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http://dx.doi.org/10.14775/ksmpe.2020.19.03.022

Effects of CMP Retaining Ring Material on the Performance of Wafer Polishing  

Park, Ki-Won (Department of Mechanical Engineering, Graduate School, Incheon National University)
Kim, Eun-young (Department of Mechanical Engineering, Graduate School, Incheon National University)
Park, Dong-Sam (Department of Mechanical Engineering, Incheon National University)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.19, no.3, 2020 , pp. 22-28 More about this Journal
Abstract
This paper investigates the effects of retaining ring materials, particularly PPS and PEEK, used in the CMP process, on wafer polishing and ring wear. CMP can be performed using bonded type retaining rings made with PPS or injection molding type retaining rings made with PEEK. In this study, after polishing a wafer with a PPS retaining ring, the average profile height of the wafer was 0.098 ㎛ less than that of the wafer polished with a PEEK retaining ring, implying that PPS retaining rings achieve a higher polishing rate. In addition, the center area of the wafer profile had less deviation and improved flatness after polishing with the PPS ring. These results indicate that a higher polishing rate and smaller profile height deviation can be achieved using retaining rings made with PPS compared to retaining rings made with PEEK. Therefore, with semiconductor circuit patterns becoming finer and wafer sizes becoming larger, the use of PPS in CMP retaining rings can obtain more stable wafer polishing results compared to that of PEEK.
Keywords
CMP; Retaining Ring; Wafer Profile; PPS; PEEK; Wear;
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Times Cited By KSCI : 2  (Citation Analysis)
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