• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.23-30
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• 2004

Interfacial reaction of Pb-free $Sn0.7wt{\%}Cu$ and $Sn3.8wt{\%}Ag0.7wt{\%}Cu$ solders and Pt during aging has been investigated. After the $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens were reflowed at $250^{\circ}C$ for 30s and the $Sn0.7wt{\%}Cu/Pt$ specimens were reflowed at $260^{\circ}C$, the specimens were aged at $125^{\circ}C,\;150^{\circ}C$ and $170^{\circ}C$ for 25-121 hours. The intermetallic thitkness and morphology change during aging were characterized using SEM, EDS and XRD. $PtSn_4$ and $PtSn_2$ were observed in the solder/pt interface and the intermetallic formation was governed by diffusion. The activation energy of intermetallic formation was 145.3 kJ/mol for$Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens for $Sn0.7wt{\%}Cu/Pt$ specimens from the measurement of the intermetallic thickness with aging temperature and time.

• Composites Research
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• v.33 no.1
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• pp.19-24
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• 2020

In this paper, the microwave irradiation process was conducted during the Poly(vinylidene fluoride) (PVDF) nano-composite film fabrication process to analyze how the β-crystalline is increased. TiO₂ was added as a nanoparticle reinforcement to further improve the β-crystalline conformation of the PVDF films by van der Waals force due to the difference of electronegativity between PVDF and the metal oxide nanoparticle. The crystalline conformation of the fabricated films was analyzed by X-ray diffraction and Fourier transform infrared spectroscopy. According to these analysis results, it was confirmed that the microwave irradiation process during the solvent evaporation process increases the crystallinity of the PVDF films, and more β-crystalline can be obtained after additional film stretching process. It was also found that the PVDF nano-composite films with the metal oxide have relatively higher β-crystalline conformation rather than the neat PVDF films.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.67-72
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• 2015

A study on thermal properties for a single-layer metal and a 2-ply metal (clad metals) was investigated for the application of heat sink. For the single-layer metal, a stainless steel (STS) and an aluminum (Al) were selected. Also, a roll bonded clad metal with STS and Al was chosen for the 2-ply metal. The thermal conductivity of the sample was obtained from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared with the calculated values using the data from the references. For the single-layer metal, measured values for the thermal diffusivity and thermal conductivity were smaller than calculated values. Differences between measured and calculated values were about 6% and 18% for the STS and Al samples, respectively. For the clad metals, however, a large difference (55%) was observed. Here, a relatively small thermal conductivity measured by LFA was due to the existence of a interface between STS and Al in the clad metal. Such a interface reduces the moving velocity of free electrons and phonons in the clad metal. For the development of a high performance heat-issipation module with the multi-layer structure, the control of interface properties which determine thermal properties was confirmed to be important.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.40.1-40.1
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• 2009

생체용 금속 임플란트의 표면개질은 생체활성화를위하여 오래 전 부터 관심을 가지고 연구해오고 있다. 최근에 표면개질을위하여 화학적 에칭, 샌드 블래스팅, 또는 나노튜브형성등 표면에 임의의 요철을 만들어서 사용하는방법이 가장 일반적으로 적용되어 상용화되고있다. 그러나 샌드블래스팅이나 화학적 에칭은 가공은 쉽지만 가공표면에 인체에 해로운 잔류물의존재로 생체적합성에 해로운 영향을 미칠 수 있다. 이러한 문제점들을 해결하기위하여 레이저를 사용하여 임플란트 표면을 개질한 예가 보고 되었다. 레이저를 사용한 표면처리 방법의큰 장점은 잔류물이 남지 않고 비교적 표면 거칠기의 제어가 용이하다. 금속합금의 표면개질에사용되는 레이저는 주로 Nd:YAG 레이저의 파장을 반으로 줄인 녹색레이저 ($\lambda$=532nm)를 사용하거나, 자외선파장영역의레이저를 사용하는 경우가 일반적으로 가장 보 편화된 가공방법으로 연구되었다. 표면의 거칠기는 수마이크로의크기와 수십나노의 크기를 갖는 표면을 생체적합적인 측면에서 요구하고 있다. 따라서 이러한 표면의 거칠기를조절할 수 있는 펨토레이저를 사용하여 표면에 균질한 표면의 텍스춰링을 통하여 그 특성을 개선할 수 있는지를 확인하는 것이 본 과제이다. 본 실험에서는 Ti합금을 진공 아크로를 이용하여 3원계합금을 제조하고 $1000^{\circ}C$에서 24시간 열처리 후 급냉(water quenching)하였다. 열처리 후 시편은 두께 2mm로 절단 하여 #2000까지 연마 후 하여 펨토 초(10-15 second) 펄스폭 대역을 갖는 레이저를 이용하여 수마이크로 크기의 미세 요철을 표면에 형성한 후, 표면의 특성을 조사해 보았다.(NRF-2009-0074672)

• Journal of Dental Rehabilitation and Applied Science
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• v.25 no.2
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• pp.95-107
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• 2009

The purpose of this research was to examine the fitness of zirconia cores that were made by different sintering methods; generic electricity furnace and microwave furnace. Firstly, 12 cores for each group were made by using each different sintering process and attached them to a metal die with silicon. The internal and marginal gap of sintered zirconia was measured by using Skyscan 1076 micro-CT, then it was reorganized by CT-An software. To each samples, we extracted B-L image, M-D image of cutting side, and cross-sectional side of tooth long axis and calculated the mean value of marginal, axial, and occlusal gap each side. Results: 1. The mean marginal gap of sintered zirconia was $36.20{\mu}m$ for EVE, $47.67{\mu}m$ for LAV, $52.47{\mu}m$ for DEN, and $54.63{\mu}m$ for CER. 2. For the axial wall, the research showed the largest value of $63.49{\mu}m$ for EVE, but there were no statistical significance. 3. In related to the occlusal internal measurement, DEN showed the smallest value ($77.06{\mu}m$), EVE and CER showed significantly high value. From this study, it is suggested that CAD/CAM zirconia core which was made in the process of microwave sintering has clinically acceptable values in marginal and internal gap.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.65-70
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• 2008

The mechanical shear strength of BGA(Ball Grid Array) solder joints under high impact loading was investigated. The Sn-37Pb solder balls with a diameter of $500{\mu}m$ were placed on the pads of FR-4 substrates with ENIG(Electroless Nickel Immersion Gold) surface treatment and reflowed. For the High Temperature Storage(HTS) test, the samples were aged a constant testing temperature of $120^{\circ}C$ for up to 250h. After the HTS test, high speed shear tests with various shear speed of 0.01, 0.1, 1, 3 m/s were conducted. $Ni_3Sn_4$ intermetallic compound(IMC) layer was observed at the solder/Ni-P interface and thickness of IMC was increased with aging process. The shear strength increased with increasing shear speed. The fracture surfaces of solder joints showed various fracture modes dependent on shear speed and aging time. Fracture mode was changed from ductile fracture to brittle fracture with increasing shear speed.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.63-69
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• 2022

Vanadium dioxide shows a unique and interesting property of metal-insulator transition, which has attracted great attention from the viewpoints of fundamental materials science and industrial applications. In this study, the effect of Mg and W addition on the metal-insulator transition of VO₂ were investigated for the bulk materials that are prepared by spark plasma sintering. The X-ray diffraction analysis of the sintered specimens revealed that the lattice parameters barely change, and the secondary phases are present. The transition temperature of MIT appears in the range of 64.2-64.6℃, regardless of the impurity element and content. On the other hand, the addition of Mg and W alters the electrical conductivity, i.e., the electrical conductivity increases by a factor of up to 2.4 or decrease by a factor of up to 57.4 depending on the impurity type and its content. The thermal conductivity showed the values of 1.8~2.5 W/m·K below the transition temperature, and the values of 1.9~2.8 W/m·K above the transition temperature. These changes in electrical and thermal conductivities can be attributed to the combination of the change in charge carrier density, the impurities as scattering centers, and the change in microstructures.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.50-50
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• 2009

본 연구에서는 차체 부품의 경량소재 대체에 따른 Panel Assembly Rear Seat Back 부품 제작에 최신 저입열 미그용접공정을 적용한 TWB(Tailor Welded Blank) 공정기술을 확보하기 위해 최적 용접조건 도출에 관한 연구를 진행하였다. 용접 후 성형이 이뤄지는 제조공정의 특성 상 성형강도에 중점을 둔 실험을 진행하였으며, 이를 위해 각 와이어에 따른 용접부의 기계/금속학적 특성이 평가되었다. 대상 시편은 6천계열 열처리형 합금이며, 두께는 각각 1.6t, 1.4t로 이를 맞대기 용접 후 그 특성을 평가하였다. 용접은 저입열 GMA용접 공법 중 하나인 CMT 용접법(Cold Metal Transfer)을 사용하였으며, 평가 대상 와이어로는 4043, 4047, 5183 및 5356이 사용되었다. 특성평가는 마크로 및 마이크로 조직, 경도, 인장강도, 기공 및 결함, 성형강도 등에 대해 이뤄졌으며, 희석된 와이어의 조성이 용접부 특성에 미치는 영향에 대해서도 검토되었다. 실험 결과, 5천계열 와이어가 성형강도에 비교적 더 강인한 결과를 나타냈으며 성형강도는 용접조건 및 초기 갭에 대한 영향은 받았으나, 비드형상과 강도간의 연관성은 찾을 수 없었다. 이에 따라 TWB 적용을 위한 와이어로는 5356이 가장 우수한 것으로 판명되었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.139-139
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• 2018

최근 자동차 산업을 중심으로 한 수송용 기기의 경량화 추세에 따라 대표적인 경량금속 소재인 알루미늄 합금에 대한 수요가 증가하고 있으며 이에 따라 알루미늄 합금 표면에 다양한 특성을 부여할 수 있는 표면개질 기술에 대한 필요성이 부각되고 있다. 알루미늄 합금의 대표적인 표면처리기술인 아노다이징과 유사한 원리로 표면에 세라믹 코팅층을 형성할 수 있는 기술인 플라즈마 전해 산화(Plasma electrolytic oxidation, PEO)가 주목을 받고 있다. PEO 코팅법은 전해액 내에 소재를 침지시키고 400 ~ 600V에 이르는 고전압을 인가시켜 마이크로 방전을 유도하여 표면에 치밀한 세라믹 층을 형성시키는 기술이다. 본 연구에서는 PEO법으로 표면 개질된 Al 합금 표면의 표면 조직 특성과 전기화학 특성을 평가하고, 코팅층 특성에 미치는 공정 변수의 영향을 분석하고자 하였다. PEO 처리를 위해 사용된 소재는 상용 Al 합금 판재(Al 5083-O)로서 $2cm{\times}2cm$로 절단하여, 에머리페이퍼로 1000번까지 연마하여 사용하였다. 시험을 위한 PEO 처리 시스템은 전해액 수조, 일정 온도 유지를 위한 열교환기와 칠러, 전원 발생을 위한 전원공급기(power supply)로 구성되었다. 전해액은 약 알칼리 수용액을 이용하였으며, 전원 공급기를 통해 시험편에 펄스 전류를 인가하였다. PEO 처리 후 시편에 대하여 SEM, EDS, XRD 등을 이용한 표면 특성 평가를 실시하였다. 또한 코팅층의 전기화학적 부식 특성 평가를 위해 해수용액에서 동전위분극실험을 실시하였다. 시험 결과, Al 합금의 PEO 처리 시 내식성은 개선되는 것으로 확인되었으며, 공정변수는 표면의 미세조직 및 전기화학적 특성에 큰 영향을 미치는 것으로 나타났다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.1-9
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• 2007

OSP(organic solderability preservatives) finish has been considered as a very effective process for substituting the metal surface treatment of Ni/Au finish because of lower cost, interface property and environmental issue of OSP finish. However, the discoloration of OSP layer is formed during assembly process consisting of various steps of temperature. The causes of discoloration and the characterization of solder joint were investigated with a degree of discoloration and the assembly process of OSP finished products, which was also compared statistically with that of conventional Ni/Au finished products. As the results, the solution of process trouble for OSP finished products is able to be offered.