• 열병합발전
• /
• s.53
• /
• pp.3-10
• /
• 2006

• 열병합발전
• /
• s.54
• /
• pp.4-8
• /
• 2006

• Journal of Power System Engineering
• /
• v.14 no.2
• /
• pp.65-70
• /
• 2010

Retaining rings are used to support the field winding end turns from the centrifugal force by the high speed of the field and these are the overstressed parts among the generator parts. There have been several retaining failures in Europe and America, all attributable to stress corrosion cracking in 18Mn-5Cr steel. Since then, each manufacture companies have developed a good 18Mn-5Cr steel in temperature, strength characteristic and it is used in many field now. From many findings and test results, we could conformed that the failure might be grown in the overstressed condition unrelated to the moisture particle.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.18 no.8
• /
• pp.44-50
• /
• 2019

CMP is the most critical process in the manufacture of silicon wafers, and the use of retaining rings, which are consumable parts used in CMP equipment, is increasingly important. Since the retaining ring is made of plastic, it is not only weak in strength but also has the problem of taking a long time for the flattening operation of the ring itself performed before the CMP process, and of the imbalance of force due to bolt tightening causing uneven wear. In order to solve this problem, the retaining ring and the insert ring are integrally used, and the flatness of the retaining ring may be affected depending on the material of the insert ring. Also, the residual stress generated in the manufacturing process of the insert ring may cause distortion of the ring, which may adversely affect the precision polishing. In this study, when the insert ring is made of Zn or STS304, the thickness variation and the flatness of the retaining ring are compared and, finally, the material removal rate is analyzed by polishing the wafer by the oxide CMP process. Through these experiments, the effects of the insert ring material on the polishing accuracy of the wafers were investigated.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.19 no.3
• /
• pp.22-28
• /
• 2020

This paper investigates the effects of retaining ring materials, particularly PPS and PEEK, used in the CMP process, on wafer polishing and ring wear. CMP can be performed using bonded type retaining rings made with PPS or injection molding type retaining rings made with PEEK. In this study, after polishing a wafer with a PPS retaining ring, the average profile height of the wafer was 0.098 ㎛ less than that of the wafer polished with a PEEK retaining ring, implying that PPS retaining rings achieve a higher polishing rate. In addition, the center area of the wafer profile had less deviation and improved flatness after polishing with the PPS ring. These results indicate that a higher polishing rate and smaller profile height deviation can be achieved using retaining rings made with PPS compared to retaining rings made with PEEK. Therefore, with semiconductor circuit patterns becoming finer and wafer sizes becoming larger, the use of PPS in CMP retaining rings can obtain more stable wafer polishing results compared to that of PEEK.

• Proceedings of the KSME Conference
• /
• 2000.04a
• /
• pp.849-853
• /
• 2000

The retaining rings used to restrain the end turns of the rotor winding against centrifugal force require very careful attention during design and manufacture because they have traditionally been the highest-stressed components of the generator. In other words, the rings maintain their shrink fits during their entire service life. In this study, using finite element method, the part of shrink fits in generator was analyzed to obtain residual stresses in retaining ring and contact Pressures between contact surfaces at zero, rated, and 120 rated speeds, respectively.