic aperture radars. The design is focused on the achievement of a wide bandwidth, a high polarization purity, a low loss, a good isolation and some mechanical requirements suitable for the application. The antenna is fed by a -3 dB tapered feed network, and is composed of dual polarized SSFIP (Strip-Slot-Foam-Inverted Patch) elements with honeycomb and shielding plane. Simulation results for the antenna array are presented and compared with measurements. It is observed that the antenna shows a bandwidth of 80 MHz, a polarization isolation better than 20 dB, an isolation of 40 dB, and good mechanical characteristics.

• Journal of the Korean Society of Industry Convergence
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• v.21 no.6
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• pp.329-335
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• 2018

In an electric vehicle and Energy Storage System(ESS), a large number of batteries are connected in series or parallel to obtain high voltage and current. The battery management system(BMS) is needed because battery has a characteristic that explode in overcharging and overcurrent situations due to the nature of the battery material and the battery life is dramatically reduced when the battery is overdischarged below the specified voltage. In this paper, we proposed a system that can manage a large amount of batteries through the communication of master-slave type with multiple microcontroller. We confirmed the stable operation of the proposed system through the balancing-charging and storage mode experiments.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.17-33
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• 2022

Ti₃C₂T_X MXene, first reported by Naguib et al. in 2011, has attracted tremendous attention due to its excellent hydrophilicity, electrical conductivity, and mechanical/chemical stability. Since MXene is a two-dimensional material with a thickness of few nanometers, which ensure its flexibility. In last few years, due to these properties many researchers used Ti₃C₂T_X MXene into various fields such as flexible smart sensors, energy harvesting/storage devices, supercapacitors and electromagnetic interference shielding systems. In this review article, we have briefly discussed the various synthesis processes and characteristics of Ti₃C₂T_X MXene. Moreover, we reviewed the latest development of Ti₃C₂T_X MXene as flexible electrode material to be used into different applications.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.111-118
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• 2023

MXene, a two-dimensional transition metal carbide or nitride, has recently attracted much attention as a lightweight and flexible electromagnetic shielding material due to its high electrical conductivity, good mechanical strength and thermal stability. In particular, the Ti-based MXene, Ti₃C₂T_x and Ti₂CT_x are reported to have the best electrical conductivity and electromagnetic shielding properties in the vast MXene family. Therefore, in this study, Ti₃C₂T_x and Ti₂CT_x films were prepared by vacuum filtration using Ti₃C₂T_x and Ti₂CT_x dispersions synthesized by interlayer metal etching and centrifugation of Ti₃AlC₂ and Ti₂AlC. The electrical conductivity and electromagnetic shielding efficiency of the films were measured after heat treatment at high temperature. Then, X-ray diffraction and photoelectron spectroscopy were performed to analyze the structural changes of Ti₃C₂T_x and Ti₂CT_x films after heat treatment and their effects on electromagnetic shielding. Based on the results of this study, we propose an optimal structure for an ultra-thin, lightweight, and high performance MXene-based electromagnetic shielding film for future applications in small and wearable electronics.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.33-42
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• 2023

Throughout all industries, eco-friendliness is being promoted worldwide with focus on suppressing the environmental impact. With recent international environment policies and regulations supported by government, the electric vehicles demand is expected to increase rapidly. Battery system itself perform an essential role in EVs technology that is arranged in cells, modules, and packs, and each of them are connected mechanically and electrically. A multifaceted approach is necessary for battery pack bonding technologies. In this paper, pros and cons of applicable bonding technologies, such as resistance welding, laser and ultrasonic bonding used in constructing electric vehicle battery packs were compared. Each bonding technique has different advantages and limitations. Therefore, several criteria must be considered when determining which bonding technology is suitable for a battery cell. In particular, the shape and production scale of battery cells are seen as important factors in selecting a bonding method. While dealing with the types and components of battery cells, package bonding technologies and general issues, we will review suitable bonding technologies and suggest future directions.